• Korean Journal of Remote Sensing
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• v.19 no.6
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• pp.479-490
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• 2003

This study proposed a modified anisotropic diffusion restoration for image classification. The anisotropic diffusion restoration uses a probabilistic model based on Markov random field, which represents geographical connectedness existing in many remotely sensed images, and restores them through an iterative diffusion processing. In every iteration, the bonding-strength coefficient associated with the spatial connectedness is adaptively estimated as a function of brightness gradient. The gradient function involves a constant called "temperature", which determines the amount of discontinuity and is continuously decreased in the iterations. In this study, the proposed method has been extensively evaluated using simulated images that were generated from various patterns. These patterns represent the types of natural and artificial land-use. The simulated images were restored by the modified anisotropic diffusion technique, and then classified by a multistage hierarchical clustering classification. The classification results were compared to them of the non-restored simulation images. The restoration with an appropriate temperature considerably reduces error in classification, especially for noisy images. This study made experiments on the satellite images remotely sensed on the Korean peninsula. The experimental results show that the proposed approach is also very effective on image classification in remote sensing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.4
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• pp.333-341
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• 2022

Magnetoelectric (ME) composites are comprised of magnetostrictive and piezoelectric phases. Lots of theoretical and experimental works have been done on ME composites in the last couple of decades. The output performance of ME composites has been enhanced by optimizing the constituent phases, interface layer, dimensions of the ME composites, different operating modes, etc. However, the detailed information about the characterization of ME coupling in ME composites is not provided yet. Therefore, in this tutorial paper, we are giving an insight into the details of measurements of ME voltage coefficient of ME composites both at off-resonance and resonance conditions. A symmetric type Gelfenol/PMN-PZT/Gelfenol ME composites were fabricated by sandwiching (011) 32-mode PMN-PZT single crystal between two Galfenol plates by epoxy bonding are used for the example of ME coupling measurement. The details about the experimental setup used for the measurement of ME voltage coefficient are provided. Furthermore, a step-by-step measurement of ME voltage coefficient using computerized program is demonstrated. We believe the present experimental measurement details can help readers to understand the concept of ME coupling and its analysis.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.40-50
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• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.2
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• pp.113-120
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• 2010

An experimental investigation was carried out to examine the evaporative heat transfer characteristics of R-134a in a micro-channel heat exchanger. The micro-channel heat exchanger used in this study was a sort of plate heat exchanger. Micro-channels were fabricated on the SUS304 plate by the photo-etching process: 13 sheets of plates were stacked and bonded by the diffusion bonding process. The effects of the evaporating temperature, mass flux of R-134a, and inlet temperature of water were examined. As the difference between the inlet temperatures of R-134a and water increased, the heat transfer rate increased. The evaporative heat transfer coefficients obtained in this study range from 0.67 to 6.23 kW/$m^2{\cdot}^{\circ}C$. The experimental correlation for the Nusselt number as a function of the Reynold number and $\Theta$ was suggested for the micro-channel heat exchanger.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.1
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• pp.36-41
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• 2018

This paper presents an implementation of a millimeter-wave(W band) multiflare-angle horn antenna. The proposed antenna is a multimode dual-polarized square horn having equal E- and H-plane beamwidths and consists of a multimode generating section, a four-square-waveguide exciter, orthomode transducers, and power combiners for the sum pattern formation. The antenna structure has been designed to allow for easy fabrication and the designed antenna has been fabricated to a precision of ${\pm}0.02mm$ by layer-by-layer machining and diffusion bonding. The input reflection coefficient and the radiation pattern of the fabricated antenna have been measured using a network analyzer and a far-field test facility. Measurements show that the proposed antenna has 17.7~18.3 dBi gain, $25.2{\sim}28.5^{\circ}$ beamwidth, and an input VSWR between 1.02~1.75, within ${\pm}0.5GHz$ from the center frequency.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.10
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• pp.1541-1550
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• 1997

Since the ceramic/metal joint material is made at a high temperature, the residual stress develops when it is cooled from bonding temperature to room temperature due to remarkable difference of thermal expansion coefficient between ceramic and metal. As residual stress at ceramic/metal joints influences the strength of joints, it is important to estimate residual stress quantitatively. In this study, it is attempted to estimate joint residual stress of Si$_3$N$_4$STS304 joints quantitatively and to compare the strength of joints. The difference of residual stress is measured when repeated thermal cycl is loaded, under the conditions of the practical use of the ceramic/metal joint. The residual stress increases at 1 cycle of thermal load but decreases in 3 cycles to 10 cycles of thermal load. And 4-point bending test is performed to examine the influence of residual stress on fracture strength. As a result, it is known that the stress of joint decreases as the number of thermal cycle increases.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.382-382
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• 2010

$TaO_2$ thin films as gate dielectrics have been proposed to overcome the problems of tunneling current and degradation mobility in achieving a thin equivalent oxide thickness. An extremely thin $SiO_2$ layer is used in order to separate the carrier in MOSFETchannel from the dielectric field fluctuation caused by phonons in the dielectric which decreases the carrier mobility. The electronic and optical properties influenced the device performance to a great extent. The atomic structure of amorphous and crystalline Tantalum oxide ($TaO_2$) gate dielectrics thin film on Si (100) were grown by utilizing atomic layer deposition method was examined using Ta-K edge x-ray absorption spectroscopy. By using X-ray photoelectron spectroscopy and reflection electron energy loss spectroscopy (REELS) the electronic and optical properties was obtained. In this study, the band gap (3.400.1 eV) and the optical properties of $TaO_2$ thin films were obtained from the experimental inelastic scattering cross section of reflection electron energy loss spectroscopy (REELS) spectra. EXAFS spectra show that the ordered bonding of Ta-Ta for c-$TaO_2$ which is not for c-$TaO_2$ thin film. The optical properties' e.g., index refractive (n), extinction coefficient (k) and dielectric function ($\varepsilon$) were obtained from REELS spectra by using QUEELS-$\varepsilon$(k, $\omega$)-REELS software shows good agreement with other results. The energy-dependent behaviors of reflection, absorption or transparency in $TaO_2$ thin films also have been determined from the optical properties.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.1-10
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• 2022

Recently, semiconductor devices have been used in many fields owing to various applications of mobile electronics, wearable and flexible devices and substrates. During the semiconductor chip bonding process, the mismatch of coefficient of therm al expansion (CTE) between the substrate and the solder, and the excessive heat applied to the entire substrate and components affect the performance and reliability of the device. These problems can cause warpage and deterioration of long-term reliability of the electronic packages. In order to improve these issues, many studies on low-melting temperature solders, which is capable of performing a low-temperature process, have been actively conducted. Among the various low-melting temperature solders, such as Sn-Bi and Sn-In, Sn-58Bi solder is attracting attention as a promising low-temperature solder because of its advantages such as high yield strength, moderate mechanical property, and low cost. However, due to the high brittleness of Bi, improvement of the Sn-Bi solder is needed. In this review paper, recent research trends to improve the mechanical properties of Sn-Bi solder by adding trace elements or particles were introduced and compared.

• Journal of Korean Society on Water Environment
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• v.36 no.1
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• pp.48-54
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• 2020

This paper presents a screening protocol for the selection of solvents available for the solvent extraction desalination process. The desalination solvents hypothetically and theoretically require the capability of (1) Forming hydrogen bonds with water, (2) Absorbing some water molecules into its non-polar solvent layer, (3) Changing solubility for water-solvent separation, and (4) Rejecting salt ions during absorption. Similar to carboxylic acids, amine solvents are solvent chemicals applicable for desalination. The key parameter for selecting the potential solvent was the octanol-water partitioning coefficient (Kow) of which preferable value for desalination was in the range of 1-3. Six of the 30 amine solvents can absorb water and have a variable, i.e., temperature swing solubility with water molecule for water-solvent separation. Also, the hydrogen bonding interaction between solvent and water must be stronger than the ion-dipole interaction between water and salt, which means that the salt ions must be broken from the water and only water molecules absorbed for the desalination. In the final step, three solvents were selected as desalination solvents to remove salt ions and recover water. The water recovery of these three solvents were 15.4 %, 2.8 %, 10.5 %, and salt rejection were 76 %, 98 %, 95 %, respectively. This study suggests a new screening protocol comprising the theoretical and experimental approaches for the selection of solvents for the desalination method which is a new and challenges the desalination process in the future.

• Child Health Nursing Research
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• v.5 no.3
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• pp.358-367
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• 1999

The Purpose of this study was to identify of parent-child relationship, Perceived social support and coping of female in late adolescents and its relationships. The underlying assumption is that Parent-child relationship based on internal working cognition affects on perceived social support and coping. The sample was consisted of 277 female students of college. The instruments used in this study were Parental bonding instrument (PBI)(Parker, Tupling & Brown. 1979), Personal resources questionnaire : PRQ-part II (Weinert ' Brant, 1987), and Way of coping (Folkman & Lazarus, 1985). The data was analyzed using frequencies, correlation coefficient, ANOVA. and t-test. As a result. perceived social support correlated positively with Parental care and negatively with parental overprotection. Perceived social support showed positive relationship with coping. Perceived social support differed according to parent-child relationship type. The group of 'affectionate constraint' high care and high overprotection. reported high perceived social support, but 'affectionless control'(low care and high overprotection) reported low perceived social support. The group of high perceived social support showed higher parental care and higher coping than low one. The group of high coping showed higher parental care, lower parental overprotection and higher perceived social support than low one. Findings from this study linking retrospective accounts of early parental relationships to current working models concerning the nature of supportive relationships are consistent with attachment theory that individual who, as children, experienced relationships with their parents that were independent-encourage. affectionate, and not overprotective developed working models of others as available to provide social support. This study confirmed that perceived social support significantly related to coping in dealing with stress.