• Composites Research
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• v.17 no.6
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• pp.14-21
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• 2004

Failure process, mode and strength of unidirectional composite single lap bonded joints were investigated experimentally with respect to bonding methods, those are, co-curing with and without adhesive and secondary bonding. The co-cured joint specimens without adhesive had the largest failure strength. Progressive failures along the adhesive layer occurred in the secondary bonded specimens. In the co-cured specimens with adhesive film which had better material strength and adhesion performance, delamination failure occurred and the joint strengths were less than those of secondary bonded specimens. Delamination failure did not occur in the secondary bonded specimens because of earlier crack growth and progressive failure in the adhesive layer. Therefore, failure strength of composite bonded Joints were not always proportionate to material strength and adhesion performance of the adhesive due to the weakness of delamination in composite materials. The effects of surface roughness, bondline thickness and fillets were also studied on secondary bonded specimens.

• Applied Chemistry for Engineering
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• v.24 no.2
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• pp.148-154
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• 2013

UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.32-38
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• 2006

A series of organic-inorganic hybrids, PCL/EP/$SiO_2$, involving epoxy resin and triethoxysilane-terminated polycaprolactone elastomer (PCL-TESi) were prepared via polymerization of diglycidyl ether of bisphenol A (DGEBA) with amine curing agent KB-2 and sol-gel process of PCL-TESi. The curing reactions were started from the initially homogeneous mixture of DGEBA, KB-2 and the PCL-TESi. The organicinorganic hybrids containing up to 4.95% (wt) of $SiO_2$ were obtained and characterized by FT-IR, transmission electron microscopy (TEM), differential scanning calorimetry (DSC) and thermogravimetry analysis (TGA). It was experimentally shown that the swelling property in toluene, morphologies and thermal properties of the resulting hybrids were quite dependent on the contents of $SiO_2$. The crosslink network density decreases with increasing of the PCL-TESi. And in TEM, the phase separated morphology of these hybrids was found, which resulted from the coagulation of Si-O-Si networks resulting from $-Si(OC_2H_5)_3$ of PCL-TESi self-curing by hydrolytic silanol condensation, with the advancement of the curing reaction in the modified epoxy resin systems. Meanwhile, the change of the $SiO_2$ content made the morphologies changed from aggregated particles of Si-O-Si in the hybrid to nanocluster of interconnected Si-O-Si particles, then to aggregated Si-O-Si dispersing in the continuous cured epoxy phase again, and last to co-continuous interpenetrating network. The glass transition behavior of the hybrid material was cooperative motion of large chain segments, which were hindered by the inorganic Si-O-Si network. And in TG analysis, the characteristic temperature at 5% of weight loss was evidently increased from $120.5^{\circ}C$ of pure cured epoxy to $277.6^{\circ}C$ of 3.84% (wt) of $SiO_2$ modified epoxy due to the existence of Si-O-Si when PCL-TESi was added in the hybrid.

• Composites Research
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• v.34 no.5
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• pp.317-322
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• 2021

When a complex load such as torsion, low-speed impact, or fatigue load is applied, the properties in the thickness direction are weakened through microcracks inside the material due to the nature of the laminated composite material, and delamination occurs. To prevent the interlaminar delamination, various three-dimensional reinforcement methods such as Z-pinning and stitching, and structural health monitoring techniques that detect the microcrack of structures in real time have been continuously studied. In this paper, the single-lap joints with I-fiber stitching process were manufactured by a co-curing method and their strengths and failure detection capability were evaluated. AE and electric resistance method were used for detection of crack and failure signal and electric circuit for signal analysis was manufactured, and failure signal was analyzed during the tensile test of a single-lap joint. From the experiment, the strength of the single lap joint reinforced by I-fiber stitching process was improved by about 44.6% compared to the co-cured single lap joint without reinforcement. In addition, as the single-lap joint reinforced by I-fiber stitching process can detect failure in both the electrical resistance method and the AE method, it has been proven to be an effective structure for failure monitoring as well as strength improvement.

• Composites Research
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• v.29 no.5
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• pp.315-320
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• 2016

Conventionally, composite aircraft structures are fabricated within autoclave at high pressure. However, autoclave process has several disadvantages including high curing costs and limitation of part size. Recently, out-of-autoclave (OoA) processes have been investigated in many studies to replace conventional autoclave process. A newly developed OoA prepreg, using conventional ovens, can significantly reduce the curing costs and produce autoclave-quality parts. Nevertheless, manufacture of void-free complex shape structure using OoA process presents significant challenges because of the low consolidation pressure. In this study, integrated skin-spar-rib composite part was fabricated using OoA prepreg. And cross-sectional macro- and micro-graphs of the part were examined in order to assess the possibility of replacing conventional autoclave process.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Carbon letters
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• v.6 no.3
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• pp.181-187
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• 2005

Bipolar plates require some specific properties such as electrical conductivity, mechanical strength, chemical stability, and low permeability for the fuel cell application. This study investigated the effects of carbon nanotube (CNT) contents and process conditions of hot press molding on the electrical and physical properties using CNT 3~7 wt% added graphite nano-composites in the curing temperatures range of 140~$200^{\circ}C$ and pressure of 200~300 kg/$cm^2$. Bulk density, hardness and flexural strength increased with increasing CNT contents, curing pressure and temperature. With the 7 wt% CNT added noncomposite, the electrical resistance improved by 30% and the flexural strength increased by 25% as compared to that without CNT at the temperature of $160^{\circ}C$ and pressure of 300 kg/$cm^2$. These properties were close to the DOE reference criteria as bulk resistance of 13 $m{\Omega}cm$ and tensile strength of 515 kg/$cm^2$.

• Macromolecular Research
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• v.11 no.4
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• pp.267-272
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• 2003

The isothermal cure reactions of blends of epoxy (DGEBA, diglycidyl ether of bisphenol A)/anhydride resin with polyamide copolymer (poly(dimmer acid-co-alkyl polyamine)) or PEI were studied using differential scanning calorimetry (DSC). Rheological measurements have been made to investigate the viscosity and mechanical relaxation behavior of the blends. The reaction rate and the final cure conversion were decreased with increasing the amount of thermoplastics in the blends. Lower values of final cure conversions in the epoxy/thermoplastic blends indicate that thermoplastics hinder the cure reaction between the epoxy and the curing agent. Complete miscibility was observed in the uncured blends of epoxy/thermoplastics up to $120^{\circ}C$ but phase separations occurred in the early stages of the curing process at higher temperatures than $120^{\circ}C$. According to the rheological measurement results, a rise of G' and G" at the onset of phase separation is seen. A rise of G' and G" is not observed for neat epoxy system since no phase separation is seen during cure reaction. At the onset of phase separation the rheological behavior was influenced by the amount of thermoplastics in the epoxy/thermoplastic blends, and the onset of phase separation can be detected by rheological measurements.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.211-216
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• 2016

In several industrial fields, epoxy resin is widely used as an adhesive for co-curing and manufacturing various structures. Controlling the manufacturing process is required for ensuring robust bonding performance and the stability of the structures. A fiber optic sensor is suitable for the cure monitoring of epoxy resin owing to the thready shape of the sensor. In this paper, a fiber Bragg grating (FBG) sensor was applied for the cure monitoring of epoxy resin. Based on the experimental results, it was demonstrated that the FBG sensor can monitor the status of epoxy resin curing by measuring the strain caused by volume shrinkage and considering the compensation of temperature. In addition, two types of epoxy resin were used for the cure-monitoring; moreover, when compared to each other, it was found that the two types of epoxy had different cure-processes in terms of the change of strain during the curing. Therefore, the study proved that the FBG sensor is very profitable for the cure-monitoring of epoxy resin.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.41 no.12
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• pp.975-986
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• 2013

This paper dealt with the fabrication and performance evaluation of the electronics housing made of lightweight composite materials, aiming at the enhancement of satellite mass savings by replacing conventional aluminum alloy widely used for satellite avionics with lightweight composite material. For this purpose, a fabrication process was designed to overcome low machinability of CFRP and to minimize the post-treatment. The composite housing with grid-stiffened and monolithic frame was made using co-curing method. Its performance was also evaluated regarding endurance, stiffness, thermal conductivity, electrical grounding, EMI protection and radiation shielding. The composite housing can provide the considerable mass savings over the aluminum housing with same dimension.