• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.443-450
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• 2008

Efficient use of low rank coals (LRC) have been investigated as a method to cope with recent high oil price. Among the coals used in industry, lignite and sub-bituminous coals are belong to the LRC, and have abundant deposit and are distributed worldwide, but high moisture contents and self ignition properties inhibits their utilization. In this paper, chemical coal cleaning to produce ash-free coal from LRC has been investigated. Two technologies, that is, UCC(Ultra Clean Coal) process removing ash from coal and Hyper Coal process extracting combustibles from coal were compared with. UCC process has merits of simple and reliable when it compared with Hyper Coal process, but the remaining ash contents werehigher than Hyper Coal. Hyper Coal has ash contents under the 200ppm when raw coal is treated with appropriate solvent and ion exchange materials to remove alkali materials in extracted solution. The ash-free coal which is similar grade with oil can be used as alternate oil in the industry, and also used as a high grade fuel for IGCC, IGFC and other advanced combustion technology.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.19 no.3
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• pp.280-287
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• 2009

High-tech microelectronics industry is known as one of the most chemical-intensive industries. In Korea, Microelectronics industry occupied 38% of export and 16% of working employees work in microelectronics industry. But, chemical information and health hazards of high-tech microelectronics manufacturing are poorly understood because of rapid development and its penchant for secrecy. We need to investigate on chemical use and exposure control. We Site-visits to 6 high-tech microelectronics manufacturing company which have cleanroom work using over 1,000kg organic solvents (5 semi-conductor chips and its related parts company, 1 liquid crystal display (LCD)). We reviewed their data on chemical use and ventilation system, and measured TVOCs (Total Volatile Organic Compounds) and carbon dioxide concentration. All cleanroom air passed through hepa filters to acheive low particle levels and only 1 cleanroom uses carbon filters to minimize the organic solvents exposures In TVOC screening test, Cleanroom for semi-conductor chips and its related parts company with laminar down flow system (e.g. class 1~100) showed nondetectable level of TVOCs concentration, but Cleanroom for liquid crystal display (LCD) with conventional flow system (e.g. class 1,000~10,000) showed 327 ppm as TVOCs. Acetone concentration in cleanroom for Jig cleaning, LC Injection, Sealing processes were 18.488ppm (n=14), 49.762 ppm (n=15), 8.656 ppm (n=14) as arithmetric mean. Acetone concentration in cleanroom for LCD inspection process was 40ppm (n=55) as geometric mean, where the range was 7.8~128.7ppm and weakly correlated with ventilation rate efficiency(r=0.44, p<0.05). To control organic solvents in cleanrooms, chemical and carbon filters should be installed with hepa filters. Even though their volatile organic compounds concentration was not exceed to occupational exposure limits, considering of entrance limited cleanroom environment, long-term period exposure effects and adverse health effects of cleanroom worker need further reseach.

• Nuclear Engineering and Technology
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• v.44 no.1
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• pp.21-32
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• 2012

Fluorinated compounds mainly used in the semiconductor industry are potent greenhouse gases. Recently, thermal plasma gas scrubbers have been gradually replacing conventional burn-wet type gas scrubbers which are based on the combustion of fossil fuels because high conversion efficiency and control of byproduct generation are achievable in chemically reactive high temperature thermal plasma. Chemical equilibrium composition at high temperature and numerical analysis on a complex thermal flow in the thermal plasma decomposition system are used to predict the process of thermal decomposition of fluorinated gas. In order to increase economic feasibility of the thermal plasma decomposition process, increase of thermal efficiency of the plasma torch and enhancement of gas mixing between the thermal plasma jet and waste gas are discussed. In addition, noble thermal plasma systems to be applied in the thermal plasma gas treatment are introduced in the present paper.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.37-49
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• 2008

Recent rapid progress in the photovoltaic industry has seriously been retarded by limited supply of polysilicon used as the feedstock for silicon wafer-based solar cells. It is thus believed that development of a competitive process for preparing polysilicon with the quality required for solar cells can greatly enhance the competitiveness and extent of the photovoltaic application. Technologies currently available for preparing the silicon feedstock are reviewed with the recent fluidized bed silicon deposition process being discussed in more details in terms of key technical barriers.

• Advances in environmental research
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• v.1 no.2
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• pp.153-166
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• 2012

Decolourization potential of white rot fungal organism, coriolus versicolor, was investigated in a batch reactor, for textile dye industry wastewater. The influence of process parameters like pH, temperature, agitation speed and dye wastewater concentration on the decolourization of textile dye wastewater was examined by using Response surface methodology (RSM). The maximum decolourization was attained at: pH- 6.8, temperature - $27.9^{\circ}C$, agitation speed - 160 rpm and dye wastewater concentration - 1:2. From the analysis of variance (ANOVA) results it was found that, the linear effect of agitation speed and dye wastewater concentration were significant for the decolourization of textile dye wastewater. At these optimized condition, the maximum decolourization and chemical oxygen demand (COD) reduction was found to be 64.4% and 79.8% respectively. Various external carbon sources were tried to enhance the decolourization of textile dye wastewater. It was observed that the addition of carbon source enhances the decolourization of textile dye wastewater. Kinetics of textile dye degradation process was studied by first order and diffusional model. From the results it was found that the degradation follows first order model with $R^2$ value of 0.9430.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.42 no.3
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• pp.50-57
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• 2010

A mill trial was performed in a kraft paper mill in order to evaluate the possibility of utilizing dual polymer dry strength aids system consisting of cationic PVAm and anionic PAM. It was found that the cationic PVAm - anionic PAM dry strength additives can improve paper strength without significantly disturbing the stability of the kraft papermaking process when virgin UKP was used as a furnish. Tensile strength (25.3% in machine direction, 48.4% in cross machine direction), elongation of paper (31.6%, 15.6%) and tensile energy absorption (48%, 54%) were improved. Air permeability of the kraft paper was improved as well (22%). Tear strength was decreased with PVAm dry strength aids system, but it can be compensated with decreasing refining degree. In addition, the mill trial results indicate that highly air permeable kraft sack paper can be produced by the addition of PVAm dry strength agents at the stock with reduced freeness.

• Clean Technology
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• v.11 no.4
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• pp.165-170
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• 2005

The aim of this study is to provide vapor-liquid equilibrium (VLE) information for the study of process which directly synthesize dimethyl carbonate (DMC) from $CO_2$. For this study we collected some necessary VLE systems data of Methanol-Water, Methanol-DMC, $CO_2$-DMC, $CO_2$-Methanol, $CO_2$-Methanol, and performed VLE calculation with Peng-Robinson equation of state, Wong-Sandler mixing rules that widely used in chemical industry. These calculation results relatively agreed with VLE data well. Optimized Parameters of EoS given through this calculation will be used as some valuable information for fundamental study, process development and process optimization of DMC direct synthesis.

• Proceedings of the Korean Society of Near Infrared Spectroscopy Conference
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• 2001.06a
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• pp.1082-1082
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• 2001

Extrusion is one of the most important processes in polymer industry. The characterization of the polymer melt during processing will improve this process noticeably, One possibility of characterizing the actual processed polymer melt is the inline near infrared (NIR) spectroscopy, With this method several polymer properties can be observed during processing, e.g. composition, moisture ormechanical properties of the melt. For this purpose probes for transmission and reflection measurements have been developed, withstanding the high temperatures and pressures appearing during extrusion process (tested up to 300$^{\circ}C$ and 10 ㎫). For the transmission system an optical bypass was developed to eliminate disturbing spectral influences and hence increase the long term stability, which is the prerequisite for an industrial application. Measurements in transmission and reflection produced comparable results (or blending processes, where the prediction error was less than 1%. An optimum RMSEP of only 0.24% was found for preprocessed polymer blends measured in transmission on a laboratory extruder. A transflection measurement allowed for the first time the recording of relevant NIR-spectra in the screw area of an extruder. The application to a (PE+PP) blending process delivered promising results. This new measurement mode allows the observation of the ongoing processes within the screw area, which is of maximum Interest for reactive extrusion processes. Due to economic reasons the calibration transfer between different extrusion systems is also of high importance. Investigations on simulated and real-world spectra showed that a calibration transfer is possible. A new method alternatively to the well-known direct standardization procedures was developed, which is based on an automatic data pretreatment. This procedure delivers comparable results for the calibration transfer. Overall this paper presents concepts, components and algorithms for the inline near infrared (NIR) spectroscopy for polymer extrusion, which allows the use of it in a real industrial extrusion process.

• Proceedings of the Korea Contents Association Conference
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• 2007.11a
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• pp.487-489
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• 2007

In this paper chemical process plant information is addressed to be standardized. The chemical process plant information has complexities in the context of its various types such as functions, shapes, connectivity etc. as well as its usages such as design, construction, operation, maintenance and so on. It was well known that the standard should be made by its users themselves to be used widely. The chemical process industry oriented ISO 15926 RDL (Systems and integration of life-cycle data for oil and gas production facilities : Reference Data Library) can provide the methodology for exchanging and sharing of plant equipment information, which will be developed through integrating existing standards such as ISO 10303 AP221, AP231, AP227. The PCA (Posc Caesar Association) which is located in Oslo, Norway, has the initiative in developing ISO 15926. Korea is a member of PCA and takes part in proposing and reviewing the new standard. The trends and prospects for the standard of chemical process plant information are addressed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.257-257
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• 2012

Fault detection was carried out in a etcher of capacitive coupled plasma with OES (Optical Emission Spectroscopy) and impedance by VI probe that are widely used for process control and monitoring at semiconductor industry. The experiment was operated at conventional Ar and Fluorocarbon plasma with variable change such as pressure and addition of N2 and O2 to assume atmospheric leak, RF power and pressure that are highly possible to impact wafer yield during wafer process, in order to observe OES and VI Probe signals. The sensitivity change on OES and Impedance by VI probe was analyzed by statistical method including PCA to determine healthy of process. The main goal of this study is to find feasibility and limitation of OES and Impedances for fault detection by shift of plasma characteristics and to enhance capability of fault detection using PCA.