• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1107-1113
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• 2014

In this article, the megasonic cleaning system for cleaning micro/nano particles from flat panel display (FPD) surfaces was developed. A piezoelectric actuator and a waveguide were designed by finite element method (FEM) analysis. The calculated peak frequency value of the quartz waveguide was 1002 kHz, which agreed well with the measured value of 1003 kHz. The average acoustic pressure of the megasonic cleaning system was 43.1 kPa, which is three times greater than that of the conventional type of 13.9 kPa. Particle removal efficiency (PRE) tests were performed, and the cleaning efficiency of the developed system was proven to be 99%. The power consumption of the developed system was 64% lower than that of the commercial system. These results show that the developed megasonic cleaning system can be an effective solution in particle removing from FPD substrate with higher energy efficiency and lower chemical and ultra pure water (UPW) consumption.

• Applied Chemistry for Engineering
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• v.18 no.2
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• pp.188-193
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• 2007

Semi-solvent type cleaning agents were prepared by mixing naphthenes, natural terpene oil, surfactant and water, and measured their physical properties. And also, cleaning efficiency for flux and grease was measured by gravimetric method. By measuring the physical properties, pH for cleaning agents were 6.0~6.7, surface tension, 27.4~28.4 dyne/cm, and wetting index, 8.65~12.46 (with water), 11.99~17.43 (without water). The cleaning agent composed of naphthene, 30 wt%, natural terpene oil, 45 wt%, surfactant, 13 wt%, co-surfactant, 12 wt%, and water, 0 wt% had the largest wetting index, and shown the most effective cleaning properties for flux (98.66%) and grease (93.44%). The conductivity with $0.5{\sim}0.9{\mu}s/cm$ to the cleaning agent containing small amount of water was found to form W/O type microemulsion.

• Clean Technology
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• v.19 no.3
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• pp.219-225
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• 2013

Environment-friendly and surfactant-free aqueous cleaning agents have been developed in order to solve various problems generated by surfactants in the aqueous cleaning agents. Aqueous surfactant-free cleaning agents, S-1 and S-2 have been formulated with water-soluble solvents such as propylene glycol and propylene glycol ether on their main components and with some additives. These solvents were chosen because of their good solubility in water and excellent solubility of fluxes which are major contaminants of printed circuit board in the electronic industry. Physical properties of the formulated and the imported cleaning agents were measured to predict their cleaning performance, and their cleaning abilities of flux and solder contaminants were evaluated under the various ultrasonic frequencies by a gravimetric method. The measurement results show that the physical properties of cleaning agent V are generally similar with those of formulated cleaning agents S-1 and S-2. Both the cleaning agent V and the formulated cleaning agents S-1 and S-2 showed similar trends that their pH decrease in the beginning and then increases later on with the increase of their dilution in water. It is considered that the wetting indices of the cleaning agents calculated with experimental values do not not have any influence on their cleaning ability. In ultrasonic cleaning tests under three ultrasonic frequencies of 28, 45, and 100 kHz, their best performances of cleaning solder and flux were obtained at 45 kHz and 28 kHz, respectively, and the cleaning performance of the formulated cleaning agents S-1 and S-2 was better than that of the cleaning agent V. However, in the case of the recommended diluted concentration of 25 wt% cleaning solution, the cleaning performance of the cleaner V for solder and flux was better in the initial stage of cleaning compared to the formulated cleaners. And it may be concluded that the formulated cleaning agents S-1 and S-2 can be applied to cleaning of solder and flux in the industry, based on the experimental results in this study.

• The KSFM Journal of Fluid Machinery
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• v.17 no.2
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• pp.54-58
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• 2014

The method of residential waste and food waste collecting is changed into automatic waste collection(AWC) system from direct collection by human resource. To solve the problem caused by odour from AWC facilities, the structure of input facilities, conveying pipes and collecting facilities have been changed into closed and sealed construction to enclosed the facilities and collect odour efficiently. Based on cases and experiences, to treat variable odour matters which are caused by food waste, chemical cleaning method is preferable method to cope with odour caused by food waste.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.45-50
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• 2009

By Laser Through-Silicon-Via process, debris and particles occur when you are forming. Therefore the research of TSV cleaning become important to remove those particles and debris. Both chemical cleaning method that uses a surfactant and physical cleaning method that uses a brush were studied with the via of $30{\mu}m$ diameter and $100{\mu}m$ depth on the 8 inch CMOS Image Sensor wafer. On the DI water and a surfactant in mixture ratio of 2:1, debris show $73{\mu}m^2$ per $0.054mm^2$. Cleaning is superior by lower mixture ratio of DI water and surfactant. In addition, It is less than 5% of debris distribution in the laser condition changed by Laser's frequency and its speed and cleaning had no effect. In the physical cleaning, there are no crack and damage when the system condition is set by $1000{\sim}3000rpm$ strip, $50{\sim}3000rpm$ rinsing, and $200{\sim}300rpm$ brushing Therefore, debris and particles can be removed by enforced chemical method and physical method.

• Applied Chemistry for Engineering
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• v.29 no.2
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• pp.229-236
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• 2018

A customized cleaning agent was investigated for improving the performance decreased by the pollution of collecting plates in an electric fume collector (EFC) which was developed and applied for the purification of effluent gas including oil mist from the textile industry. The pollutants on the surface of collecting plates were blackened by the condensation of oil mist for a long time and difficult to remove by general cleaning agents. The composition of an optimized cleaning agent consisted of alkali, alcohol, glycol and non-ionic surfactant sources was determined by considering the pollutant properties and effect on the damage of the basic metal of collecting plate and so on. The developed cleaning agent solution diluted by 9.1% was applied to the field test, and also the pollutants strongly adhered on collecting plate surfaces were successfully removed by a simple spraying method. The effluent gas purification efficiency of EFC increased significantly by cleaning of collecting plates.

• Clean Technology
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• v.18 no.3
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• pp.287-294
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• 2012

In this study, performances of two cleaning methods were analyzed and a cleaning system was designed to develop a cleaning process of electronic components to remanufacture old laser copy machine. First, plasma cleaning as a dry cleaning method was executed to test cleaning ability. In cleaning of printed circuit board (PCB) by plasma, some damages were found near the metal parts, and considering the productivity, this method was not adequate for the cleaning of electronic components. With 4 different cleaning agents, ultrasonic cleaning tests were executed to select an optimal cleaning agent, aqueous agents showed superior cleaning performance compared to semi-aqueous and non-aqueous agents. Cleaning with aqueous cleaning agent A and 28 kHz ultrasonic frequency can be completed in 30 sec to 1 min. Finally, an ultrasonic cleaning system was constructed based on the pre-test results. Optimal cleaning conditions of 40 kHz and $50^{\circ}C$ were found in the field test. The productivity and economic efficiency in remanufacturing of laser copy machine are expected to increase by adapting developed ultrasonic cleaning system.

• Journal of Environmental Science International
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• v.16 no.8
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• pp.873-879
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• 2007

For the purpose of development of an environmentally friendly aqueous cleanser, some experimental researches on emulsification of D-limonene were performed. OA series surfactants with different molecular weight were adapted as an emulsifier for preparation of O/W emulsion. Cleaning power of aqueous cleanser was measured by a dipping method adapting abietic acid(AA) as a solubilizate. Besides, drop size and drop size distribution, contact angle and storage stability of the aqueous cleansers were also measured and relationships among them were examined. Decrease in molecular weight of surfactant induced small drop size and contact angie, resulting in high cleaning power of aqueous cleanser. Aqueous cleanser consisted of 3wt.% OA300 and 30wt.% D-limonene showed the highest cleaning power, but displayed unfortunately with low storage stability. The storage stability of the aqueous cleanser with OA300 was significantly enhanced by addition of 0.5wt.% OA600 at the expanse of decrease in cleaning power.

• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.24.1-24.1
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• 2010

In practical operation, the exposed surfaces may get dirty thus degrade the performance of devices. So the combination of self cleaning and antireflection is very desirable for use in outdoor photovoltaic and displaying devices, self cleaning windows and car windshields. For the purpose of self cleaning, the surface needs to be either superhydrophobic or superhydrophilic. However, in practice AR in the visible region and self cleaning are a pair of competitive properties. To satisfy the requirements for superhydrophobic or superhydrophilic surfaces, high surface roughness is required. But it usually cause severely light scattering. Photo-responsive coatings (TiO2, ZnO etc.) can lead to superhydrophilic. However, the refractive indices are high. Thus for porous structure, controlling pore size in the underwavelength scale to reduce the light scattering is very crucial for highly transparent and self cleaning antireflection coating. Herein, we demonstrate a simple method to make high performance broadband antireflection layer on the glass surface, by "carving" the surface by hot alkali solution. Etched glass has superhydrophilic surface. By chemical modification, it turns to superhydrophobic. Enhanced transparency (up to 97%) in a broad wavelength range was obtained by short time etching. Also antifogging effect has been demonstrated, which may offer advantage for devices working at high humidity environment or underwater. Compositional dependence of the properties was observed by comparing three different commercially available glasses.