• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권4호
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• pp.241-246
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• 1999

In this study, the piezoelectric ceramics PZT powders were synthesized by Wet-Dry combination method. And the flexible 1-3-0 type composites were favricated with piezoceramic PZT and Eccogel polymer matrix embedded 3rd phase. Dielectric constant of 1-3-0 type composites was lower than that of single phase PZT ceramics. Thickness mode coupling factor $k_t$ which was comparable with single phase PZT ceramics, and Mechanical Quality factor $Q_m$ were about 0.65 and 6 respectively. These composites are considered as a good candidates for broad-band type transducer applications. The acoustic impedance for 1-3-0 type composites was lower than that of single phase PZT ceramics. Therefore, these composites would be better used for hydrophone applications.

• The Korean Journal of Ceramics
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• 제5권1호
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• pp.55-72
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• 1999

A cheallenge in the aerospace field is to design new composites satisfying specific and sometimes conflicting properties. The key steps are ⅰ)the understanding and the control of the reaction between the reinforcement and the embedding matrix, ⅱ) the achievement of a coherent and robust matrix. The problems encountered to prepare particulate, 1D, 2D and 3D reinforced composites using polymeric are discussed. Emphasis is given to the control of the micro/nanostructure using Raman microspectrometry and depth-sensing microindentation, in order to get information on the micromechanics and fiber structure simultaneously, within ceramic (CMC's) and metal matrix (MMC's) composites.

• 한국안전학회지
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• 제13권1호
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• pp.13-18
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• 1998

It is well known in the fracture mechanics community that the fracture toughness of brittle materials, such as ceramics, can be improved improves significantly when fibers are added into the material. This is because in presence of fibers the cracks cannot propagate as freely as it can in absence of them. Fibers bridge the gap between two adjacent surfaces of the crack and reduce the crack tip opening displacement, thus make it harder to propagate. Several investigators have experimentally studied how the length, diameter and volume fraction of fibers affect the fracture toughness of chopped strand reinforced matrix composite materials. In this paper, matrix used ALS, Arizona Lunar Simulant, types of fiber used carbon steels and stainless steels. To analyze quantitatively fiber reinforced ALS composites, experimental and analytical methods was progressed. Load-displacement curve is used to experimental method, and FEM analysis program using ABAQUS is used analytical method.

• Composites Research
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• 제15권5호
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• pp.44-52
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• 2002

To study numerically the mechanical behaviors of advanced composite materials considering the microscopic phenomena as well as the macroscopic properties and behaviors, a multi-scale modeling and analysis by the mathematical homogenization method with the help of the finite element method(FEM) are reviewed. The hierarchical modeling strategy and the formulation are briefly described first to give some idea of the multi-scale framework. The latter half of this article focuses on the verification of the multi-scale analysis by the homogenization method in its applications to real advanced materials. The first example is the verification of the predicted macroscopic(homogenized) properties based on the microstructure of porous ceramics. In spite of the complexity of the random microstructure, the error between the predicted and the measured values was only 1%. Next, two applications to the process simulation of fiber reinforced polymer matrix composites are presented. The permeability characteristics are evaluated for sheared weave fabrics for resin transfer molding(RTM) simulation, and the thermoforming of FRTP sheet is analyzed considering the large deformation of the knit structure during the deep-draw forming was verified by comparison with the experimental results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.9-12
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• 1994

Epoxy-Ceramic Composite have good insulating, therma1 and mechanical properties, so it is studied actively on this material. In this thesis, we made a composite material b)\ulcorner filling Epoxy Resin with ceramics treated with Sillane Coupling Agent and studied dielectric and insulating characteristics according to treatment density of Sillane Coupling Agent and weight percent of filler. As a result, loss tangent increase and electrical breakdown voltage decrease according to increasing treatment density of sillane coupling agent because Interface matching between matrix and filler is not good. The best treatment density of sillane coupling agent is 0.5% water solution, in this density the best interface matching is achieved so good dielectric and insulation characteristics are shown. Dielectric and insulation characteristics according to weight percent of filler are best at 25wt.

• Applied Microscopy
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• 제26권4호
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• pp.447-456
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• 1996

Fracture surfaces of materials contain useful information ranging from crack path to the mechanism of fracture. Since limitation of electron transparency requires a sample in the form of thin foil for TEM observations, it is impossible to extract such information directly from the fracture surfaces. In this study, the method of surface replication from the ceramic fracture surface is employed to characterize the process of crack propagation in ceramic matrix composites using TEM analysis. The surface replica from the fracture surface in ceramic materials provides detailed surface morphology and more importantly, loosened particles on the fracture surface are collected. Electron diffraction and chemical composition analyses of these particles reveal crack path in the specimen. Furthermore, one can determine the mode of fracture by observing the fracture surface morphology from the image of replica. Two examples are given to illustrate the potential of the surface replication technique. In the first example, apparent toughness increase in $B_{4}C-Al$ composites at high strain rate is investigated by surface replication to elucidate the mechanism of fracture at different strain rates. The polytypes of SiC formed during the sintering of SiC-AlN composite and their effect on the fracture behavior of SiC-AlN composite are analyzed in the second example.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.303-306
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• 1999

In this study, the piezoelectric ceramics PZT powder was synthesized by Wet-Dry combination method. The flexible 1-3-0 type composites were fabricated with piezoceramic PZT and Eccogel polymer matrix embedded 3rd phase. This paper represents the acoustic properties with various 3rd phase wt.%. The acoustic impedance of 1-3-0 type composites was lower than that of single phase PZT ceramics. The pulse-echo response of transducer fabricated with 1-3-0 type composites was better than solid PZT transducer.

• 한국결정성장학회지
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• 제21권6호
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• pp.253-258
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• 2011

본 연구에서는 1_3형 압전복합체(1-3 type piezo-composite)의 전기-기계적 성능을 수치적으로 분석하였다. PZT 세라믹스의 압전물성 계산치를 실험치와 비교하여 수치 해석방법의 정확성을 검증하였다. 그리고 구성재료의 부피 비 및 물성, PZT 기둥의 종 횡비(aspect ratio) 등이 복합체의 $k_t$특성에 미치는 영향을 해석하였다. 그 결과, PZT 부피 비가 30 vol%까지 증가함에 복합체의 $k_t$ 특성은 급격하게 증가하다가 그 이상의 영역에서는 일정한 값에 수렴한다. 그리고 상대적으로 유연한 폴리머를 사용한 복합체가 전반적으로 우수한 $k_t$ 특성을 갖는다. 또한 PZT 부피비가 30 % 이하인 경우, 복합체의 $k_t$ 특성은 PZT 기둥의 종횡 비에 많은 영향을 받는다. 그러므로 $k_t$ 특성 향상을 위해서는 상대적으로 유연한 폴리머 및 우수한 압전특성의 PZT를 사용하여 복합체를 구성하는 것이 유리하다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2004년도 SMICS 2004 International Symposium on Maritime and Communication Sciences
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.