• Journal of the korean academy of Pediatric Dentistry
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• v.26 no.3
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• pp.554-563
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• 1999

For the purpose of elucidating the polymerization modes of dual-cure restorative materials and comparing them with single-cure restorative materials, a study was performed on the light-cured composite resin, dual-cure composite resin, dual-cure glass ionomer cement and chemical-cure glass ionomer cement. By measuring the microhardness of each material at 0mm, 1mm and 3mm depth during initial 24 hours with predetermined interval, the state of polymerization and degree of conversion was indirectly evaluated for each material, and obtained results are as follows : 1. All of four materials tested showed significant increase in microhardness after 24hrs compared with just after curing starts. 2. In all materials except Ketac-fil, there showed a significant difference in microhardness between each depth at each time interval. 3. In the test of lap time till final curing for each material, the polymerization process was revealed to last longer in the dual-cure type materials than in single-cure type materials at 3mm depth. Based on the results above, it was demonstrated with materials of dual-cure mode that the degree of conversion increases by successive curing reactions even in the deeper layers where sufficient curing light is impermeable.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2012.11a
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• pp.65-66
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• 2012

The cement used in the construction industry of the manufacturing process, large amounts of the greenhouse gas, CO₂ and is currently being studied for cement substitutes that reduce greenhouse gas issue. Therefore, the this study as a replacement for cement industrial by-product of blast furnace slag, red mud, silica fume and alkali-activator, using only inorganic composites without high-temperature calcination process were manufactured. The waste gypsum board micro powder added to compensate for the shrinkage cracks, the compressive strength and flow, and length change characteristics were investigated. Consequently, The setting time was shortened as GB added And liquidity was reduced. GB 2%, 7 days curing the added strength of specimens was the highest. Came out, and change the length of the Plain least.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.61-62
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• 2006

In this paper, it was demonstrated that organic thin- film transistors (OTFTs) were fabricated with the organic adhesion layer between an organic semiconductor and a gate insulator by vapor deposition polymerization (VDP) processing. In order to form polymeric film as an adhesion layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing. The saturated slop in the saturation region and the subthreshold nonlinearity in the triode region were c1early observed in the electrical output characteristics in our organic thin film transistors using the staggered-inverted top-contact structure. Field effect mobility, threshold voltage, and on-off current ratio in 15-nm-thick organic adhesion layer were about $0.5\;cm^2/Vs$, -1 V, and $10^6$, respectively. We also demonstrated that threshold voltage depends strongly on the delay time when a gate voltage has been applied to bias stress.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.114-115
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• 2007

In this paper, it was demonstrated that organic thin-film transistors (OTFTs) were fabricated with the organic passivation layer by vapor deposition polymerization (VDP) processing, In order to form polymeric film as an passivation layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing, Field effect mobility, threshold voltage, and on-off current ratio with 450-nm-thick organic passivation layer were about $0.21\;cm^2/Vs$, IV, and $1\;{\times}\;10^5$, respectively.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.11
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• pp.115-120
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• 2021

In this study, cigarettes, which are an essential element in the production of tobacco, are generally not cylindrical. The main materials used for cigarettes are generally hemp and pulp. For the production of cylindrical cigarettes, the cigarettes or cylinders are mounted via gluing. This adhesive is a vinyl acetate emulsion, a high-temperature melt adhesive, and is adhered in a cylindrical shape immediately after being linearly applied to the inner surface of the paper roll or a local part. These adhesives are greatly affected by the atmospheric temperature of the manufacturing space in summer and winter. In the summer, even if the adhesive is temporarily adhered, the coagulation time of the adhesive is long, and problems such as deterioration of the adhesive state occur. in the winter, there is a problem that the temperature of the manufacturing space is low and the adhesive force of the adhesive is poor, resulting in defective adhesive products. In order to solve these problems, another heat transfer device is utilized to cure the remaining adhesive to ensure higher adhesiveness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.421-421
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• 2008

Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

• Journal of the Korean Geotechnical Society
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• v.40 no.2
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• pp.19-28
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• 2024

This study explores the long-term decline in the uniaxial compressive strength of Controlled Low Strength Material (CLSM) by preparing a sample with a 1:1 mixing ratio of CLSM and water. Uniaxial compressive strength tests were conducted after 7 and 28 days of curing. The results revealed that the compressive strength at 28 days was reduced by a factor of 2.85 compared to that at 7 days. Additionally, when expansion was introduced under the same mixing conditions, there was a significant reduction in compressive strength. Point load strength tests based on 7 and 28 days of curing indicated a disparity of 29.27 to 58.76 and 48.19 to 95.13 times, respectively, between the point load strength and the uniaxial compressive strength at 7 days. The differences observed in the findings of this study compared to previous studies may be attributed to variations in the precision of the test method and the sample production process. Therefore, it is essential to establish clear testing methods to accurately evaluate CLSM.

• Polymer(Korea)
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• v.34 no.3
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• pp.215-219
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• 2010

Nitrile rubber (NBR) composites were prepared using the commercially avaliable rubber compounding process with Cloisite$^{(R)}$ 10A or carbon black as fillers. When Cloisite$^{(R)}$ 10A was used as a filler in the NBR composites, the mechanical properties, oil resistant, and oxygen barrier were better than those for carbon black composites. In cure characteristics of NBR/clay composites, scorch time and curing time were reduced. It was found that alkyl ammonium ion inserted in Cloisite$^{(R)}$ 10A was considered as an accelerator of vulcanization for NBR composites.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.38 no.1 s.113
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• pp.1-8
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• 2006

To overcome troubles in strength and process of linerboard caused by raw materials, a neutral sizing which is usual in fine paper making can be considered. A new sizing agent is necessary to show good performance in a system with high conductivity and COD. In this study, fast cure type AKD was examined as a new sizing agent and compared with conventional AKD. The effects of fixing agent addition and drying condition were also investigated. Fast cure type AKD which has a higher cationicity showed better sizing degree than conventional AKD in spite of low addition level and no curing treatment. And when fixing agent of sufficient amount was added, sizing degree was improved for both AKDs. High cationicity is a crucial factor for neutral sizing of linerboard for obtaining fast and stable sizing degree. Drying with temperature over $100^{\circ}$ was desirable for developing sizing degree.

• Design & Manufacturing
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• v.7 no.1
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• pp.60-63
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• 2013

Recently, Silicone that one of the thermo-sets is used to making optical products such as LED lenses because of excellent thermal properties. LED lenses are required to keep the precise dimensions, so they must be molded to have the minimum deformation. Thermo-sets have the expansion characteristic on the part of thermal property, it is important to optimize the cure condition so that the deformation of the part become minimum. In this study, to investigate the relationship between the shrinkage by the curing and expansion by the thermal properties of the resin, reactive injection experiment was performed by setting the variables such as mold setting temperature, cure time. As a result, it was confirmed that there was a interval while the thermal properties were transferred to more active during the cure process. It is expected to help in determining the reactive injection molding conditions of the thermo-set parts as well as LED lens in order to reduce the amount of deformation.