• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.12
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• pp.915-923
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• 2008

The performance experiments for a microchannel printed circuit heat exchanger (PCHE) of high-performance and high-efficiency on the two technologies of micro photo-etching and diffusion bonding were performed in this study. The microchannel PCHE were experimentally investigated for Reynolds number in ranges of 100 $\sim$ 700 under various flow conditions in the hot side and the cold side. The inlet temperatures of the hot side were conducted in range of $40^{\circ}C\;{\sim}\;50^{\circ}C$ while that of the cold-side were fixed at $20^{\circ}C$. In the flow pattern, the counter flow was provided 6.8% and 10 $\sim$ 15% higher average heat transfer rate and heat transfer performance than the parallel flow, respectively. The average heat transfer rate, heat transfer performance and pressure drop increases with increasing Reynolds number in all the experiment. The increasing of inlet temperature in the experiment range has not an effect on the heat transfer performance while the pressure drop decrease slightly with that of inlet temperature. The experimental correlations to the heat transfer coefficient and pressure drop factor as a function of the Reynolds number have been suggested for the microchannel PCHE.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.205.2-205.2
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• 2014

The effects of ion beam mixing of a SiC film coated on super alloys (hastelloy X substrates) were studied, aiming at developing highly sustainable materials at above $900^{\circ}C$ in decomposed sulfuric acid gas (SO2/SO3/H2O) channels of a process heat exchanger. The bonding between two dissimilar materials is often problematic, particularly in coating metals with a ceramics protective layer. A strong bonding between SiC and hastelloy X was achieved by mixing the atoms at the interface by an ion-beam: The film was not peeled-off at ${\geq}900^{\circ}C$, confirming excellent adhesion, although the thermal expansion coefficient of hastelloy X is about three times higher than that of SiC. Instead, the SiC film was cracked along the grain boundary of the substrate at above $700^{\circ}C$. At ${\geq}900^{\circ}C$, the film was crystallized forming islands on the substrate so that a considerable part of the substrate surface could be exposed to the corrosive environment. To cover the exposed areas and cracks multiple coating/IBM processes have been developed. An immersion corrosion test in 80% sulfuric acid at $300^{\circ}C$ for 100 h showed that the weight retain rate was gradually increased when increasing the processing time.

• The Journal of the Korea Contents Association
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• v.18 no.11
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• pp.369-378
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• 2018

The purpose of this study was to investigate the relationship between elderly people's consciousness of discrimination, elderly contact experience, grandparents' bonding, recognition of filial piety in College 190 Students and descriptive research study to identify factors affecting the sense of discrimination of the elderly. The questionnaire was collected from May 28 to June 15, 2018. The results of this study are as follows: First, the elderly's perception of the elderly was related to the elderly's contact experience (r = -. 353, p <.01), grandparent relationship with grandparents (r =. 01) were statistically significan. The influence factors of the elderly discrimination consciousness of college students are recognition of filial piety (${\beta}=-.354$, p<.001) and knowledge of the elderly (${\beta}=.281$, p <.001), the elderly contact experience and grandparents' bonding. The total explanatory power of the variables was 29.1%.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of the Korean Academy of Child and Adolescent Psychiatry
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• v.7 no.2
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• pp.167-178
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• 1996

Objects : This study was conducted to investigate the relationships between parenting style and depressive trait in adolescents. Methods : 287 Middle school students were asked to complete self-report questionnaires including the Parental Bonding Instrument(PBI) and the Children's Depression Inventory (CDI). Results : Relations between two sets of variables were examined by means of the Pearson's correlation coefficient. It was suggested that the relationship with their mothers had more influence on the depressive trait of adolescents. The mean scores of children's depression inventory were significantly higher in group whose parents had been overprotective and less careful, than whose parents had been careful and not overprotective. Conclusion : The results support that the adolescents' depression is significantly related to the parenting style. Among parental bonding types, the high care-low overprotection type was most favorable and the low care-high overprotection type was worst.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.5
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• pp.483-487
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• 2014

In this study, joining methods with SiC powder as the joining adhesives were studied in order to avoid the residual stresses coming from CTE (Coefficient of Thermal Expansion) mismatch between substrate and joining layer. The shear strength and microstructure of joined material between SiC substrates are investigated. The commercial Hexoloy-SA (Saint-Gobain Ceramics, USA) used in this work as substrate material. The fine ${\beta}$-SiC nano-powder which the average particle size is below 30 nm, $Al_2O_3$, $Y_2O_3$, and $SiO_2$ were used as joining adhesives. The specimens were joined with 20MPa and $1400-1900^{\circ}C$ by hot pressing in argon atmosphere. The shear test was performed to investigate the bonding strength. The cross-section of the joint was characterized by using an optical microscope and scanning electron microscopy (SEM).

• Composites Research
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• v.26 no.2
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• pp.129-134
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• 2013

The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

• Journal of Technologic Dentistry
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• v.33 no.4
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• pp.349-357
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• 2011

Purpose: In this study, for the reasons of observing the changes when using bonding agent with Ni-Cr alloy and Co-Cr alloy and using VM13 and Vintage MP ceramic which have the disparity in coefficient of thermal expansion, it is carried out to evaluate the characteristics of the bonding agent through the analysis of the interface between metal and ceramic and the analysis of bond strength by variable. Methods: The surface treatment was performed on the two kinds of alloy(Ni-Cr alloy and Co-Cr alloy) specimens, which were sandblasted and were treated with bonder application. The metal-ceramic interfaces were analyzed with EPMA in order to ionic diffusion, and the shear test was performed. Results: As a result of observation of metal-ceramic interfacial properties, it was observed that Cr atoms were spread from the alloy body to the ceramic floor in the specimen of Group B. It was also seen that Cr, W atoms were spread from the alloy body to the ceramic floor in the specimen of Group S. In consequence of observing Shear bond strength, it was calculated that the specimen of BSV was 27.75(${\pm}11.21$)MPa, BSM was 27.02(${\pm}5.23$)MPa, BCV was 30.20(${\pm}5.99$)MPa, BCM was 27.94(${\pm}10.76$)MPa, SSV was 20.83(${\pm}2.58$)MPa, SSM was 23.98(${\pm}3.94$)MPa, SCV was 32.32(${\pm}4.68$)MPa, and SCM was 34.54(${\pm}10.63$)MPa. Conclusion: In the metal-ceramic interface of Bellabond plus sample group, diffusion of Cr atoms was incurred and diffusion of C Cr atoms and W atoms in the sample group of $Starloy{(R)}\;C$ was observed. Using bonding agent showed the higher bond strength than using the sand blasting treatment. In the Bellabond plus alloys, the specimen group with the use of binding materials showed higher shear bond strength, but didn't show statistically significant differences (p>0.05). In the $Starloy{(R)}\;C$ alloys, the specimen group with the use of binding materials showed higher shear bond strength and statistically significant differences(p<0.05). In terms of VM13 ceramic, it was in the Bellabond plus alloys that the high shear bond strength was showed, but there's no statistically significant differences(p>0.05). In terms of Vintage MP ceramic, it was in the $Starloy{(R)}\;C$ alloys that the high shear bond strength was showed and statistically significant differences(p<0.05). Metal-ceramic to fracture of the shear strength measurements and an analysis of all aspects of military usage fracture of the composite, respectively.

• Restorative Dentistry and Endodontics
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• v.27 no.1
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• pp.44-53
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• 2002

목적 : 최근 개발된 bonding agent 중 일부는 다양한 함량의 filler를 포함하고 있으며 filler의 첨가는 bonding agent의 기계적인 물성을 향상시킴으로써 접착력의 향상에 기여한다는 주장이 있다. 본 연구에서는 다양한 함량의 filler를 포함한 adhesive를 실험적으로 만들어, filler의 함량이 전단접착강도에 미치는 영향을 살펴보고 임상적으로 가장 적절한 filler의 함량을 알아보고자 하였다. 또 adhesive의 간접인장강도를 측정하여 adhesive의 기계적인 물성과 접착력과의 상관관계를 알아보았다. 방법 : 발거된 건전한 70개의 대구치를 투명 레진에 매몰하고 상아질면을 노출시켰다. 3M사의 Scotchbond Multipurpose의 etchant와 primer를 제조사의 지시대로 적용하고 1$\mu\textrm{m}$크기의 barium glass filler를 0, 5, 10, 15, 20, 30, 45wt% 포함하도록 실험적으로 제작한 adhesive를 도포한 후 레진을 충전하여 시편을 완성하였다. Instron으로 0.5mm/min의 속도에서 전단접착강도를 측정하고 그 단면을 입체현미경으로 관찰하여 파절의 양상을 확인하였다. Filler함량에 따른 adhesive의 후경을 측정하기 위해 상기한 방법으로 시편을 제작하여 주사 전자현미경으로 관찰한 후 Sigmascan을 이용하여 그 후경을 측정하였다. 또, 지름 4mm 높이 6mm의 원통형 시편을 제작하여 Instron로 간접인장강도의 측정을 시행하였다. 얻어진 결과는 Kruskal-Wallis test와 Mann-Whitney test를 시행하여 분석하였으며, 상관관계를 분석을 위해 Pearson Product Moment Correlation Coefficient를 구하였다. 결과 : 1) Filler함유량에 따라 전단접착강도는 유의할 만한 차이를 보였다(p<0.05). 2) Filler함량의 증가에 따라 전단접착강도는 유의하게 증가하여 15% 수준에서 가장 높은 갈(19.9$\pm$1.38Mpa)을 보였으며 20% 이상의 수준에서는 유의하게 감소하였다(p<0.05). 3) Adhesive의 간접인장강도는 20% 수준까지는 증가하는 양상을 보였으나 통계적 유의성은 없었으며(p>0.05), 30% 이상에서는 유의할 만한 감소를 보였다(p<0.05). 4) Adhesive의 후경은 0% 수준에서 5.97$\pm$1.23$\mu\textrm{m}$부터 45%수준에서 73.37$\pm$11.7$\mu\textrm{m}$까지 유의하게 증가하였다(p<0.05). 5) Filler함량에 따른 Adhesive의 간접인장강도와 전단접착강도는 상관관계가 없었다.