• Design & Manufacturing
• /
• 제6권1호
• /
• pp.84-89
• /
• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• Journal of Advanced Marine Engineering and Technology
• /
• 제34권8호
• /
• pp.1100-1106
• /
• 2010

LED는 온도가 일정이상 올라가면 효율이 떨어지고 수명이 짧아지는 단점이 있다. 본 연구는 이러한 LED의 효율적인 온도제어에 대한 것이다. LED의 방열을 위해 방열판과 팬을 사용하고 시스템의 온도제어는 원칩 마이크로프로세서와 PID제어를 통해 원하는 온도를 제어할 수 있음을 실험을 통해 확인한다. 궁극적으로 팬을 냉각장치로 사용하고 이를 잘 제어하면 LED 시스템 구동전력의 약 2%만을 사용하여 적절한 조도와 온도를 유지하는 성능을 얻을 수 있음을 제어실험을 통해 확인하였다.

• 마이크로전자및패키징학회지
• /
• 제23권2호
• /
• pp.73-78
• /
• 2016

집적회로(Integrated Circuit) 소자의 트랜지스터(transistor) 밀도 증가는 소자에서 발생하는 열 방출(heat dissipation)의 급격한 상승을 초래하여 열 문제를 발생시키고, 이는 소자의 성능과 열적 신뢰성에 영향을 크게 미친다. 열문제의 해결방안 중 본 연구에서는 냉매를 이용한 액체 냉각방법을 연구하였으며, 실리콘 웨이퍼에 관통실리콘비아(through Si via)와 마이크로 채널(microchannel)을 딥 반응성 이온 애칭(deep reactive ion etching)로 구현한 후 유리기판과 어노딕본딩을 통하여 액체 냉각 구조를 제작하였다. 제작된 마이크로 채널 위에 Ag, Cu 또는 Cr/Au/Cu bump를 스크린프린팅(screen printing) 방법으로 형성하였고, 범프의 유무를 통해 액체 냉각 전후의 냉각 모듈의 실리콘 표면온도의 변화를 적외선현미경으로 분석하였다. Cr/Au/Cu bump가 탑재된 액체 냉각 모듈의 경우 가열온도 $200^{\circ}C$에서 냉각 전후의 실리콘 표면 온도 차이는 약 $45.2^{\circ}C$이고, 전력밀도 감소는 약 $2.8W/cm^2$ 이었다.

• 전자통신동향분석
• /
• 제38권6호
• /
• pp.41-51
• /
• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• 진공이야기
• /
• 제4권3호
• /
• pp.16-20
• /
• 2017

Graphene has emerged as a promising material for optoelectronic applications including as ultrafast and broadband photodetector, optical modulator, and nonlinear photonic devices. Graphene based devices have shown the feasibility of ultrafast signal processing for required for photonic integrated circuits. However, on-chip monolithic nanoscale light source has remained challenges. Graphene's high current density, thermal stability, low heat capacity and non-equilibrium of electron and lattice temperature properties suggest that graphene as promising thermal light source. Early efforts showed infrared thermal radiation from substrate supported graphene device, with temperature limited due to significant cooling to substrate. The recent demonstration of bright visible light emission from suspended graphene achieve temperature up to ~3000 K and increase efficiency by reducing the heat dissipation and electron scattering. The world's thinnest graphene light source provides a promising path for on-chip light source for optical communication and next-generation display module.

• 천문학논총
• /
• 제18권1호
• /
• pp.69-74
• /
• 2003

A CCD camera for the BOES (Bohyunsan Observatory Echelle Spectrograph) has been developed. The camera consists of a 2048 ${\times}$ 4096 format CCD, a SDSU Gen-I CCD controller, and a continuous flow cryostat (CFC) designed by the ESO. In order to control the CCD under SDSU Gen-I controller, the voltage level of all the biases and clocks were lowered by -6V. The CFC showed cooling time of about 10 hour, after which the chip temperature settled down with variation less than ${\pm}1^{\circ}C$. The final chip temperature is around -105$^{\circ}C$ with the setting value for the CFC as -170$^{\circ}C$.

• 대한전자공학회논문지
• /
• 제24권6호
• /
• pp.1068-1073
• /
• 1987

Traditional circuit partitioning algorithm using the cluster development method, which is suitable for such applications as single chip floor planning or multiple layer PCB system placement, where the clusters are formed so that inter-cluster nets are localized within the I/O connector pins, may not be appropriate for the functiona block placement in truly 3-D electronic modules. 3-D hybrid IC is one such example where the inter-layer routing as well as the intra-layer routing can be maximally incorporated to reduce the overall circuit size, cooling requirements and to improve the speed performance. In this paper, we propose a new algorithm called MBE(Minimum Box Embedding) for the layer assignment of each functional block in 3-D hybrid IC design. The sequence of MBE is as follows` i) force-directed relaxation in 3-D space, ii) exhaustive search for the optimal orientation of the slicing plane and iii) layer assignment. The algorithm is first explaines for a 2-D reduced problem, and then extended for 3-D applications. An example result for a circuit consisting of 80 blocks has been shown.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2006년도 춘계학술대회 논문집
• /
• pp.443-444
• /
• 2006

The influence of the heat sources on LED junction temperature are Engine room air, Back plate, Electric power device, and so on. LED lamp cooling system is considered to be an important subject fur high light efficiency. Because LED Chip will be problem When LED junction temperature be over $135^{\circ}C$, In this Study, The Looped Heat Pipe System is considered to prevent LED Chip fall. The LHPS is consist of evaporator part, condenser part, heat pipe part. The working fluid of LHPS is HCFC-123. In this study, to prevent LED Chipfall, we study thermal characteristics for Looped Heat Pipe System with LED lamp.

• Journal of Chest Surgery
• /
• 제21권2호
• /
• pp.231-239
• /
• 1988

Currently numerous methods are in use for myocardial hypothermia as a myocardial preservation modality for cardiac operation. During cardiac ischemia after crystalloid cardioplegia[4C GIK solution], topical cold saline[Group I, a=9], topical ice slush[Group II, n=9] and topical ice chip[Group III, a=10] have been compared for myocardial surface cooling in the isolated rat heart model of cardiopulmonary bypass. During postischemic period, hemodynamic functions[aortic flow, coronary flow, peak aortic pressure and heart rate], biochemical enzymatic activities and cellular injuries with electron microscope were evaluated in this isolated rat heart perfusion model. Postischemic aortic flow, cardiac output and peak aortic pressure in Group I and Group II recovered better than Group III.[p< 0.05] Postischemic creatine kinase and lactate dehydrogenase leakages in Group II and Group III increased more than Group l and postischemic mitochondrial swelling in Group III was more severe than Group I, and Group II.[p< 0.05] These results suggest that topical cold saline was the better method than topical ice slush or topical ice chip as a myocardial preservation modality in the isolated rat heart model of cardiopulmonary bypass.

• 한국산업융합학회 논문집
• /
• 제12권4호
• /
• pp.179-186
• /
• 2009

Electronic components in an enclosure have been investigated to prevent undesired thermal problems. The electronic devices, such as ECUs of automotive engines, are operated under the contaminated environments, so that they rely on the passive cooling without any fluid-driving methods. Therefore the radiation heat dissipation plays more important role than the conduction and convection heat transfer. Hence their combined heat dissipation phenomena have been simulated by a numerical model to reveal the effects of supplied heat flux, emissivity of material, geometry of enclosure, charging gas and pressure. The result showed that the radiation had a significant effect on the heat dissipation of module in an enclosure, and some space above the module should be reserved to prevent its thermal problem. In addition, the higher thermal conductivity and pressure of gas in an enclosure could be necessary to improve the thermal dissipation from the electronic devices.