• Journal of Welding and Joining
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• 제19권4호
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• 한국재료학회지
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• 제19권6호
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• pp.337-343
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• 2009

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

• Journal of Welding and Joining
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• 제21권3호
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• 열처리공학회지
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• 제32권1호
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• pp.12-16
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• 2019

In this study, strain-controlled low cycle fatigue test for hot rolled STS304 steel was carried out at $400^{\circ}C$ and $600^{\circ}C$, respectively. High temperature fatigue test was done using an electric furnace attached on the hydraulic fatigue test machine. The results of this study show that STS304 hot rolled steel has excellent static strength and fatigue characteristics. The hysteresis loop at half life was obtained in order to calculate the elastic and plastic strain. Also, Relationship between strain amplitude and fatigue life was examined in order to predict the low cycle fatigue life of STS304 steel by Coffin-Manson equation.

• Journal of Mechanical Science and Technology
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• 제16권7호
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• pp.919-926
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• 2002

In this study, the numerical prediction of the thermal fatigue lie? of a $\mu$BGA (Micro Ball Grid Array) solder joint was focused. Numerical method was performed using the three-dimensional finite element analysis for various solder alloys such as Sn-37%Pb, Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-3.5%Ag-3%In-0.5%Bi during a given thermal cycling. Strain values obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5%Ag with the 50-degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. A practical correlation for the prediction of the thermal fatigue life was also suggested by using the dimensionless variable γ. Additionally Sn-3.5Ag-0.75Cu and Sn-2.0Ag-0.5Cu-2.0Bi were applied to 6$\times$8$\mu$BGA obtained from the 63Sn-37Pb Solder. This 6$\times$8$\mu$BGA were tested at different aging conditions at 130$\^{C}$, 150$\^{C}$, 170$\^{C}$ for 300, 600 and 900 hours. Thickness of the intermetallic compound layer was measured thor each condition and the activation energy thor their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS ( Energy Dispersive Spectroscopy).

• 대한기계학회논문집A
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• 제34권7호
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• pp.911-917
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• 2010

본 연구에서는 열적-기계적 주기하중을 받고 있는 엔진 배기매니폴드에 대해서 열응력 해석방법과 열피로수명 예측과정을 제시하였다. 즉, 파손현상이 복잡한 배기시스템의 효율적인 유한요소 모델링 방법과 온도 의존성 재료의 시험결과를 이용한 해석 데이터 구성, 그리고 열사이클 하중에 대한 열응력 및 파손 예측방법을 디젤엔진의 배기매니폴드에 대해서 나타내었다. 일반적으로 배기매니폴드의 파손 취약부에서는 고온영역에서 큰 압축소성변형이 발생하고 냉각시에는 인장의 잔류응력이 나타난다. 따라서 이같은 응력과 변형률의 이력곡선으로부터 소성변형의 진폭 또는 소성에너지의 크기를 얻을 수 있으며 이를 통해서 피로수명을 예측할 수 있다.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2005년도 추계학술대회 논문집
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• pp.283-288
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• 2005

기존의 기계적인 센서들보다 높은 민감도와 선형성을 가지는 반도체 센서들은 크기가 작고 일괄공정에 의해 제작될 수 있는 반도체 공정 기술로 제작되므로 다양한 산업에서 적용되고 있다. 하지만 열과 반복적인 외부 하중은 센서의 수명에 치명적인 영향을 미치고 있고, 특히 외부에서 가해지는 열은 센서를 구성하는 구조물보다 신호를 전달하는 배선의 피로 수명에 지대한 영향을 미치고 있으므로 이에 대한 영향성을 분석할 수 있는 프로세스를 확립하고, 이후 다양한 재료의 반복적인 열하중에 대한 피로 수명을 평가하여 사용 온도에 대한 적절한 재료를 선정할 수 있는 자료를 제시하고자 하였다.