• Title/Summary/Keyword: Cleaning Method

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Cleaning Methods to Effectively Remove Peanut Allergens from Food Facilities or Utensil Surfaces (식품 시설 또는 조리도구 표면에서 땅콩 알레르겐을 효과적으로 제거하는 세척 방법)

  • Sol-A Kim;Jeong-Eun Lee;Jaemin Shin;Won-Bo Shim
    • Journal of Food Hygiene and Safety
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    • v.38 no.4
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    • pp.228-235
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    • 2023
  • Peanut is a well-known food allergen that causes adverse reactions ranging from mild urticaria to life-threatening anaphylaxis. Consumers suffering from peanut allergies should thus avoid consuming undeclared peanuts in processed foods. Therefore, effective cleaning methods are needed to remove food allergens from manufacturing facilities. To address this, wet cleaning methods with washing water at different temperatures, abstergents (peracetic acid, sodium bicarbonate, dilute sodium hypochlorite, detergent), and cleaning tools (brush, sponge, paper towel, and cotton) were investigated to remove peanuts from materials used in food manufacture, including plastics, wood, glass, and stainless steel. Peanut butter was coated on the surface of the glass, wood, stainless steel, and plastic for 30 min and cleaned using wet cleaning. The peanut residue on the cleaned surfaces was swabbed and determined using an optimized enzyme-linked immunosorbent assay (ELISA). Cleaning using a brush and hot water above 50℃ showed an effective reduction of peanut residue from the surface. However, removing peanuts from wooden surfaces was complicated. These results provide information for selecting appropriate materials in food manufacturing facilities and cleaning methods to remove food allergens. Additionally, the cleaning methods developed in this study can be applied to further research on removing other food allergens.

A new scheme for finding the biggest rectangle that doesn't have any obstacle (장애물을 제외한 가장 큰 공간을 찾는 기법)

  • Hwang, Jung-Hwan;Jeon, Heung-Seok
    • The KIPS Transactions:PartA
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    • v.18A no.2
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    • pp.75-80
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    • 2011
  • Recently, many cleaning robots have been made with various algorithms for efficient cleaning. One of them is a DmaxCoverage algorithm which efficiently clean for the situation when the robot has a time limit. This algorithm uses Rectangle Tiling method for finding the biggest rectangle that doesn't have any obstacle. When the robot uses grid map, Rectangle Tiling method can find the optimal value. Rectangle Tiling method is to find all of the rectangles in the grid map. But when the grid map is big, it has a problem that spends a lot of times because of the large numbers of rectangles. In this paper, we propose Four Direction Rectangle Scanning(FDRS) method that has similar accuracy but faster than Rectangle Tiling method. FDRS method is not to find all of the rectangle, but to search the obstacle's all directions. We will show the FDRS method's performance by comparing of FDRS and Rectangle Tiling methods.

Silicon Intrinsic Gettering Technology: Understanding and Practice (실리콘 Intrinsic Gettering 기술의 이해와 응용)

  • Choe Kwang Su
    • Korean Journal of Materials Research
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    • v.14 no.1
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    • pp.9-12
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    • 2004
  • Metallic impurities, such as Fe, Cu, and Au, become generation and recombination centers for minority carriers when combined with oxide precipitates or silicon self-interstitial clusters. As these centers may cause leakage and discharge in silicon devices, their prevention through gettering of the metallic impurities is an important issue. In this article, key aspects of intrinsic gettering, such as oxygen control, wafer cleaning, device area denudation, and bulk oxygen precipitation are discussed, and a practical method of implementing intrinsic gettering is outlined.

Study on the efficiency of cleaning Process for Screen printing cleaning (스크린 인쇄 세정에 대한 세정공정 효율 연구)

  • 최성용
    • Journal of the Korean Graphic Arts Communication Society
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    • v.15 no.1
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    • pp.85-96
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    • 1997
  • The color difference between original and printed copy is affected mainly by ink trapping and optical properties of overprinted ink layer. Since the general expression itself about ink trapping is affected also by the optical properties, the analysis of color difference using the ink trapping only cannot be certain. This study will show a new approaching method for optical analysis of spectral reflectance and the effect of printing sequence on color difference in multi-color overprints under the condition of excluding completely the ink trapping problems by means of using transparent film as a substrate.

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The Fermemtation Control of Kimch (김치의 숙도조절)

  • 김미정;김순동
    • Journal of the East Asian Society of Dietary Life
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    • v.4 no.2
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    • pp.75-91
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    • 1994
  • As a part of the fermentation control scheme for the preservation and improvement of the quality of Kimch, this paper summerizes a result of the research into the cleaning method of materials, the fermentation of Kimch using cleaning materials, the search of lacticacidbacteria for starter, the seperation state of cell wall by starter, the fermentation of Kimchi in the airtight instrument and in the air controlled state. And it shows the influence on the growth of lacticacidbacteria when the herb-medicine is used as a sub-ingredients, and the effects on the quality of ginseng added Kimchi.

Development of Environmentally Friendly Aqueous Cleanser by Emulsification of D-Limonene (D-Limonene 유화공정에 의한 환경친화성 수성세정제 개발)

  • Kim, Min-Hee;Kim, Si-Young;Jeong, Kap-Seop;Ju, Chang-Sik
    • Journal of Environmental Science International
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    • v.16 no.8
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    • pp.873-879
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    • 2007
  • For the purpose of development of an environmentally friendly aqueous cleanser, some experimental researches on emulsification of D-limonene were performed. OA series surfactants with different molecular weight were adapted as an emulsifier for preparation of O/W emulsion. Cleaning power of aqueous cleanser was measured by a dipping method adapting abietic acid(AA) as a solubilizate. Besides, drop size and drop size distribution, contact angle and storage stability of the aqueous cleansers were also measured and relationships among them were examined. Decrease in molecular weight of surfactant induced small drop size and contact angie, resulting in high cleaning power of aqueous cleanser. Aqueous cleanser consisted of 3wt.% OA300 and 30wt.% D-limonene showed the highest cleaning power, but displayed unfortunately with low storage stability. The storage stability of the aqueous cleanser with OA300 was significantly enhanced by addition of 0.5wt.% OA600 at the expanse of decrease in cleaning power.

Study on Measurement of Wafer Processing Throughput and Sequence Simulation of SWP(Single Wafer Process) Cleaning Equipment (매엽식 세정장비의 동작순서 시뮬레이션 및 웨이퍼 처리량 측정에 관한 연구)

  • Sun, Bok-Keun;Han, Kwang-Rok
    • Journal of the Institute of Electronics Engineers of Korea CI
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    • v.42 no.5
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    • pp.31-40
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    • 2005
  • In this study, we study measurement of wafer processing throughput and sequence simulation of single wafer type for wafer cleaning equipments that were used for etching, cleaning and polishing of wafer. Based on finite state machine, simulation model was built with identification of robot's status according to scheduling algorithm. Moreover, through performance of simulation as above, throughput per hour of cleaning equipment was measured. By the simulation method that are proposed in this paper, we could measure the wafer throughput per hour according to recipe and robot motion speed, and find optimal recipe and moving sequence of robot that maximize the throughput.

Study of Turbine Module Design for Die Casting Mold Release Injection Robot System (다이케스팅 이형재 분사 로봇시스템의 터빈 모듈 설계에 관한 연구)

  • Choi, Hyun-Jin;Son, Young-Bum;Park, Chul-Woo;Lee, Seung-Yong;Choi, Seong-Dae
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.5
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    • pp.1-7
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    • 2015
  • Cleaning by injecting dry ice and water is a generally adopted trend these days to clean molds (injection, diecasting foundry, press, rubber mold, etc). This cleaning method is performed manually, or by installing multiple high pressure spray nozzles. We have manufactured a turbine cleaning module device that is able to clean diecasting modules at any position and angle in the space by mounting an articulated robot instead of the existing pipe type injection nozzle, to minimize lead time and enhance working yield of the cleaning process. In this paper, we analyzed process factors that are required to design the turbine module by reviewing number of revolution, and results according to different blade angles and thicknesses of the mold release injection turbine module, using computational fiuid dynamics (CFD).

Analysis of impingement mixing for coating in injection mold (사출금형 안에서 코팅을 위한 충돌혼합에 관한 해석)

  • Kim, Seul-Woo;Lee, Ho-Sang
    • Design & Manufacturing
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    • v.13 no.4
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    • pp.1-9
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    • 2019
  • In-mold Coating is a method that can simultaneously perform injection molding and surface coating in injection mold. The material used for coating is two-component polyurethane which is composed of polyol and isocyanate. L-type mixing head can be used to mix polyol and isocyanate uniformly, and inject them inside the mold cavity. The surface quality of the injection molded products by using in-mold coating depends on the mixing uniformity between main agent and hardener. In this study, flow analysis was performed to design a mixing head for uniform mixing of two-component polyurethane. Especially the effects of design parameters of mixing head on mixing uniformity and nozzle pressure were investigated. The parameters of mixing head were mixing chamber diameter, cleaning cylinder diameter, nozzle alignment angle in the horizontal and vertical direction, and cleaning piston position. It was found that optimal design values were mixing chamber diameter of 3.5 mm, cleaning cylinder diameter of 5.0 mm, nozzle horizontal/vertical alignment angles of 140°/160°, and cleaning piston position of 1.8 mm. The optimal values would be used to develop a two-component mixing head achieving an uniform mixing for in-mold coating.

A Study on the Fluxless Bonding of Si-wafer/Solder/Glass Substrate (Si 웨이퍼/솔더/유리기판의 무플럭스 접합에 관한 연구)

  • ;;;N.N. Ekere
    • Journal of Welding and Joining
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    • v.19 no.3
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    • pp.305-310
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    • 2001
  • UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

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