• Corrosion Science and Technology
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• v.9 no.6
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• pp.247-253
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• 2010

The characteristics of selective oxidation prior to hot-dip galvanizing with the annealing atmosphere dew point and chemical composition in dual-phase steels and their effect on the inhibition layer formation relevant to coating adhesion have been studied using a combination of electron microscopic and surface analytical techniques. The annealed and also galvanized samples of 3 kinds of Si/Mn ratios with varied amounts of Si addition were prepared by galvanizing simulator. The dew point was controlled at soaking temperature $800^{\circ}C$ in 15%$H_2$ -85%$N_2$ atmosphere. It was shown that good adhesion factors were mainly uniformity of oxide particle distribution of low number density and low Si/Mn ratio prior to hot-dip galvanizing. Their effect was the greatly reduced coating bare spots and the formation of uniform inhibition layer leading to good adhesion of Zn overlay. The mechanism of good adhesion is suggested by two processes: the formation of inhibition layer on the oxide free surface uncovered with no $SiO_2$-containing particles in particular, and the inhibition layer bridging of oxide particles. The growth of inhibition layer was enhanced markedly by the delayed reaction of Fe and Al with the increase of Si/Mn ratio.

• Journal of the Society of Naval Architects of Korea
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• v.47 no.5
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• pp.743-749
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• 2010

Multi-nozzle spray painting procedure of the inorganic zinc shop primer was established in order to obtain uniform film thickness. The shop primer paint prevents the corrosion of steel block during shipbuilding. When the dry film thickness of shop primer is insufficient, rust will be generated on the steel block. Otherwise, thick coating of shop primer may be a problem of weld defect. So, it is important to obtain the uniform film thickness of shop primer. The uniformity of dry film thickness is affected by spray speed, distance from spray gun to target surface and overlapping span of spray path. In order to uniformly maintain coating thickness of shop primer, the coating procedure was established based on the correlation of shop primer spray variables.

• Journal of the Korean Physical Society
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• v.73 no.10
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• pp.1473-1478
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• 2018

In this study, we have developed a simple and cost-effective method to prevent edge bead formation by covering the edge of a chip-level substrate with heat-resistant tape during patterning using SU-8. Edge beads are a fundamental problem in photoresists and are particularly notable in high-viscosity fluids and thick coatings. Edge beads can give rise to an air gap between the substrate and the patterning mask during UV exposure, which results in non-uniform patterns. Furthermore, the sample may break since the edge bead is in contact with the mask. In particular, the SU-8 coating thickness of the chip-level substrates used in MEMS or BioMEMS may not be properly controlled because of the presence of edge beads. The proposed method to solve the edge bead problem can be easily and economically utilized without the need for a special device or chemicals. This method is simple and prevents edge bead formation on the sample substrate. Despite the small loss in the taping area, the uniformity of the SU-8 coating is improved from 50.9% to 5.6%.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.857-863
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• 2017

In this paper, the process of electro Ni and electro Cr plating is studied for the purpose of thermal barrier to protect the inner wall combustion chamber. The chamber is under the environment of very high temperature and high pressure when propellants burn in there. As one of the thermal barrier coatings, Zr-based thermal spray coating has been applied to the chamber. However, peeling of coating layer can occur under such a hard condition because of the difference of thermal expansion coefficients between the ceramic and the metallic wall. We study the characteristics of Ni-Cr coating and establish its process. It is found that the thickness of over $100{\mu}m$ of Ni and Cr coating layers with the uniformity of ${\pm}10%$ can be obtained with the used of as-developed plating bath.

• Journal of Sensor Science and Technology
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• v.16 no.5
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• pp.325-330
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• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.39-44
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• 2022

Using a CFD (computational fluid dynamics) simulation tool, we have offered a design guideline of a slot-die head having a simple T-shaped cavity through an analysis of the fluid dynamics in terms of cavity pressure and outlet velocity, which affect the uniformity of coated thin films. We have visualized the fluid flow with a transparent slot-die head where poly(3,4-ethylenedioxythiophene):poly(4-styrenesulfonate) (PEDOT:PSS) is injected. We have shown that the fluid dynamics inside the slot-die head depends sensitively on the cavity depth, cavity length, land length, and channel gap (i.e., shim thickness). Of those, the channel gap is the most critical parameter that determines the uniformity of the pressure and velocity distributions. A pressure drop inside the cavity is shown to be reduced with decreasing shim thickness. To quantify it, we have also calculated the coefficient of variation (CV). In accordance with Hagen-Poiseuille's laws and electron-hydraulic analogy, the CV value is decreased with increasing cavity depth, cavity length, and land length.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2001.11a
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• pp.55-56
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• 2001

지난 수년간 유럽을 중심으로 Carbonate의 PSD (Particle Size Distribution)가 도공지 의 백색도, 불투명도, Coverage등에 미치는 영향에 대하여 많은 연구가 진행되어 왔다. 현재 국내의 Coating Pigment System 역시 Carbonate 위주로 구성되어 있으나, 입자 분포에 따른 실증적 연구가 선진국에 비하여 부족한 상태이다. 본 연구는 최근 유럽에서 사용 중인 Narrow PSD Carbonate가 도공지 품질에 미치는 영향을 검토한 것으로서, 특히 Multiple Coating에서의 도공층 구조변화와 그에 따른 백지물성 및 인쇄적성의 변화를 연구한 것이다. 실험의 Case는 Broad PSD CaC03와 Narrow PSD CaC03를 비 교하였 다 .. Color F Formulation은 Pre Color에서 #1 Clay 30 p따t와 각각 CaC03 70 p따t를 사용하였다. 그리고 바인더와 첨가제는 동일하게 사용하였다 .. Top color Formulation 또한 동일하 게 사용하였다. 코팅방식은 speed 450rrνmin, pre rod coating, top blade coating 방식 으로 CLC (Cy lindrical Laboratory Coater)를 사용하여 코팅하였다. 백지품질은 백색도, 평활도 ,광택도, 거칠음도, Bum Out Test와 Coverage( SEM 사 진 Z -direction) 등을 측정하였다. 인쇄품질은 인쇄 광택도, 인쇄 Picking strength와 2 도 인쇄 농도를 측정하였다. 백색도는 Narrow PSD CaC03를 사용한 것이 Broad PSD CaC03를 사용한 것 대비 약1% 우수하였다. 이것은 Narrow PSD CaC03를 사용한 것이 filter cake이 많이 open 되 어 있어 dewatering이 빠르고, Wet void volume이 증가되 어 부동화점 의 농도가 낮 아져 원지 층으로 침 투되 는 pigment가 작고 표층에 잔류하는 pigment와 void volume의 증가로 인해 기공층이 증가한 것으로 판단된다. 그리고, 백지광택도, 거칠음도 등 또한 Narrow PSD CaC03를 사용한 것이 우수하였 다. 이는 Pre color에서 coverage의 개선으로 top color층의 도공량 uniformity가 개선 된 이유라고 생각한다. 그러나 인쇄품질은 백지와 비교하여 차이가 없었다. 이것은 top 칼라 Formulation이 동일하고, 인쇄시 잉크흡수 거동은 top color 층에 주로 영향을 받기 때문이라고 판단 된다. 향후에는 인쇄품질의 향상을 위하여 Case 2의 CaC03 100% 사용가능성 및 Pre Color 는 Case 2로 고정하고, Top칼라를 변경하는 방법을 또한 생각할 필요가 있다고 판단된다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.105-105
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• 2016

Recently, high power impulse magnetron sputtering (HIPIMS) has attracted considerable attentions due to its high potential for industrial applications. By pulsing the sputtering target with high power density and short duration pulses, a high plasma density and high ionization of the sputtered species can be obtained. HIPIMS has exhibited several merits such as increased coating density, good adhesion, microparticle-free and smooth surface, which make the HIPIMS technique desirable for synthesizing hard coatings. However, hard coatings present intrinsic defects (columnar structures, pinholes, pores, discontinuities) which can affect the corrosion behavior, especially when substrates are active alloys like steel or in a wear-corrosion process. Atomic layer deposition (ALD), a CVD derived method with a broad spectrum of applications, has shown great potential for corrosion protection of high-precision metallic parts or systems. In ALD deposition, the growth proceeds through cyclic repetition of self-limiting surface reactions, which leads to the thin films possess high quality, low defect density, uniformity, low-temperature processing and exquisite thickness control. These merits make ALD an ideal candidate for the fabrication of excellent oxide barrier layer which can block the pinhole and other defects left in the coating structure to improve the corrosion protection of hard coatings. In this work, CrN/Al2O3/CrN multilayered coatings were synthesized by a hybrid process of HIPIMS and ALD techniques, aiming to improve the CrN hard coating properties. The influence of the Al2O3 interlayer addition, the thickness and intercalation position of the Al2O3 layer in the coatings on the microstructure, surface roughness, mechanical properties and corrosion behaviors were investigated. The results indicated that the dense Al2O3 interlayer addition by ALD lead to a significant decrease of the average grain size and surface roughness and greatly improved the mechanical properties and corrosion resistance of the CrN coatings. The thickness increase of the Al2O3 layer and intercalation position change to near the coating surface resulted in improved mechanical properties and corrosion resistance. The mechanism can be explained by that the dense Al2O3 interlayer acted as an excellent barrier for dislocation motion and diffusion of the corrosive substance.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

• Proceedings of the Korean Society of Near Infrared Spectroscopy Conference
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• 2001.06a
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• pp.3111-3111
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• 2001

The implementation of NIR and chemometrics in the Pharmaceutical industries is still in strong progress, both regarding qualitative and quantitative applications and beneficial results are seen. Looking at the development so far, NIR will change the pharmaceutical industry even more in the future. This presentation will address the experiences and progress achieved regarding the application and implementation of quantitative methods for determination of content uniformity and assay of tablets with less than 10% w/w of active, using Near Infrared transmittance spectroscopy in combination with PLS. Also qualitative methods for identification of the same tablets by Near Infrared reflectance spectroscopy will be discussed. Four commercial tablet strengths are formulated and produced from two different compositions by direct compression. Three different strengths are dose proportional, i.e. fixed concentration by varying in size. The aim was to replace the conventional primary methods for analysing content uniformity, assay and identification by NIR. Studies were performed on comparing transmittance versus reflectance spectroscopy for both applications on the dose proportional tablets. The model for determination of content uniformity and assay was developed to cover both coated and uncoated tablets, whereas the qualitative model was developed to identify coated tablets only. The impact of the tablet formulation, tablet size and coating, resulted in individual models far each composition The best calibration was achieved using diffuse reflectance for the identification purposes and diffuse transmittance for the quantitative determination of the active content within the tablets. As NIR in combination with other techniques opens up the possibility of total quality management within the production, the transfer of the above-mentioned models from a laboratory based approach to an at-line approach at H.Lundbeck will be addressed too.