• Transactions on Electrical and Electronic Materials
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• v.14 no.5
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• pp.254-257
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• 2013

In-situ optical emission spectroscopy (OES) is employed for PECVD chamber monitoring. OES is used as an addon sensor to monitoring and cleaning end point detection (EPD). On monitoring plasma chemistry using OES, the process gas and by-product gas are simultaneously monitored. Principal component analysis (PCA) enhances the capability of end point detection using OES data. Through chamber cleaning monitoring using OES, cleaning time is reduced by 53%, in general. Therefore, the gas usage of fluorine is also reduced, so satisfying Green Fab challenge in semiconductor manufacturing.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.114-122
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• 2024

NF₃, Chamber cleaning gas, has a high Global Warming Potential (GWP) of 17,000, causing significant greenhouse effects. Reducing gas usage during the cleaning process is crucial while increasing the cleaning Rate and reducing cleaning standard deviation (Stdev). In a previous study with a 6-inch PECVD chamber, a multiple linear regression analysis showed that Power and Pressure had no significant effect on the cleaning Rate because of their P-values of 0.42 and 0.68. The weight for Flow is 11.55, and the weights for Power and Pressure are 1.4 and 0.7. Due to the limitations of the research equipment, which differed from those used in actual industrial settings, it was challenging to assess the effects in actual industrial environment. Therefore, to show an actual industrial environment, we conducted the cleaning process on a 12-inch PECVD chamber, which is production-level equipment, and quantitatively analyzed the effects of each variable. Power, Pressure, and NF3 Flow all had P-values close to 0, indicating strong statistical significance. The weight for Flow is 15.68, and the weights for Power and Pressure are 4.45 and 5.24, respectively, showing effects 3 and 7 times greater than those with the 6-inch equipment on the cleaning rate. Additionally, we analyzed the cleaning Stdev and derived that there is a trade-off between increasing the cleaning Rate and reducing the cleaning Stdev.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.183-183
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• 2012

In the era of 45 nm or beyond technology, conventional etch mask using photoresist showed its limitation of etch mask pattern collapse as well as pattern erosion, thus hard mask in etching became necessary for precise control of etch pattern geometry. Currently available hard mask materials are amorphous carbon and polymetric materials spin-on containing carbon or silicon. Amorphous carbon layer (ACL) deposited by PECVD for etch hard mask has appeared in manufacturing, but spin-on carbon (SOC) was also suggested to alleviate concerns of particle, throughput, and cost of ownership (COO) [1]. SOC provides some benefits of reduced process steps, but it also faced with wiggling on a sidewall profile. Diamond like carbon (DLC) was also evaluated for substituting ACL, but etching selectivity of ACL was better than DLC although DLC has superior optical property [2]. Developing a novel material for pattern hard mask is very important in material research, but it is also worthwhile eliminating a potential issue to continuously develop currently existing technology. In this paper, we investigated in-situ dry-cleaning (ISD) monitoring of ACL coated process chamber. End time detection of chamber cleaning not only provides a confidence that the process chamber is being cleaned, but also contributes to minimize wait time waste (WOW). Employing Challenger 300ST, a 300mm ACL PECVD manufactured by TES, a series of experimental chamber cleaning runs was performed after several deposition processes in the deposited film thickness of $2000{\AA}$ and $5000{\AA}$. Ar Actinometry and principle component analysis (PCA) were applied to derive integrated and intuitive trace signal, and the result showed that previously operated cleaning run time can be reduced by more than 20% by employing real-time monitoring in ISD process.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.72-75
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• 2023

Carbon neutrality has been emerged as important mission for all the manufacturing industry to reduce energy usage and carbon emission equivalent. Korean semiconductor and display manufacturing industries are also in huge interest by minimize the energy usage as well as to find a less global warming product gases in both etch and cleaning. In addition, Korean government is also investing long term research and development plan for the safe environment in various ways. In this paper, we revisit previous research activities on carbon emission equivalent and current research activities performed in semiconductor process diagnosis research center at Myongji University with respect to the reduction of NF3 usage for the PECVD chamber cleaning, and we present the analytical result of the exhaust gas with residual gas analysis in both 6 inches and 12 inches PECVD equipment. The presented result can be a reference study of the development of new substitution gas in near future to compare the cleaning rate of the silicon oxide deposition chamber.

• Journal of ILASS-Korea
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• v.16 no.2
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• pp.90-96
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• 2011

Atomized liquid jets from the washing nozzle which configured with recirculation chamber for cleaning hot-zone area are accelerated and impinged on the head lamp surface. Cleaning efficiency of head lamp can be increased with injecting washing fluids into the hot-zone area. Experimental and numerical studies with various design parameters were executed to reveal the relations between internal geometry and internal flow in the washing nozzle. Spray structures were fitted with each of the head lamp surfaces and spray nozzles were optimized to the spray pattern. The recirculation chamber induces a recirculation flow and can be decreased the pressures perturbation inside the chamber. Orifice determines the mass flow rate. When the diameter of orifice is excessively large, it showed an unstable spray pattern. As a nozzle exit angle increases, density distributions are separated with two section. Also, as a protrusion length of nozzle exit increases, spray patterns are spread into a large area and density distributions showed unstable trend.

• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.298-302
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• 2001

Cleaning effect of RF/DC discharge to clean the surface of vacuum chamber was studied for various discharge conditions. Glow discharge cleaning without baking reduced the outgassing rate to 1/2, which was similar to that after the only baking treatment alone. Glow discharge cleaning treatment with baking improved the cleaning efficiency and then the outgassing rate was remarkably reduced to 1/20. It was found that the ion energy and the ion density were important factors in cleaning the surface. RF discharge cleaning was more effective than BC discharge cleaning.

• Journal of Korean Society of Archives and Records Management
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• v.13 no.1
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• pp.35-58
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• 2013

The archives preservation chamber is an equipment that is able to store important archives with air-cleaning and isothermal-isohumidity control functions to permanently store archives in a highly safe environment. The chamber can only store small amounts of archives but it is crucial for organizations preserving archives to economically store a variety of archives, be it a medium or a small amount of documents. An arm of this study researches the current preservation status of the local record center to determine the need for such a chamber. In addition, in order to improve the air-cleaning and isothermal-isohumidity functions, the researchers of this study have conducted analyses to design the core parts. The preservation chamber that had been designed includes an archives preservation area, air-cleaning equipment, and environment measurement equipment. A preservation chamber is used to preserve small amounts of important archives safely. Thus, when a local record center is preserving various types of archives in small or medium quantities in a stack room, the preservation chamber can be used to aid their long-term preservation.

• Journal of Environmental Health Sciences
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• v.43 no.2
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• pp.95-102
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• 2017

Objectives: This study was conducted to evaluate the emission of VOCs from clothing that had been dry cleaned. Methods: In order to ensure the same conditions, f100% wool scarves were selected as the fabric type. Four identical tests were conducted on the option of either removing the plastic bags which came from the dry cleaning shop or not. The scarf was located inside a closet or room for one or two days. Small chamber tests were conducted to determine the VOC emission characteristics under the same conditions such as temperature, humidity, loading factor, and air exchange rates. Air from the chamber for VOCs was sampled by Tenax TA tube and analyzed by thermal desorption and GC/MSD. Results: Assuming that test represented dry cleaning and consumer's conditions well enough, we can conclude that immediate emissions after the dry cleaning of the scarfs caused elevated levels of TVOC, five VOCs (benzene, toluene, ethylbenzene, xylene, stylene), and decane group compounds. Conclusions: By removing the plastic bags which came from the dry cleaning shop or not, the storage conditions of dry cleaned scarfs by consumers during the storage time periods (one to three days) would be significant for reducing VOC emissions.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.3168-3172
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• 2007

As the minimum feature size decreases, control of contamination by nanoparticles is getting more attention in semiconductor process. Cleaning technology which removes nanoparticles is essential to increase yield. A reference wafer on which particles with known size and number are deposited is needed to evaluate the cleaning process. We simulated particle trajectories in the chamber by using FLUENT and designed a particle deposition system which consists of scanning mobility particle sizer (SMPS) and deposition chamber. Charged monodisperse particles are generated using SMPS and deposited on the wafer by electrostatic force. The experimental results agreed with the simulation results well in terms of particle number and deposition area according to particle size, flow rate and deposition voltage.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.242-243
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• 2015

Fault detection using optical emission spectra with modified K-means cluster analysis and principal component anal ysis are demonstrated for inductive coupl ed pl asma cl eaning processes. The optical emission spectra from optical emission spectroscopy (OES) are used for measurement. Furthermore, Principal component analysis and K-means cluster analysis algorithm is modified and applied to real-time detection and sensitivity enhancement for fluorocarbon cleaning processes. The proposed techniques show clear improvement of sensitivity and significant noise reduction when they are compared with single wavelength signals measured by OES. These techniques are expected to be applied to various plasma monitoring applications including fault detections as well as chamber cleaning endpoint detection.