• 폴리머
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• 제25권1호
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• pp.15-24
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• 2001

본 연구에서는 불포화 폴리에스테르 수지의 글리콜 몰비에 따른 경화거동을 실험하였다. 경화과정은 Tanaka 강체진자(rigid-body pendulum)형 점탄성 모델과 differential scanning calorimetry(DSC)법을 이용하였다. 강체진자의 회전축부에 수지막을 형성하여 자유진동을 시키면 수지막의 점탄성 변화에 응답하여 pendulum의 진동주기 T 및 대수 감쇄율 ${\Delta}$가 변화한다. Pendulum의 회전축부에 있어서의 수지막의 역학적인 응답을 pendulum의 진동 운동으로 취급하고 T 및 ${\Delta}$를 이용, 수지막의 dynamic modulus(E') 및 modulus loss(E')을 구하는 계산식을 만들었다. 이 측정법과 계산식을 이용하여 불포화 폴리에스테르 수지의 경화과정에 있어서의 점탄성 변화를 추적하여 수지막의 경화성의 차이를 알 수 있었다. Neopentyl glycol(NPG)의 몰비가 증가할수록 진동주기의 감소폭 기울기에 의한 경화반응속도가 느리고, damping 값에 의한 점도값의 상승속도가 감소하는 경화거동을 고찰하였다.

• 한국산학기술학회논문지
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• 제17권2호
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• pp.15-20
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• 2016

좁은 면적을 단기간에 개량시킬 수 있는 장점이 있는 그라우팅 공법은 지반의 특성과 지하수위 등에 따라 주입 효과의 차이가 있다. 특히 투수성이 큰 지반에서는 시간 경과에 따라서 용탈현상이 발생하여 강도저하 및 차수 성능이 저하되어 품질에 문제가 생길 수 있다. 최근 이와 같은 문제점을 해결하기 위해 초기강도 확보 및 용탈 방지와 동시에 균열 자기치유 특성을 가지는 SSG가 개발되었다. 이 연구에서는 두 가지 양생조건에 대해 SSG의 일축압축강도 시험을 수행하여 양생기간에 따른 일축압축 강도를 파악하였다. 또한 SSG와 기존의 LW 및 SGR의 일축압축강도와 비교하였다. 연구 결과, SSG가 상온 양생 및 저온 양생 모두에서 강도가 크게 측정되었으며, 초기 강도도 상대적으로 매우 우수한 것으로 나타났다.

• 한국기계가공학회지
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• 제16권6호
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• pp.81-86
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• 2017

The high-pressure resin transfer molding (HP-RTM) process has a very effective for the mass production of carbon fiber reinforced plastic (CFRP) for light weight in the automotive industry. In developing robust equipment, new process and fast cure matrix systems reduces significantly the cycle time less than 5 minutes in recent years. This paper describes the cavity pressure, temperature and molding characteristics of the HP-RTM process. The HP-RTM mold was equipped with two cavity pressure sensors and three temperature sensors. The cavity pressure characteristics of the HP-RTM injection, pressurization, and curing processes were studied. This experiment was conducted with selected process parameters such as mold cap size, maximum press force, and injection volume. Consequently, this monitoring method provides correlations between the selected process parameters and final forming characteristics in this work.

• 한국정밀공학회지
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• 제33권2호
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• pp.149-155
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• 2016

In this study, we investigated the adhesive strength by molecular weight, mixture ratio, coating thickness, lamination temperature and aging condition of adhesive in manufacture process of Nylon-Aluminum for secondary aluminum pouch. It found that as the molecular weight of adhesive gets lower, the adhesive strength increases. In the mixture ratio, as the content of hardener get higher and as the content of solvent get lower, the adhesive strength increases. Also, as the coating thickness of adhesive get thicker, the adhesive strength increase. In addition, the adhesive strength is higher at 90 degrees of lamination temperature. So, it found that 90 degrees of lamination temperature is appropriate. In the aging condition when aged for 5 days, it found that the reaction and curing of adhesive is sufficient by measuring the adhesive strength.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.352.2-352.2
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• 2014

In this present work, we report a Cu-Mn alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between Mn-based interlayer interlayer, thermal stability was measured with various low-k dielectrics. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the Mn based self-formed barriers after annealing were determined by the C concentration in the dielectric layers.

• Elastomers and Composites
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• 제55권1호
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• pp.6-12
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• 2020

Poly(ethylene-co-vinyl acetate) compounds and vulcanizates containing dicumyl peroxide (DCP) (HD) were prepared, and the curing agent and reaction products were analyzed using gas chromatography/mass spectrometry (GC/MS). Samples containing trially cyanurate (TAC) and DCP (HDT) were also prepared and analyzed. Some raw DCP were decomposed in the injector region of GC to produce acetophenone. DCP was detected in the HD compound but was not observed in the HD vulcanizate, and instead acetophenone and 2-phenyl-2-propanol were detected. Both DCP and TAC were observed in the HDT compound but not in the HDT vulcanizate, where acetophenone and 2-phenyl-2-propanol were detected. Thus, some of the DCP decomposed during the compounding process. The formation mechanism for acetophenone and 2-phenyl-2-propanol during the crosslinking reaction was identified, and differences in the crosslinking reactions of HD and HDT compounds were discussed.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2020년도 봄 학술논문 발표대회
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• pp.71-72
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• 2020

γ-dicalcium silicate (γ-C2S) is characterized by its strong carbonation reactivity and has the prospect to be utilized as a building material with the added benefit of CO2 capture. This paper aims to point out the impact of γ-C2S on the microstructure characteristics and mechanical properties of GGBFS paste, and mortar samples. Three curing conditions including un-carbonation, natural carbonation, and accelerated carbonation were applied to the research. Besides, hydration products after the carbonation process are also detected. What's more, the carbonation treatment method also meets the requirement of capture more greenhouse gas and recycles the waste products of metallurgy.

• 한국세라믹학회지
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• 제48권2호
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• pp.141-146
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• 2011

Successful coating of high quality glassy carbon is introduced by applying high pressure during the curing process of dip-coated phenol resin on graphite. The dependence of the applied pressure on the quality of the glassy carbon layer has not been reported so far. Pressure was changed from 0 to 400 psi during curing at $200^{\circ}C$. After carbonized at $1100^{\circ}C$ in inert atmosphere for the 400 psicured sample, as a promising result, a thick (~ 3 mm) and smooth glassy carbon layer could be obtained without any breakage, and the yield of carbonization was remarkably increased. It is believed that the cross-linking of resins results in decreasing volatile contents and, thus, increasing the yield of the glassy carbon. The origin of the improvement is discussed on the basis of several analytical results including FE-SEM, FT-IT and Raman spectrum.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.214.2-214.2
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• 2013

Device performance for the 45 and 32 nm node CMOS technology requires the integration of ultralow-k materials. To lower the dielectric constant for PECVD and spin-on materials, partial replacement of the solid network with air (k=1.01) appears to be more intuitive and direct option. This can be achieved introducting of second "labile" phase during depositoin that is removed during a subsequent UV curing and annealing step. Besides, with shrinking line dimensions the resistivity of barrier films cannot meet the International Technology Roadmap for Semiconductors (ITRS) requirements. To solve this issue self-forming diffusion barriers have drawn attention for great potential technique in meeting all ITRS requirments. In this present work, we report a Cu-V alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between V-based interlayer on low-k dielectric with UV curing and interlayer on low-k dielectric without UV curing, thermal stability was measured with various heat treatment temperature. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the V based self-formed barriers after annealing were strongly dominated by the O concentration in the dielectric layers.

• Composites Research
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• 제34권5호
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• pp.269-276
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• 2021

프리프레그 압축성형(PCM, Prepreg Compression Molding) 공정은 고품질 CFRP(Carbon Fiber Reinforced Plastic) 제품을 제조할 수 있는 고속성형기술이다. 오토클레이브 공정에 비해 폐기물 발생이 적고 사이클타임을 크게 줄일 수 있어 항공우주 및 자동차 산업에서 다양한 연구가 진행되고 있다. 본 연구에서는 PCM 공정의 품질을 높이기 위해 프리프레그의 경화거동을 따라 프레스의 압축압력을 단계별로 증가시키는 성형법에 대해 연구하였고, 이러한 다단 압축 성형법이 우수한 품질의 CFRP 제품을 생산하고 사이클타임을 단축할 수 있는 좋은 수단임을 확인하였다. 그리고 상온에서 적층한 프리프레그를 금형에 투입하여 예열과 성형을 동시에 함으로써 별도의 예열 공정 없이 제품을 성형할 수 있었다. 또한 평판 성형에 최적화된 공정조건을 3차원 형상물에 동일하게 적용한 결과 외관상 평판과 유사한 제품을 공정조건 수립 과정 없이 만들 수 있었다.