• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1431-1433
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• 1995

This paper describes the characteristics of Si Hall sensors fabricated on a SOI(Si-on-insulator} structure, in which the SOI structure was forrmed by SDB(Si-wafer direct bonding) technology. The Hall voltage and the sensitivity of implemented Si Hall devices show good linearity with respect to the applied magnetic flux density and supplied current. The product sensitivity of the SDB SOI Hall device is average $600V/A{\cdot}T$. In the temperature range of 25 to $300^{\circ}C$, the shifts of TCO(Temperature Coefficient of the Offset Voltage) and TCS(Temperature Coefficient of the product Sensitivity) are less than ${\pm}6.7{\times}10^{-3}/^{\circ}C$ and ${\pm}8.2{\times}10^{-4}/^{\circ}C$, respectively. From these results, Si Hall sensors using the SOI structure presented here are very suitable for high-temperature operation.

• Journal of the Korean Ceramic Society
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• v.32 no.10
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• pp.1203-1211
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• 1995

The tests of three point bending and vickers hardness have been carried out to investigate mechanical characteristics of bioceramics for artificial dental crowns. And color and color difference test has been performed to study chromaticity changes after sintering specimens composited with glass and leucite powders. In addition, thermal dilation test has been carried out to examine bonding relations between dental porcelain and metal frame (Ni-Cr alloy). The result of three point bending test showed a maximum strength of about 68 MPa. Thermal expansion coefficient changed from 8.3$\times$10-6/$^{\circ}C$ to 13.5$\times$10-6/$^{\circ}C$ with increasing leucite content (0~30wt.%) in glass matrix. Bonding between porcelain (25% leucite-75% glass) and Ni-Cr alloy was excellent.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.38-43
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• 2012

In this study, active metal brazing methods for $ZrO_2$ and Ti alloy were discussed. To get a successful metal-ceramic bonding, various factors (melting temperature, corrosion, sag resistance, thermal expansion coefficient etc. of base materilas and filler metal) should be considered. Moreover, in order to clarify bonding between the metal and ceramic, the mechanism of the interfacial structure of the joints should be identified. The driving force for the formation of metal and ceramic interfaces is the reduction of the free energy which occurs when their contact becomes complete. Interfacial bonding depends on the material combinations and the bonding processes. This study describes the bonding between ceramic and metal in an active metal brazing.

• Journal of the Korean Magnetic Resonance Society
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• v.8 no.2
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• pp.127-138
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• 2004

We obtained the chemical shifts of amide protons (NHs) in helical peptides at various temperatures and trifluoroethanol (TFE) concentrations using 2-dimensional NMR spectroscopy. These NH chemical shifts and their temperature dependence exhibited characteristic periodicity of 3-4 residues per cycle along the helix, where downfield shifted NHs showed larger temperature dependence. In an attempt to understand these observations, we focused on hydrogen bonding changes in the peptides and examined the validity of two possible explanations: (1) changes in intermolecular hydrogen bonding caused by differential solvation of backbone carbonyl groups by TFE, and (2) changes in intramolecular hydrogen bonding due to disproportionate variations in the hydrogen bonding within the peptide helix. Interestingly, the slowly exchanging NHs, which were on the hydrophobic side of the helix, showed consistently larger temperature dependences. This could not be explained by the differential solvation assumption, because the slowly exchanging NHs would become more labile if the preceding carbonyl groups were preferentially solvated by TFE. We suggest that the disproportionate changes in intramolecular hydrogen bonding better explain both the temperature dependence and the exchange behavior observed in this study.

• Nuclear Engineering and Technology
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• v.40 no.3
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• pp.233-238
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• 2008

This study investigates the surface modification of a Hastelloy X plate and diffusion bonding in the assembly of surface modified plates. These types of plates are involved in the key processes in the fabrication of a process heat exchanger (PHE) for a $SO_3$ decomposer. Strong adhesion of a SiC film deposited onto Hastelloy X can be achieved by a thin SiC film deposition and a subsequent N ion beam bombardment followed by an additional deposition of a thicker film that prevents the Hastelloy X surface from becoming exposed to a corrosive environment through the pores. This process not only produces higher corrosion resistance as proved by electrolytic etching but also exhibits higher endurance against thermal stress above 9$900^{\circ}C$. A process for a good bonding between Hastelloy X sheets, which is essential for a good heat exchanger, was developed by diffusion bonding. The diffusion bonding was done by mechanically clamping the sheets under a heat treatment at $900^{\circ}C$. When the clamping jig consisted of materials with a thermal expansion coefficient that was equal to or less than that of the Hastelloy X, sound bonding was achieved.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.3
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• pp.223-233
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• 2011

A ceramic monolithic catalyst is a honeycomb structure that consists of two layers. The honeycomb structure is regarded as a continuum in structure and heat-flow analysis. The equivalent mechanical properties of the honeycomb structure were determined by performing finite element analysis (FEA) for a test specimen. Bending strength experiments and FEA of the test specimen used in ASTM C1674-08 standard test were performed individually. The bonding coefficient between the cordierite ceramic layer and the washcoat layer was almost zero. The FEA test specimen was modeled on the basis of the bonding coefficient. The elastic modulus, Poisson's ratio, and the thermal properties of the ceramic monolithic substrate were determined by performing the FEA of the test specimen.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.567-572
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• 2013

In houses that use heating and cooling system, most of heat loss occurs through the windows, so that low-E glass, double-layered glass, and vacuum glazing are used to minimize the heat loss. In this paper, an encapsulating process that is a final process in manufacturing the vacuum glazing has been studied, and bonding in a vacuum chamber rather than atmospheric bonding was considered. For the efficiency of the encapsulating process, frit-melting temperature and bonding time were optimized with heater temperature, and the glass preheating temperature was optimized to prevent glass breakage due to thermal stress. Thus the vacuum glass was successfully manufactured based on these results and heat transmission coefficient measured was about $5.7W/m^2K$ which indicates that the internal pressure of the vacuum glazing is $10^{-2}$ torr.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• Transactions of Materials Processing
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• v.16 no.2 s.92
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• pp.144-149
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• 2007

The superplastic forming/diffusion bonding(SPF/DB) is widely used in the automotive and aerospace industry because it has great advantage to produce complex, light and strong parts. But the superplastic forming process requires much forming time and generates excessive thinning in the thickness distribution of formed part. It is necessary to minimize trial and error for SPF/DB Process. Finite element analysis using $L_{18}$ orthogonal may table of Taguchi method for 3-Sheet D/B process is carried out. Through the study, effect of process parameters, such as DH region size, thickness and friction coefficient, is evaluated and the optimum condition is derived.

• Proceedings of the Korea Concrete Institute Conference
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• 2004.05a
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• pp.80-83
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• 2004

The FRP plate or sheet bonding technology was widely used for strengthening deficient RC structures. The strengthened structure using FRP bonding scheme, however, experience the complex interfacial behaviour which is difficult to predict. Therefore, the unbonded scheme using some anchorage device can be is an alternative for more reliable design. In this study, wedge-type anchor for FRP plate is developed for the unbonded flexural strengthening scheme. Some parameter study using 2D finite element method is performed. The analysis parameters are taken as wedge-guide friction coefficients, wedge- FRP ,.friction coefficient and wedge inclination angle. Based on the parameter study, more efficient anchors are designed and tested. The test result show that the developed anchor assure about $80\%$ FRP strength, which is higher performance than typical bonding scheme. Last, 3D finite element analysis is performed.