• ETRI Journal
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• v.46 no.3
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• pp.550-563
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• 2024

A novel inductance simulation circuit employing only two dual-output voltage-differencing buffered amplifiers (DO-VDBAs) and a single capacitance (grounded) is proposed in this paper. The reported configuration is a purely resistor-less realization that provides electronically controllable realized inductance through biasing quantities of DO-VDBAs and does not rely on any constraints related to matched values of parameters. This structure exhibits excellent behavior under the influence of tracking errors in DO-VDBAs and does not exhibit instability at high frequencies. The simple and compact metal-oxide semiconductor (MOS) implementation of the DO-VDBAs (eight MOS per DO-VDBA) and adoption of grounded capacitance make the proposed circuit suitable for on-chip realization from the perspective of chip area consumption. The function of the pure grounded inductance is validated through high pass/bandpass filtering applications. To test the proposed design, simulations were performed in the PSPICE environment. Experimental validation was also conducted using the integrated circuit CA3080 and operational amplifier LF-356.

• Journal of Advanced Navigation Technology
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• v.19 no.5
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• pp.423-432
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• 2015

This paper shows that design, manufacture and the performance of FC-NIC (fibre channel network interface card) for network unit configuration which is based on one of the 5 main configuration items of the common functional module for IMA (integrated modular Avionics) architecture. Especially, FC-NIC uses zynq SoC (system on chip) for host load reductions. The host merely transmit FC destination address, source memory location and size information to the FC-NIC. After then the FC-NIC read the host memory via DMA (direct memory access). FC upper layer protocol and sequence process at local processor and programmable logic of FC-NIC zynq SoC. It enables to free from host load for external communication. The performance of FC-NIC shows average 5.47 us low end-to-end latency at 2.125 Gbps line speed. It represent that FC-NIC is one of good candidate network for IMA.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.7
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• pp.778-784
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• 2008

In this paper, a chip antenna using multi-layer configuration for multi-band operation, such as GSM, DCS, pcs, WCDMA, and Mobile WiMAX for 2.3 GHz is proposed. This proposed antenna is a PIFA structure with multi-layer configuration fabricated on R04003 substrate(${\varepsilon}_r=3.4$) and its size is $22{\times}5.5{\times}4.0\;mm^3$. Multi-layer structure can effectively reduce the size of an antenna from a reuse of air-space and can achieve broad bandwidth due to decrement of parallel capacitances from the insertion air-gap to the middle layer. The proposed antenna has a broadband operation by the high order resonance modes and the resonance at the top layer. The measured bandwidths with over 45 % radiation efficiency are 80 MHz($880{\sim}960\;MHz$) at the lower band and 690 MHz($1,710{\sim}2,400\;MHz$) at the higher band.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.353-353
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• 2008

트랜지스터 속도는 현저하게 향상되어지는 반면에 RFICs(RF integrated circuits)는 대용량화, 고속화, 고집적화, 소형화, 고 효율화 온칩(on-chip) 수동소자의 부재에 의해 발전을 이루지 못하였다. 즉, 최근 전자기기의 집적화, 초소형화 됨에 따라 실장 밀도를 높이기 위해 부품의 소형화가 강하게 요구되는 동시에 Radio Frequency(RF)에서 이용가능한 수동소자인 capacitor를 개발하고자 본 논문에서는 손가락 모양(interdigital configuration)을 갖는 RF capacitor를 Ansoft사의 HFSS를 이용하여 이상적인 S-parameter, 정전용랑(capacitance), 손실계수(loss tangent)를 도출하고자 한다. 680um의 $Al_2O_3$ 기판에 BST doped MgO을 30um, Chromium과 gold를 각각 5um로 증착시켰다. 핑거 개수 (n, number), 핑거 길이(1, length), 핑거 간격(g, gap), 핑거 너비(w, width)를 변화 시켜가면서 이상적인 결과 값에 가까운 모양 (interdigital configuration)을 얻을 수 있었다. 핑거 수 3 개 일 때 입력 값에 대하여 손실 없는 출력 값(투과값)을 갖는 $S_{21}$이 1.5GHz에서 6dB이하로 떨어졌으며 핑거 간격이 줄고 핑거 너비가 커지고 핑거길이가 커질수록 높은 캐패시턴스 값을 갖는 것을 확인 할 수 있었다.

• The Bulletin of The Korean Astronomical Society
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• v.37 no.2
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• pp.228.1-228.1
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• 2012

Digital waveform generation technology for SAR payload can be divided into DDS(Direct Digital Synthesizer) method and Memory Mapped(M/M) method. DDS is the single chip which consists of the Sine Table, NCO(Numerically Controlled Oscillator), DAC, and so on. DDS method is a very simple method because the circuit configuration is not complex but has a disadvantage that can not control phase and amplitude easily by using NCO. M/M method has the complexity of the circuit configuration because it requires the memories which stores the waveforms, the control circuits, and DAC. And this method should apply the high interface technology for being compatible with the wide bandwidth of the digital signal and has the difficulty for PCB design because the number of the signal lines should be increased according to the number of the data bits for DAC. Although it has several disadvantages, this method has the capability of pre-distortion function which can compensate the phase and amplitude characteristics of the system and also has an excellent advantage to make any arbitrary waveform, so this method is considered as an important technology with DDS method. This research describes the technological trends of the waveform generator for the SAR payload and analyzes the characteristics of the technology.

• 한국정보통신설비학회:학술대회논문집
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• 2008.08a
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• pp.414-417
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• 2008

This paper presents the design and analysis of 2.45GHz Low-IF Mixer using CMOS 0.18um. The Mixer is implemented by using the Gilbert-type configuration, current bleeding technique, and the resonating technique for the tail capacitance. And the design of this Double Balance Mixer is based on its lineaity since it is important in the interference cancellation system. The low flicker noise mixer is implemented by incorporating a double balanced Gilber-type configuration, the RF leakage-less current bleeding technique, and Cp resonating technique. The proposed mixer has a simulated conversion gain of 16dB a simulated IIP3 of -3.3dBm and P1dB is -19dBm. A simulated noise figure of 6.9dB at l0MHz and a flicker corner frequency of 510kHz while consuming only 10.65mW od DC power. The layout of Mixer for one-chip design in a 0.18-um TSMC process has 0.474mm$\times$0.39 mm size.

• Current Optics and Photonics
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• v.4 no.4
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• pp.293-301
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• 2020

In this paper we propose and theoretically analyze a monolithic multiparametric sensor consisting of a superstructure of surface-relief waveguide Bragg gratings (WBGs), a micro-machined diaphragm, and a cantilever beam. Diaphragms of two different configurations, namely circular and square, are designed and analyzed separately for pressure measurement. The square diaphragm is then selected for further study, since it shows relatively higher sensitivity compared to the circular one, as it incurs more induced stress when any pressure is applied. The cantilever beam with a proof mass is designed to enhance the sensitivity for acceleration measurement. A unique mathematical method using coupled-mode theory and the transfer-matrix method is developed to design and analyze the shift in the Bragg wavelength of the superstructure configuration of the gratings, due to simultaneously applied pressure and acceleration. The effect of temperature on the wavelength shift is compensated by introducing another Bragg grating in the superstructure configuration. The measured sensitivities for pressure and acceleration are found to be 0.21 pm/Pa and 6.49 nm/g respectively.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.47 no.6
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• pp.80-85
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• 2010

BGA 409 chip currently the most as a visual inspection of the exterior inspection is conducted. Human depending on visual inspection of the exterior inspection of the current state of testers, depending on how the test results because the change is difficult to expect reliable results. Therefore, the challenges of visual inspection of BGA solder balls to improve the visual inspection technique was developed. However, BGA solder ball size of the microstructure and the characteristics of the distinction between hard test the accuracy of the fall orientation error has a problem. In this paper BGA solder balls exterior inspection of the accuracy to improve the edge detection algorithm, the complement of features and only the comparison proposed a pattern-matching techniques, based on the characteristics of spatial configuration of the area by improving the standard error of the orientation proposed improvements.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.24 no.1
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• pp.97-101
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• 2024

In this paper, we present the implementation of proton beam irradiation test logic and test results for Xilinx's RFSoC FPGA. In addition to the FPGA function, RFSoC is a chip that integrates CPU, ADC, and DAC and is attracting attention in the defense and space industries aimed at reducing the size of the chip. In order to use these chips in a space environment, an analysis of radiation effects was required and radiation mitigation measures were required. Through the proton irradiation test, the logic to measure the radiation effect of RFSoC was designed. Logic for comparing values stored in memory with normal values was implemented, and protons were irradiated to RFSoC to measure SEU generated in the block memory area. To alleviate the occurrence of SEU in other areas, TMR and SEM were applied and designed. Through the test results, we intend to verify this test configuration and establish an environment in which logic design for satellites can be verified in the future.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.10
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• pp.1553-1571
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• 1993

A significant amount of research has focused on the development of highly parallel architectures to obtain far more computational power than conventional computer systems. These architectures usually comprise of a large number of processors communicating through an interconnection network. The VLSI (Very Large Scale Integration) and WSI (Wafer Scale Integration) cellular arrays form one important class of those parallel architectures, and consist of a large number of simple processing cells, all on a single chip or wafer, each interconnected only to its neighbors. This paper studies three fundamental issues in these arrays : fault-tolerant reconfiguration. functional reconfiguration, and their integration. The paper examines conventional techniques, and gives an in-depth discussion about fault-tolerant reconfiguration and functional reconfiguration, presenting testing control strategy, configuration control strategy, steps required f4r each reconfiguration, and other relevant topics. The issue of integrating fault tolerant reconfiguration and functional reconfiguration has been addressed only recently. To tackle that problem, the paper identifies the relation between fault tolerant reconfiguration and functional reconfiguration, and discusses appropriate testing and configuration control strategy for integrated reconfiguration on VLSI and WSI cellular arrays.