• Journal of the Korean institute of surface engineering
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• v.43 no.3
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• pp.142-147
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• 2010

We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.4
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• pp.147-153
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• 2012

The demands of the large scale machine tools, for instance, such as planomiller, turning machine, boring machine, NC machine, have been gradually increased in recent years. As the performances of machine tools and/or cutting tools are advanced, it is possible to perform high-speed and high-precision cutting works. The effective treatment of wet chip, which is discharged from cutting works, becomes very important problems. Therefore, this study is forced on the design of large scale machine tools using CATIA V5R18 and analysis of cutter, which is considered as essential equipment in large scale machine tools, using MSC.Nastran & MSC.Patran. Especially, the relations between tolerated load of cutter, driving horse power and rpm of driving shaft in chip processing system are investigated through analysis. As the results, the reliability of design could be improved by evaluating simulated numerical values, it showed that tolerated loads of supported part and edged part of cutter are 87,000N and 14,450N, respectively.

• Clean Technology
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• v.17 no.1
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• pp.25-30
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• 2011

This study presents a fabrication method of cell-chip using aqueous solution based surface modification. The applications of cell-chip have potential for fundamental study of genetics, cell biology as well as cancer diagnostics and treatment. Conventional methods for fabrication of cell-chip have been limited in economic loss and environmental pollution because of the use of harsh organic solvent, complex process of silicon technology, and expensive equipment. In order to fabricate cell chip, we have proposed simple and eco-friendly process combined polyelectrolyte multilayer coating with microcontact printing. For the proof of concept, the cell chip can be applied to analyze the different expression of cell surface glycans and derivatives between cancer and normal cells. Our proposed method is useful technique for the application of novel cancer diagnostics and basic medical engineering.

• Journal of the Korean Ceramic Society
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• v.36 no.6
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• pp.583-589
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• 1999

In the fabrication of ceramic chip couples for high frequency application such as the mobile communication equipment the formation of electrode lines and Ag diffusion were investigated with heat treatment conditions for removing organic binders. The deformation and densification of the electrode line greatly depended on the binder burnout process due to the overlapped temperature zone near 400$^{\circ}C$ of the binder dissociation and the solid phase sintering of the silver electrode. Ag ions were diffused into the glass ceramic substrate. The Ag diffusion was led by the glassy phase containing Pb ions rather than by the crystalline phase containing Ca ions. The fact suggests that the Ag diffusion could be controlled by managing the composition of the glass ceramic substrate.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.3
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• pp.16-23
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• 2017

For most machine tools, it is necessary to remove chips and coolant oil because it they will continue to be created during the manufacture of workpieces. Existing products that are in use are installed and used as they reflect depending on the characteristics of each device separately. This study proposes a method to remove the security chip as well as developing an integrated system capable of reducing coolant damage. The Leverage AutoCAD and CATIA program was used for 2D and 3D design, shapes were identified by utilizing the KeyShot program, and the load and displacement analysis of the development apparatus was performed utilizing the ANSYS program. After the prototype underwent sufficient design review, the mixed oil separation device had a complete sensor control program using the LabVIEW program. The chip design process for transferring experiments and experiments on the mixed oil cooling device were developed for performance tests of the product. The final product resulted in an increase in space utilization during commercialization, reduced installation costs, and caused social effects such as pulmonary flow reduction, which, through the economic costs, reduces pollution, resulting in various benefits to the industry, such as deceased errors in the workplace decreases.

• ETRI Journal
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• v.35 no.6
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.53-59
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• 2009

Low pressure mercury lamp type UV equipments have been widely used for cleaning and modification of PCB surfaces. To enhance the productivity of the process, we newly developed remote DBD type atmospheric pressure plasma equipment. The productivity of both equipments could be compared by measuring surface contact angle for various transferring speed. By the result of the measurement, we could verify that the productivity of the atmospheric pressure plasma be superior to the productivity of the UV equipment. XPS experiments confirmed that the surface effect of the UV and atmospheric pressure plasma processing are similar for each other. Organic contamination level was reduced after the processing and some surface elements were oxidized for both cases. Finally, the atmospheric pressure plasma equipment was adapted to flip chip BGA's flux printing process and it was concluded that the printing uniformity be enhanced by the atmospheric pressure plasma surface treatment.

• IEIE Transactions on Smart Processing and Computing
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• v.3 no.5
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• pp.331-337
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• 2014

Ge is becoming an increasingly popular semiconductor material with high Si compatibility for on-chip optical interconnect technology. For a better manifestation of the meritorious material properties of Ge, its surface treatment should be performed satisfactorily before the electronic and photonic components are fabricated. Ex-situ rapid thermal annealing (RTA) processes with different gases were carried out to examine the effects of the annealing gases on the thin-film quality of Ge grown epitaxially on Si substrates. The Ge-on-Si samples were prepared in different structures using the same equipment, reduced-pressure chemical vapor deposition (RPCVD), and the samples annealed in $N_2$, forming gas (FG), and $O_2$ were compared with the unannealed (deposited and only cleaned) samples to confirm the improvements in Ge quality. To evaluate the thin-film quality, room-temperature photoluminescence (PL) measurements were performed. Among the compared samples, the $O_2$-annealed samples showed the strongest PL signals, regardless of the sample structures, which shows that ex-situ RTA in the $O_2$ environment would be an effective technique for the surface treatment of Ge in fabricating Ge devices for optical computing systems.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.2
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• pp.92-97
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• 2002

One of the important roles of a DNA chip is the capability of detecting genetic diseases and mutations by analyzing DNA sequence. For a successful electrochemical genotyping, several aspects should be considered including the chemical treatment of electrode surface, DNA immobilization on electrode, hybridization, choice of an intercalator to be selectively bound to double standee DNA, and an equipment for detecting and analyzing the output signal. Au was used as the electrode material, 2-mercaptoethanol was used for linking DNA to Au electrode, and methylene blue was used as an indicator that can be bound to a double stranded DNA selectively. From the analysis of reductive current of this indicator that was bound to a double stranded DNA on an electrode, a normal double stranded DNA was able to be distinguished from a single stranded DNA in just a few seconds. Also, it was found that the peak reduction current of indicator is proportional to the concentration of target DNA to be hybridized with probe DNA. Therefore, it is possible to realize a sim71e and cheats DNA sensor using the electrochemical measurement for genotyping.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.