• Title/Summary/Keyword: Chip Shape

Search Result 233, Processing Time 0.028 seconds

Formation of high uniformity solder bump for wafer level package by tilted electrode ring (경사진 전극링에 의한 웨이퍼레벨패키지용 고균일도의 솔더범프 형성)

  • Ju, Chul-Won;Lee, Kyung-Ho;Min, Byoung-Gue;Kim, Seong-Il;Lee, Jong-Min;Kang, Young-Il;Han, Byung-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2003.07a
    • /
    • pp.366-369
    • /
    • 2003
  • The vertical fountain plating system with the point contact has been used in semiconductor industry. But the plating shape in the opening of photoresist becomes gradated shape, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. So, we designed the tilted electrode ring contact to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha$-step. A photoresist was coated to a thickness of $60{\mu}m$ and vias were patterned by a contact aligner After via opening, solder layer was electroplated using the fountain plating system and the tilted electrode ring contact system. In $\alpha$-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were ${\pm}16%,\;{\pm}3.7%$ respectively. In this study, we could get high uniformity bumps by the tilted electrode ring contact system. So, tilted electrode ring contact system is expected to improve workability and yield in module process.

  • PDF

A Study on the Improvement of Performance of High Speed Cutting Tool using Magnetic Fluid Grinding Technique(A Performance Estimation of High Speed Cutting Tool) (자기연마기술을 이용한 고속절삭공구의 성능향상에 관한 연구 (고속절삭공구의 성능평가를 중심으로))

  • Cho J.R.;Yang S.C.;Jung Y.G.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.10a
    • /
    • pp.354-361
    • /
    • 2005
  • In high speed cutting process, due to the friction between the tool and workpiece, a temperature rise of contacting part is serious. It need to develop cutting tool for overcoming such a poor condition. So now, some studies, the optimization of tool shapes, the fine grains of tool material, multi-layer coating of tools are processing. If mirror finishing on the tool is processed, there is advantage of relation between chip and tool, because of less friction, and also tool's lift would be increased. As a result mirror like finishing is expected efficient enhancement of tool. Generally, it is too difficult to process by a general way for tools of complex shapes, it is required a new method to process such complex shape tools. The magnetic fluid polishing technique can polish the workpiece of complex shape, because the polishing method which polishes as compress the workpiece by the magnetism abrasives to arrange to the linear according to the line of magnetic force. In this paper, We polished the surface of the high speed cutting tool using the magnetic fluid polishing technique, to enhance the performance of the high speed cutting tool.

  • PDF

Various Pulse Forming of Pulsed $CO_2$ laser using Multi-pulse Superposition Technique

  • Chung, Hyun-Ju;Kim, Hee-Je
    • KIEE International Transactions on Electrophysics and Applications
    • /
    • v.11C no.4
    • /
    • pp.127-132
    • /
    • 2001
  • We describe the pulse forming of pulsed $CO_2$laser using multi-pulse superposition technique. A various pulse length, high duty cycle pulse forming network(PFN) is constructed by time sequence. That is, this study shows a technology that makes it possible to make various pulse shapes by turning on SCRs of three PFN modules consecutively at a desirable delay time with the aid of PIC one-chip microprocessor. The power supply for this experiment consists of three PFN modules. Each PFN module uses a capacitor, a pulse forming inductor, a SCR, a High voltage pulse transformer, and a bridge rectifier on each transformer secondary. The PFN modules operate at low voltage and drive the primary of HV pulse transformer. The secondary of the transformer has a full-wave rectifier, which passes the pulse energy to the load in a continuous sequence. We investigated laser pulse shape and duration as various trigger time intervals of SCRs among three PFN modules. As a result, we can obtain laser beam with various pulse shapes and durations from about 250 $mutextrm{s}$ to 600 $mutextrm{s}$.

  • PDF

A Small RFID Tag Antenna with Bandwidth-Enhanced Characteristic (대역폭 확장 특성을 갖는 소형 RFID 태그 안테나)

  • Lee Woo-Sung;Chang Ki-Hun;Yoon Young-Joong;Lee Byoung-Moo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.17 no.6 s.109
    • /
    • pp.511-518
    • /
    • 2006
  • In this paper, a small RFID tag antenna in UHF band which has bandwidth-enhanced characteristic is proposed. The shape of the proposed antenna is a meander antenna to have size-reduced characteristic, and it consists of two radiators which make dual resonance in adjacent frequency to enhance bandwidth. By adjusting length and location of each radiator, the proposed antenna can make dual resonance at arbitrary location on the Smith chart, which is able to make impedance matching with RFID tag chip in wide frequency range. And it is apparent that the proposed antenna can have bandwidth-enhanced characteristic according to the simulated and measured results.

Light Distribution Pattern of Optical System in Street Lights with AC COB-Type LEDs (AC COB형 LED 가로등의 광학계 배광 패턴)

  • Kim, Young-Gil;Yoo, Kyung-Sun;Lee, Chang-Soo;Hyun, Dong-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.26 no.1
    • /
    • pp.66-73
    • /
    • 2017
  • This study attempted to design lights with Type II distribution suitable for LED street lights based on the regulations of street light distribution developed by the Illuminating Engineering Society of North America (IESNA). The shape of an asymmetric lens, different from that of a rotationally symmetric lens, cannot be generated using a simple mathematical formula. In the first trial, the outline of the lens was fixed and simulated to confirm the distribution type. Following ISENA regulations, some problems that occurred during simulations and repeating was be modified that process is how we detected errors. Through optical research and simulations, a lens conforming to the regulations of Type II very short, Type II short, and Type II medium distributions was developed. A prototype was developed using simulation data and it was subjected to distribution tests. The results show that it can compare with property of Type II distribution.

Controlling a lamprey-based robot with an electronic nervous system

  • Westphal, A.;Rulkov, N.F.;Ayers, J.;Brady, D.;Hunt, M.
    • Smart Structures and Systems
    • /
    • v.8 no.1
    • /
    • pp.39-52
    • /
    • 2011
  • We are developing a biomimetic robot based on the Sea Lamprey. The robot consists of a cylindrical electronics bay propelled by an undulatory body axis. Shape memory alloy (SMA) actuators generate propagating flexion waves in five undulatory segments of a polyurethane strip. The behavior of the robot is controlled by an electronic nervous system (ENS) composed of networks of discrete-time map-based neurons and synapses that execute on a digital signal processing chip. Motor neuron action potentials gate power transistors that apply current to the SMA actuators. The ENS consists of a set of segmental central pattern generators (CPGs), modulated by layered command and coordinating neuron networks, that integrate input from exteroceptive sensors including a compass, accelerometers, inclinometers and a short baseline sonar array (SBA). The CPGs instantiate the 3-element hemi-segmental network model established from physiological studies. Anterior and posterior propagating pathways between CPGs mediate intersegmental coordination to generate flexion waves for forward and backward swimming. The command network mediates layered exteroceptive reflexes for homing, primary orientation, and impediment compensation. The SBA allows homing on a sonar beacon by indicating deviations in azimuth and inclination. Inclinometers actuate a bending segment between the hull and undulator to allow climb and dive. Accelerometers can distinguish collisions from impediment to allow compensatory reflexes. Modulatory commands mediate speed control and turning. A SBA communications interface is being developed to allow supervised reactive autonomy.

A Study on Jacquard Fabric Bags of Fashion Merchandise using Danchung Patterns (단청 문양을 활용한 자카드직물 가방 상품개발)

  • Song, Ha-Young
    • Journal of the Korea Fashion and Costume Design Association
    • /
    • v.11 no.3
    • /
    • pp.101-110
    • /
    • 2009
  • Danchung(丹靑) is the traditional Korean patterns that are decorated with various colorful patterned paintings upon each sections of wooden architecture. Although Danchung consists of variety patterns with the meaningful signs and symbols, as an accomplishment of Korean traditional images, there is a few fashion merchandise by Danchung patterns. Therefore, the purpose of this study is about to design Jacquard fabrics, and to develop bags of Jacquard fabric by Danchung patterns, as a differentiated cultural Fashion Merchandise. The theoretical background was researched for the geometric image of Danchung patterns on the basis of the basic elements, compositions and symbolic meanings of Danchung. The geometric image of Danchung patterns, which had the shape of circle, triangle, square and hexagon, was designed to the surface design by Jacquard CAD system(i.e., EAT Designscope by Germany) and woven into Jacquard fabrics by Stabuli electronic Jacquard system. Danchung patterns for fabric design in this study was mainly focused on 'ChipJaGum', 'SamJiChangGum', 'ShouSulGum', Moro patterns of lotus flower(蓮花), Rok-Wha(綠花) and so on. To development bags of jacquard fabric, those woven jacquard fabrics were manufactured to bags by applying the selected of twelve bag-designs among the current bag styles. These manufactured bags of jacquard fabrics in geometric Danchung patterns were appeared a contemporary yet ethnic feeling so that they can be used for the unique korean cultural products to further commercialization.

  • PDF

A MICRO FLUXGATE SENSOR IN PRINTED CIRCUIT BOARD (PCB) (인쇄회로 기판에 내장된 마이크로 플럭스게이트 센서)

  • 최원열;황준식;나경원;강명삼;최상언
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2002.07a
    • /
    • pp.151-155
    • /
    • 2002
  • This paper presents a micro fluxgate magnetic sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon with extremely high DC permeability of ∼100,000 and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3${\times}$5.7m㎡. Excellent linear response over the range of -100${\mu}$T to +100${\mu}$T is obtained with 540V/T sensitivity at excitation square wave of 3V$\_$P-P/ and 360kHz. The very low power consumption of ∼8mW was measured. This magnetic sensing element which measures the lower fields than 50${\mu}$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.

  • PDF

Embedded Micro Fluxgate Sensor in Printed Circuit Board (PCB) (PCB 기판에 내장된 마이크로 플럭스게이트 센서)

  • 최원열;황준식;강명삼;최상언
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.15 no.8
    • /
    • pp.702-707
    • /
    • 2002
  • This paper presents a micro fluxgate sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3$\times$5.7$\textrm{mm}^2$. Excellent linear response over the range of -100$\mu$T to +100$\mu$T is obtained with 540V/T sensitivity at excitation square wave of 3 $V_{p-p}$ and 360kHz. The very low power consumption of ~8mW was measured. This magnetic sensing element, which measures the lower fields than 50$\mu$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.h.

A Study on Improving the Efficiency of a Heat Dissipation Design for 30 W COB LED Light Source (30 W COB LED광원의 효율 개선을 위한 방열설계에 관한 연구)

  • Seo, BumSik;Lee, KiJoung;Cho, Young Seek;Park, Dae-Hee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.26 no.2
    • /
    • pp.158-163
    • /
    • 2013
  • In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.