• 제목/요약/키워드: Chip Form

검색결과 220건 처리시간 0.03초

밀링가공에서의 커더 런 아웃량 검출에 관한 연구 (A Study on the Detection of Cutter Runout Magnitude in Milling)

  • 황준;정의식;이기용;신승춘;남궁석
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.151-156
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    • 1995
  • This paper presents a methodology for real-time detecting and identifying the runout geometry of an end mill. Cutter runout is a common but undesirable phenomenon in multi-tooth machining such as end-milling process because it introduces variable chip loading to insert which results in a accelerated tool wear,amplification of force variation and hence enlargement vibration amplitude. Form understanding of chip load change kinematics, the analytical sutting force model was formulated as the angular domain convolution of three dynamic cutting force component functions. By virtue of the convolution integration property, the frequency domain expression of the total cutting forces can be given as the algebraic multiplication of the Fourier transforms of the local cutting forces and the chip width density of the cutter. Experimental study are presented to validata the analytical model. This study provides the in-process monitoring and compensation of dynamic cutter runout to improve machining tolerance tolerance and surface quality for industriql application.

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진단의학 도구로서의 DNA칩 (DNAchip as a Tool for Clinical Diagnostics)

  • 김철민;박희경
    • 한국지능시스템학회:학술대회논문집
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    • 한국퍼지및지능시스템학회 2004년도 춘계학술대회 학술발표 논문집 제14권 제1호
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    • pp.97-100
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    • 2004
  • The identification of the DNA structure as a double-stranded helix consting of two nucleotide chain molecules was a milestone in modern molecular biology. The DNA chip technology is based on reverse hybridization that follows the principle of complementary binding of double-stranded DNA. DNA chip can be described as the deposition of defined nucleic acid sequences, probes, on a solid substrate to form a regular array of elements that are available for hybridization to complementary nucleic acids, targets. DNA chips based on cDNA clons, oligonucleotides and genomic clons have been developed for gene expression studies, genetic variation analysis and genomic changes associated with disease including cancers and genetic diseases. DNA chips for gene expression profiling can be used for functional analysis in human eel Is and animal models, disease-related gene studies, assessment of gene therapy, assessment of genetically modified food, and research for drug discovery. DNA chips for genetic variation detection can be used for the detection of mutations or chromosomal abnormalities in cnacers, drug resistances in cancer cells or pathogenic microbes, histocompatibility analysis for transplantation, individual identification for forensic medicine, and detection and discrimination of pathogenic microbes. The DNA chip will be generalized as a useful tool in clinical diagnostics in near future. Lab-on-a chip and informatics will facilitate the development of a variety of DNA chips for diagnostic purpose.

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COB Line형 LED를 사용한 PAR 조명의 제작 (Manufacturing of PAR Illumination Using COB Line Type LEDs)

  • 윤갑석;유경선;이창수;현동훈
    • 한국생산제조학회지
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    • 제24권4호
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    • pp.448-454
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    • 2015
  • In this paper, the band structural design that is typically in a line was arranged in a ring shape, so as to configure the high power LED lighting in such a way as to form a concentrated light distribution angle of less than 15 degrees. The parabolic aluminized reflector PAR38 that facilitates design using area and the area of the optical system to the same extent, applied a multiple light-source condenser lens optical system for the control of integration. The LED used here implemented a single linear light source using ans LED module with ans LED, flip-chip chip-scale package. The optical system was designed based on the energy star standard.

이동통신 단말기에 이용되는 적층 칩 써미스터 제작 (The Fabrication of Mulilayer Chip NTC Thermistor for Mobile Communication Telephone)

  • 윤중락;이헌응;김지균;이석원
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 하계학술대회 논문집 C
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    • pp.1794-1796
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    • 2000
  • Oxides of the form $Mn_{3}O_4$-$Co_{3}O_4$-NiO present properties that make them useful as multilayer chip NTC thermistor for mobile communication telephone. When $Mn_{2}Ni_{x}CO_{1-x}O_4$ composition with the X = 0.12$\sim$0.24 at sintered temperature 1250$^{\circ}C$, resistivity and B-constant were 300$\sim$450[${\Omega}-cm$] and 3250$\sim$3450, respectively. Multilayer chip NTC(Negative Temperature Coefficient) resistor were fabricated with 4 layer by a conventional multilayer capacitor techniques, using 100 pd paste as internal electrode and $Mn_{2}Ni_{0.20}CO_{0.8}O_4$ composition as NTC materials. In particular, resistance change ratio (${\Delta}R$), the important factor for reliability, varied within $\pm$3%, indicating the compositions of multilayer chip NTC thermistor products could be available for mobile communication telephone.

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볼엔드밀 반구가공에서 가공 위치에 따른 절삭성 평가 (A Machinability test on the cutting position in the ball-end milling of hemisphere)

  • 박희범;김석원;이득우;김정석
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 춘계학술대회 논문집
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    • pp.890-893
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    • 2000
  • In this paper, the test of machinability according to the cutting positions when the ball end milling of hemispheric workpiece is carried out to find the optimum cutting position of free form surface die. Tool runout, cutting force. and chip form are measured. The results show that the optimum cutting condition to get the constant feed per tooth is the inclined angle of 40 degree of workpiece.

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머신비전에 의한 LED Chip Package 형광물질 토출형상 측정 (Measurement System for Phosphor Dispensing Shape of LED Chip Package Using Machine Vision)

  • 하석재;김종수;조명우;최종명
    • 한국산학기술학회논문지
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    • 제14권5호
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    • pp.2113-2120
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    • 2013
  • 본 연구는, LED 칩 패키지에 있는 토출된 형광체 수지의 모양을 인라인 측정을 통해 개발된 검사 시스템을 기초로 한 효율적인 머신 비전에 관한 연구이다. 형광체의 반투명 특성 때문에 조사된 빛이 칩의 표면뿐만 아니라 하단 부에서도 반사된다. 이러한 현상이 LED 칩 검사의 신뢰성을 저하시키기 때문에 적절한 조명 광학계를 결정하기 위해 백색광 LED 와 635nm의 레이저 슬릿 빛을 이용하여 검사하였다. 또한, 광 삼각측정법을 이용해 정반사와 분산반사법으로 검사를 수행하였다. 실험 결과 백색 슬릿 광과 정반사 반사법의 조합이 가장 좋은 검사 결과를 낸다는 것을 확인할 수 있었다. Catmull-Rom 스플라인 보간법을 이용하여 측정된 데이터를 부드러운 표면 형상으로 나타내었다. 측정 결과를 통해 개발된 시스템이 LED 칩 패키징 공정에 인라인 검사에 성공적으로 적용될 수 있다는 결론을 내릴 수 있다.

공정 단계에 따른 박형 Package-on-Package 상부 패키지의 Warpage 특성 분석 (Warpage Characteristics Analysis for Top Packages of Thin Package-on-Packages with Progress of Their Process Steps)

  • 박동현;정동명;오태성
    • 마이크로전자및패키징학회지
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    • 제21권2호
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    • pp.65-70
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    • 2014
  • 박형 package-on-package의 상부 패키지에 대하여 PCB 기판, 칩본딩 및 에폭시 몰딩과 같은 공정단계 진행에 따른 warpage 특성을 분석하였다. $100{\mu}m$ 두께의 박형 PCB 기판 자체에서 $136{\sim}214{\mu}m$ 범위의 warpage가 발생하였다. 이와 같은 PCB 기판에 $40{\mu}m$ 두께의 박형 Si 칩을 die attach film을 사용하여 실장한 시편은 PCB 기판의 warpage와 유사한 $89{\sim}194{\mu}m$의 warpage를 나타내었으나, 플립칩 공정으로 Si 칩을 PCB 기판에 실장한 시편은 PCB 기판과 큰 차이를 보이는 $-199{\sim}691{\mu}m$의 warpage를 나타내었다. 에폭시 몰딩한 패키지의 경우에는 DAF 실장한 시편은 $-79{\sim}202{\mu}m$, 플립칩 실장한 시편은 $-117{\sim}159{\mu}m$의 warpage를 나타내었다.

One-chip determinism multi-layer neural network on FPGA

  • Suematsu, Ryosuke;Shimizu, Ryosuke;Aoyama, Tomoo
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2002년도 ICCAS
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    • pp.89.4-89
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    • 2002
  • $\textbullet$ Field Programmable Gate Array $\textbullet$ flexible hardware $\textbullet$ neural network $\textbullet$ determinism learning $\textbullet$ multi-valued logic $\textbullet$ disjunctive normal form $\textbullet$ multi-dimensional exclusive OR

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이중-적분을 이용한 용량형 센서용 스위치드-캐패시터 인터페이스 (A Switched-Capacitor Interface Based on Dual-Slope Integration)

  • 정원섭;차형우;류승용
    • 대한전자공학회논문지
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    • 제26권11호
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    • pp.1666-1671
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    • 1989
  • A novel switched-capacitor circuit for interfacing capacitive microtransducers with a digital system is developed based on the dual-slope integration. It consists of a differential integrator and a comparator. Driven by the teo phase clock, the circuit first senses the capacitance difference between the transducer and the reference capacitor in the form of charge, and accumulates it into the feedback capabitor of the integrator for a fixed period of time. The resulant accumulated charge is next extracted by the known reference charge until the integrator output voltage refurns to zero. The length of time required for the integrator output to return to zero, as measured by the number of clock cycle gated into a counter is proportional to the capacitance difference, averaged over the integration period. The whole operation is insensitive to the reference voltage and the capacitor values involved in the circuit, Thus the proposed circuit permits an accurate differental capacitance measurement. An error analysis has showh that the resolution as high as 8 bits can be expected by realizing the circuit in a monolithic MOS IC form. Besides the accuracy, it features the small device count integrable onto a small chip area. The circuit is thus particularly suitadble for the on-chip interface.

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Development of wrinkled skin-on-a-chip (WSOC) by cyclic uniaxial stretching

  • Lim, Ho Yeong;Kim, Jaewon;Song, Hyun Jeong;Kim, Kyunghee;Choi, Kyung Chan;Park, Sungsu;Sung, Gun Yong
    • Journal of Industrial and Engineering Chemistry
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    • 제68권
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    • pp.238-245
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    • 2018
  • The skin experiences constant physical stimuli, such as stretching. Exposure to excessive physical stimuli stresses the skin and can accelerate aging. In this study, we applied a method that allowed human fibroblasts and keratinocytes to be perfused with media to form 3D skin equivalents that were then uniaxially 10%-stretched for 12 h per day (at either 0.01 or 0.05 Hz) for up to 7 days to form wrinkled skin-on-a-chip (WSOC). There was more wrinkling seen in skin equivalents under 0.01 Hz uniaxial stretching than there was for non-stretched skin equivalents. At 0.05 Hz, the stratum corneum almost disappeared from the skin equivalents, indicating that stretching was harmful for the epidermis. At both frequencies, the production of collagen and related proteins in the skin equivalents, such as fibronectin 10 and keratin, decreased more than those in the non-stretched equivalents, indicating that the dermis also suffered from the repeated tensile stress. These results suggest that WSOCs can be used to examine skin aging and as an in vitro tool to evaluate the efficacy of anti-wrinkle cosmetics and medicines.