• 폴리머
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• 제34권6호
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• pp.491-494
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• 2010

무유화 에멀젼 공중합법을 이용하여 180~200 nm의 지름을 가지는 단분산성 폴리(스티렌/디비닐벤젠/비닐 아세테이트) [poly(ST-co-DVB-co-VAc)] 고분자 나노입자를 합성하였으며, 제조된 단분산성 고분자 나노입자의 표면을 비누화반응을 통하여 개질하여 단분산성 폴리(스티렌/디비닐벤젠/비닐알코올) [poly(ST-co-DVB-co-VA)] 나노입자를 제조하였다. 합성된 입자를 반응염료와 반응시켜 적색과 청색 단분산성 폴리(스티렌/디비닐벤젠/비닐알코올) 나노입자를 제조하였으며, 입자의 형태, 분산성 및 표면전하를 전자현미경, 시차열분석기, UV/Vis 흡광기 및 제타 전하 측정장치를 이용하여 규명하였다.

• 한국고분자학회지:고분자과학과기술
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• 제5권1호
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• pp.24-28
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• 1994

• Macromolecular Research
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• 제10권5호
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• pp.273-277
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• 2002

Ultra-thin polymer films containing cobalt(II) meso-tetraphenylporphyrin(CoTPP) have been prepared by vacuum codeposition of the metal complex and trans-2-butene as an organic monomer using an inductively coupled RF glow discharge operating at 7-9 Watts. The polymer films were characterized by sorption measurements. Sorption data obtained for polymer films containing CoTPP indicate that the CoTPP molecules are capable of reversibly binding oxygen molecules. It was found that the adjacent CoTPP molecules in the aggregated metal complex phase could irreversibly share the oxygen molecules. A dispersion of the metal complex molecules in the polymer matrix was made to maintain the reversible reactivity of the metal complex molecules with oxygen in the polymer films via vacuum evaporation process. The Henry mode solubility constant, the Langmuir mode capacity constant, the amount of binding oxygen, and the dissociation equilibrium in the dual mode sorption theory were discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.360-361
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• 2008

A new kind of SBM co-polymer binder as styrene, n-butyl acrylate, and methacrylic acid (SBM) monodisperse co-polymer binder materials basted on $TiO_2$ pastes was synthesized and this $TiO_2$ pastes were applied of dye-sensitized solar cells (DSSCs). The SBM co-polymer binder was prepared by soap-free emulsion copolymerization using a PEG-EEM macromonomer. The photoanodes were characterized by morphology investigated from field emission scanning electron microscopy (FE-SEM). The photoelectrochemical properties of the thin films and the performance of DSSCs were measured by photovoltaic-current density. DSSC based on the emulsion co-polymer binder was obtained conversion efficiency of 7.1% under irradiation of AM 1.5($100mWcm^{-2}$).

• 한국고분자학회지:고분자과학과기술
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• 제7권1호
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• pp.14-22
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• 1996

• Macromolecular Research
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• 제8권2호
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• pp.89-94
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• 2000

A semi-interpenetrating network (IPN) was prepared for a temperature-sensitive polymer system composed of sodium alginate and poly (N, N-dimethylaminoethyl methacrylate (DMAEMA)-co-ethyl acrylamide (EAAm)). The role of sodium alginate is to provide crosslinked network and that of poly(DMAEMA-co-EAAm) is to provide temperature responsiveness to the polymer system. Semi-IPN gel shows temperature-induced swelling transition at the same temperature of the lower critical solution temperature of poly(DMAEMA-co-EAAm) and its swelling kinetics is manipulated by the control of crosslinking densitv.

• EDISON SW 활용 경진대회 논문집
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• 제5회(2016년)
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• pp.147-154
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• 2016

Co-nonsolvency is a puzzling phenomenon that a polymer swells in a good solvent individually, but it collapses in a mixture of good solvents. This structural transition with changing solvent environment has been drawing attention due to practical application for stimuli-responsive polymer. The aim of this work is to describe the physical origin of the co-nonsolvency. In this work, we present Monte Carlo simulations for polymer solutions by using simple and general model. We simulate linear and ring polymers to compare their co-nonsolvency behaviors. Calculating Flory exponents and bridging fractions gives a good description for polymer structures. While the polymer structure shows non-monotonous behavior with increasing the cosolvent fraction, the chemical potential decreases monotonously. This indicates that coil-to-globule transition of polymers is purely controlled by free energy and can be regarded as a thermodynamics transition. We also present that ring polymers have higher looping probability than linear polymers, thus the bridging fraction remains higher at high cosolvent fraction. Our study provides a new perspective to understand polymer structure when the polymer "dissolves well" in any solvent.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.784-787
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• 2006

We have developed a RGB polymer dispersed liquid crystal film (RGB PDLC). To obtain the color display, color pigments are mixed in the prepolymer. We have presented an electro-optical performance of our cell and analyzed the electro optical properties for varying LC/ pre-polymer ratio and polymer type.

• Korea-Australia Rheology Journal
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• 제18권2호
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• pp.83-90
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• 2006

Supercritical carbon dioxide ($scCO_2$) has advantages of being incorporated in polymer with high solubility and of being recovered easily by depressurizing. $scCO_2$ reduces the viscosity of polymer melt and it is expected to be use as a plasticizing agent. In this work, we studied on the effect of $scCO_2$ on the rheological properties of polymer melts during extrusion process. Slit die attached to twin screw extruder was used to measure the viscosity of polymer melts plasticized by supercritical $CO_2$. A gas injection system was devised to accurately meter the supercritical $CO_2$ into the extruder barrel. Measurements of pressure drop within the die, confirmed the presence of a one phase mixture and a fully developed flow during the measurements. The viscosity measurement of polypropylene was performed at experimental conditions of various temperatures, pressures and $CO_2$ concentrations. We observed that melt viscosity of polymer was dramatically reduced by $CO_2$ addition.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1702-1703
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• 2011

MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.