• Transactions on Electrical and Electronic Materials
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• 제14권5호
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• pp.254-257
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• 2013

In-situ optical emission spectroscopy (OES) is employed for PECVD chamber monitoring. OES is used as an addon sensor to monitoring and cleaning end point detection (EPD). On monitoring plasma chemistry using OES, the process gas and by-product gas are simultaneously monitored. Principal component analysis (PCA) enhances the capability of end point detection using OES data. Through chamber cleaning monitoring using OES, cleaning time is reduced by 53%, in general. Therefore, the gas usage of fluorine is also reduced, so satisfying Green Fab challenge in semiconductor manufacturing.

• 반도체디스플레이기술학회지
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• 제23권2호
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• pp.114-122
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• 2024

NF₃, Chamber cleaning gas, has a high Global Warming Potential (GWP) of 17,000, causing significant greenhouse effects. Reducing gas usage during the cleaning process is crucial while increasing the cleaning Rate and reducing cleaning standard deviation (Stdev). In a previous study with a 6-inch PECVD chamber, a multiple linear regression analysis showed that Power and Pressure had no significant effect on the cleaning Rate because of their P-values of 0.42 and 0.68. The weight for Flow is 11.55, and the weights for Power and Pressure are 1.4 and 0.7. Due to the limitations of the research equipment, which differed from those used in actual industrial settings, it was challenging to assess the effects in actual industrial environment. Therefore, to show an actual industrial environment, we conducted the cleaning process on a 12-inch PECVD chamber, which is production-level equipment, and quantitatively analyzed the effects of each variable. Power, Pressure, and NF3 Flow all had P-values close to 0, indicating strong statistical significance. The weight for Flow is 15.68, and the weights for Power and Pressure are 4.45 and 5.24, respectively, showing effects 3 and 7 times greater than those with the 6-inch equipment on the cleaning rate. Additionally, we analyzed the cleaning Stdev and derived that there is a trade-off between increasing the cleaning Rate and reducing the cleaning Stdev.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.183-183
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• 2012

In the era of 45 nm or beyond technology, conventional etch mask using photoresist showed its limitation of etch mask pattern collapse as well as pattern erosion, thus hard mask in etching became necessary for precise control of etch pattern geometry. Currently available hard mask materials are amorphous carbon and polymetric materials spin-on containing carbon or silicon. Amorphous carbon layer (ACL) deposited by PECVD for etch hard mask has appeared in manufacturing, but spin-on carbon (SOC) was also suggested to alleviate concerns of particle, throughput, and cost of ownership (COO) [1]. SOC provides some benefits of reduced process steps, but it also faced with wiggling on a sidewall profile. Diamond like carbon (DLC) was also evaluated for substituting ACL, but etching selectivity of ACL was better than DLC although DLC has superior optical property [2]. Developing a novel material for pattern hard mask is very important in material research, but it is also worthwhile eliminating a potential issue to continuously develop currently existing technology. In this paper, we investigated in-situ dry-cleaning (ISD) monitoring of ACL coated process chamber. End time detection of chamber cleaning not only provides a confidence that the process chamber is being cleaned, but also contributes to minimize wait time waste (WOW). Employing Challenger 300ST, a 300mm ACL PECVD manufactured by TES, a series of experimental chamber cleaning runs was performed after several deposition processes in the deposited film thickness of $2000{\AA}$ and $5000{\AA}$. Ar Actinometry and principle component analysis (PCA) were applied to derive integrated and intuitive trace signal, and the result showed that previously operated cleaning run time can be reduced by more than 20% by employing real-time monitoring in ISD process.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.72-75
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• 2023

Carbon neutrality has been emerged as important mission for all the manufacturing industry to reduce energy usage and carbon emission equivalent. Korean semiconductor and display manufacturing industries are also in huge interest by minimize the energy usage as well as to find a less global warming product gases in both etch and cleaning. In addition, Korean government is also investing long term research and development plan for the safe environment in various ways. In this paper, we revisit previous research activities on carbon emission equivalent and current research activities performed in semiconductor process diagnosis research center at Myongji University with respect to the reduction of NF3 usage for the PECVD chamber cleaning, and we present the analytical result of the exhaust gas with residual gas analysis in both 6 inches and 12 inches PECVD equipment. The presented result can be a reference study of the development of new substitution gas in near future to compare the cleaning rate of the silicon oxide deposition chamber.

• 한국분무공학회지
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• 제16권2호
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• pp.90-96
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• 2011

Atomized liquid jets from the washing nozzle which configured with recirculation chamber for cleaning hot-zone area are accelerated and impinged on the head lamp surface. Cleaning efficiency of head lamp can be increased with injecting washing fluids into the hot-zone area. Experimental and numerical studies with various design parameters were executed to reveal the relations between internal geometry and internal flow in the washing nozzle. Spray structures were fitted with each of the head lamp surfaces and spray nozzles were optimized to the spray pattern. The recirculation chamber induces a recirculation flow and can be decreased the pressures perturbation inside the chamber. Orifice determines the mass flow rate. When the diameter of orifice is excessively large, it showed an unstable spray pattern. As a nozzle exit angle increases, density distributions are separated with two section. Also, as a protrusion length of nozzle exit increases, spray patterns are spread into a large area and density distributions showed unstable trend.

• 한국진공학회지
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• 제10권3호
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• pp.298-302
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• 2001

초청정을 요구하는 진공용기의 내벽세정을 위한 RF 및 DC 방전세정장치를 제작하여 여러 가지 방전조건에 따라 세정효과를 조사하였다. Baking없이 방전세정만을 수행하였을 때는 baking만 진행했을 때와 비슷한 세정효과를 나타내었으며 세정후의 탈기체율은 반으로 줄어들었다. Baking과 방전세정을 동시에 진행하면 세정효과가 매우 증대되어 세정후의 탈기체율이 1/20으로 감소하였다. Baking과 방전세정을 동시에 수행 시 여러 방전조건에 따른 세정효과를 조사하였는데 이온이 진공용기 내벽에 부딪히며 세정을 할 때 이온에너지와 이온밀도가 중요한 역할을 하는 것으로 보였다. 진공용기를 세정함에 있어 RF방전세정이 DC 방전세정보다 효과적이라는 결과를 얻었다.

• 한국기록관리학회지
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• 제13권1호
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• pp.35-58
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• 2013

기록물 보존챔버란 소량의 중요기록물을 안정성 높은 보존환경에서 영구보존하는 데 적합한 장비이다. 이 장비는 소량의 기록물을 영구보존하기 위한 공공기관이나 민간단체에서 기록물을 경제적이면서 안전하게 장기보존하기에 적합한 장비이다. 본 연구는 지방기록관의 기록물 보존현황 조사를 통해 보존챔버의 필요성을 분석한 후 보존챔버의 핵심부분을 설계함으로 기록물을 안정적이면서 경제적으로 보존할 수 있는 방안을 모색하였다. 기록물 보존챔버는 크게 기록물을 보존하는 보존공간, 보존환경 유지를 위한 공기정화장치부, 보존환경을 모니터링하기 위한 환경측정장치부로 구성된다. 기록물 보존공간은 외부 공기의 출입을 막고 내부공기가 순환함으로 항온항습 유지 및 유해가스 제거가 가능하도록 하였다. 이렇게 설계된 보존챔버는 소량의 기록물을 서고에서 보존할 때보다 더 경제적으로 보존할 수 있는 것으로 산출되었다.

• 한국환경보건학회지
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• 제43권2호
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• pp.95-102
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• 2017

Objectives: This study was conducted to evaluate the emission of VOCs from clothing that had been dry cleaned. Methods: In order to ensure the same conditions, f100% wool scarves were selected as the fabric type. Four identical tests were conducted on the option of either removing the plastic bags which came from the dry cleaning shop or not. The scarf was located inside a closet or room for one or two days. Small chamber tests were conducted to determine the VOC emission characteristics under the same conditions such as temperature, humidity, loading factor, and air exchange rates. Air from the chamber for VOCs was sampled by Tenax TA tube and analyzed by thermal desorption and GC/MSD. Results: Assuming that test represented dry cleaning and consumer's conditions well enough, we can conclude that immediate emissions after the dry cleaning of the scarfs caused elevated levels of TVOC, five VOCs (benzene, toluene, ethylbenzene, xylene, stylene), and decane group compounds. Conclusions: By removing the plastic bags which came from the dry cleaning shop or not, the storage conditions of dry cleaned scarfs by consumers during the storage time periods (one to three days) would be significant for reducing VOC emissions.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.3168-3172
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• 2007

As the minimum feature size decreases, control of contamination by nanoparticles is getting more attention in semiconductor process. Cleaning technology which removes nanoparticles is essential to increase yield. A reference wafer on which particles with known size and number are deposited is needed to evaluate the cleaning process. We simulated particle trajectories in the chamber by using FLUENT and designed a particle deposition system which consists of scanning mobility particle sizer (SMPS) and deposition chamber. Charged monodisperse particles are generated using SMPS and deposited on the wafer by electrostatic force. The experimental results agreed with the simulation results well in terms of particle number and deposition area according to particle size, flow rate and deposition voltage.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.242-243
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• 2015

Fault detection using optical emission spectra with modified K-means cluster analysis and principal component anal ysis are demonstrated for inductive coupl ed pl asma cl eaning processes. The optical emission spectra from optical emission spectroscopy (OES) are used for measurement. Furthermore, Principal component analysis and K-means cluster analysis algorithm is modified and applied to real-time detection and sensitivity enhancement for fluorocarbon cleaning processes. The proposed techniques show clear improvement of sensitivity and significant noise reduction when they are compared with single wavelength signals measured by OES. These techniques are expected to be applied to various plasma monitoring applications including fault detections as well as chamber cleaning endpoint detection.