• 전기전자학회논문지
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• 제25권1호
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• pp.180-192
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• 2021

이미지 인식 및 패턴 감지를 위해 널리 사용되는 알고리즘 중 하나는 convolution neural network(CNN)이다. CNN에서 대부분의 연산량을 차지하는 convolution 연산을 효율적으로 처리하기 위해 외부 하드웨어 가속기를 사용하여 CNN 어플리케이션의 성능을 향상 시킬 수 있다. 이러한 하드웨어 가속기를 사용함에 있어서 CNN은 막대한 연산량을 처리하기 위해 오프칩 DRAM에서 가속기 내부의 메모리로 데이터를 갖고 와야 한다. 즉 오프칩 DRAM과 가속기 내부의 온칩 메모리 혹은 글로벌 버퍼 사이의 데이터 통신이 CNN 어플리케이션의 성능에 큰 영향을 끼친다. 본 논문에서는 CNN 가속기 내의 온칩 메모리 혹은 글로벌 버퍼의 크기에 따른 주메모리 혹은 DRAM으로의 접근 횟수를 추산할 수 있는 시뮬레이터를 개발하였다. CNN 아키텍처 중 하나인 AlexNet에서, CNN 가속기 내부의 글로벌 버퍼의 크기를 증가시키면서 시뮬레이션 했을 때, 글로벌 버퍼 크기가 100kB 이상인 경우가 100kB 미만인 경우보다 가속기 내부와 오프칩 DRAM 간의 접근 횟수가 0.8배 낮은 것을 확인 했다.

• Journal of the Korean Wood Science and Technology
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• 제43권2호
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• pp.186-195
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• 2015

This study aims at modeling the rotary drying of wood chips in co-current mode and estimating the drying time of larch (Larix kaemferi) wood chip. Drying data were obtained in a lab. scale fixed bed dryer operating with an air velocity of 1 m/sec. and at hot air inlet temperatures of $100^{\circ}C$, $200^{\circ}C$, and $300^{\circ}C$. The lab. scale fixed-bed drying rates for small, medium and large size larch wood chips that had been dried from 40% wet-based moisture content (MC) to 10% MC at $200^{\circ}C$ drying temperature were 17.3 %/min., 10.2 %/min. and 5.5 %/min., respectively. It was predicted that larch large size wood chips could be dried from 40% MC to 10% MC in about 23.0, 34.6, and 44.7 minutes at $300^{\circ}C$, $200^{\circ}C$ and $150^{\circ}C$, respectively. Expected drying times for medium size chips were about 8.6, 11.2 and 13.2 minutes and those for small size chips were 4.3, 5.5 and 6.4 minutes, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.854-857
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• 2005

We developed new circuit architecture for reducing the power consumption and chip-size of driver ICs. In this paper we describe a new drive scheme, based on the concept of time -sharing output and optimal circuit design based on color resolution. In case of 132 x 176-pixel class, we used only 8 O p-A mps for a 262-k color display.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 ITC-CSCC -2
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• pp.782-785
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• 2002

Power amplifier of wireless communication tranceiver can be effectually controlled output power. And small size and low power dissipation are indispensable to portable system. In this paper, to reduce the size of portable tranceiver, inductor is integrated in a single chip. And to reduce power dissipation, a power amplifier that can be digitally controlled output power, is proposed and designed.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.193-215
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• 2003

Fracture Mechanism of Flip Chip Electromigration Failure - Mostly caused by Cathode Depletion at the UBM/Solder Interface Guideline to Increase Electromigration Resistance Material Selection: Sn/Ag(/Cu) > Pb/63Sn Cu UBM > Ni UBM (but, Solder Material combination) UBM Design: thick UBM is preferable (but, Stress Issue) Pad open/UBM size: as large as possible (but, pad size & pitch limit)

• 한국통신학회논문지
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• 제22권8호
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• pp.1733-1739
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• 1997

An ultra-compact milimeter-wave broadband MMIC amplifier was designed using a direct-coupled topology combined with optimum feedback design. Significant reductionin the chip size was possible by employing the direct-coupled topology. Bias resistors required for the direct-coupled topology were also used as feedback elements. Feedback was optimized for millimeter-wave frequencies using reactive elements. The fabricated MMIC amplifier was realized in a chip size of 0.8mm$^{[-992]}$ and showed gains higher than 8 dB from 12 to 44 GHz. An output power of 30mW was achieved at 44 GHz with a drain efficiency of 10%.

• Elastomers and Composites
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• 제58권2호
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• pp.87-94
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• 2023

Abrasion tests of an SBR compound were conducted using four different types of abrasion testers (cut and chip, Lambourn, DIN, and LAT100). The abrasion test results were analyzed in terms of size distributions and morphologies of the wear particles. Most wear particles were larger than 1000 ㎛. The wear particle size distributions tended to decrease as the particle size decreased. Except for the Lambourn abrasion test, the wear particles smaller than 212 ㎛ were rarely generated by the other three abrasion tests, implying that small wear particles were produced through friction by introducing talc powder. Shapes of the wear particles varied depending on the abrasion testers. The wear particles generated from the Lambourn abrasion tester had stick-like shapes. The cut and chip abrasion test showed a clear abrasion pattern, but the DIN abrasion test did not show any specific abrasion pattern. The Lambourn and LAT100 abrasion tests showed irregular abrasion patterns.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1663-1667
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• 2003

This thesis is on tile development of LD(Laser Diode) chip tester and the control system based on graphical programming language(LabVIEW) to control the equipment. The LD chip tester is used to test the optic power and the optic spectrum of the LD Chip. The emitter size of LD chip and the diameter of the receiver(optic fiber) are very small. Therefore, in order to test each chip precisely, this tester needs high accuracy. However each motion part of the tester could not accomplish hish accuracy due to the limit of the mechanical performance. Hence. an image processing with machine vision was carried out in order to compensate for the error. and also a load test was carried out so as to reduce tile impact of load on chip while the probing motion device is working. The obtained results were within ${\pm}$5$\mu\textrm{m}$ error.

• 대한전자공학회논문지TC
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• 제41권5호
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• pp.47-52
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• 2004

본 논문에서는 Blluetooth 주파수 대역 2.402∼2.4800㎓에서 동작하는 마이크로 칩 안테나를 제작하였다. 안테나는 54㎜×19㎜×0.8㎜의 bluetooth PCB 크기와 11㎜×4㎜×1.6㎜의 칩 크기를 갖는다. 설계 제작된 Bluetooth용 칩 안테나는 2.45㎓의 중심주파수에서 10.71%의 대역폭을 갖고, 임의의 급전점 변화에 따라 대역폭과 공진주파수의 변화를 보였다. 또한, 칩안테나의 측정된 방사패턴에서 E-면과 H-면을 비교 분석하였다.

• 전기학회논문지
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• 제58권1호
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.