• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.11-17
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• 2002

Polymer/ceramic composite is of great interest as a dielectric material for embedded capacitors. This paper is concerned in the effects of $BaTiO_3$ particle size on epoxy/$BaTiO_3$ composite films for embedded capacitors. 6 different size powders smaller than 1 $\mu\textrm{m}$ in diameter and bisphenol-A type epoxy were used for this experiment. Dielectric constant of the epoxy/$BaTiO_3$ composite capacitors increases as the powder size increases at the same powder loading, which is due to the increase of tetragonality of the powders as particle size increases. And leakage current of the capacitors also increases dramatically as the powder size increases. It was explained that this is due to the decrease of the number of $BaTiO_3$epoxy/$BaTiO_3$ potential barriers per unit length and, moreover, the enhancement of potential barrier lowering effects caused by increase of potential drop per one barrier. As a result, there is tradeoff between high dielectric constant and low leakage current in the epoxy/$BaTiO_3$ composite capacitors. So it is important to select proper size $BaTiO_3$ powders in accordance with needs.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.5-8
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• 2005

In this paper, the electromechanical displacements of curved piezoelectric actuators composed of PZT ceramic and laminated composite materials are calculated based on high performance computing technology and the optimal configuration of composite curved actuator is examined. To accurately predict the local pre-stress in the device due to the mismatch in coefficients of thermal expansion, carbon-epoxy and glass-epoxy as well as PZT ceramic are numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers increases the number of degrees of freedom, large-scale structural analyses are performed through the PEGASUS supercomputer, which is installed in our laboratory. In the first stage, the curved shape of the actuator and the internal stress in each layer are obtained by the cured curvature analysis. Subsequently, the displacement due to the piezoelectric force (which is resulted from applied voltage) is also calculated. The performance of composite curved actuator is investigated by comparing the displacements obtained by the variation of thickness and elastic modulus of laminated composite layers. In order to consider the finite deformation in the first analysis stage and include the pre-stress due to curing process in the second stage, nonlinear finite element analyses are carried out.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.121-121
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• 2005

• Journal of Powder Materials
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• v.30 no.4
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• pp.356-362
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• 2023

Inorganic-organic composites find extensive application in various fields, including electronic devices and light-emitting diodes. Notably, encapsulation technologies are employed to shield electronic devices (such as printed circuit boards and batteries) from stress and moisture exposure while maintaining electrical insulation. Polymer composites can be used as encapsulation materials because of their controllable mechanical and electrical properties. In this study, we propose a polymer composite that provides good electrical insulation and enhanced mechanical properties. This is achieved by using aluminum borate nanowhiskers (ABOw), which are fabricated using a facile synthesis method. The ABOw fillers are created via a hydrothermal method using aluminum chloride and boric acid. We confirm that the synthesis occurs in various morphologies based on the molar ratio. Specifically, nanowhiskers are synthesized at a molar ratio of 1:3 and used as fillers in the composite. The fabricated ABOw/epoxy composites exhibit a 48.5% enhancement in mechanical properties, similar to those of pure epoxy, while maintaining good electrical insulation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.12
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• pp.782-787
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• 2017

There is growing interest in power inductors in which metal soft magnetic powder and epoxy resin are combined. In this field, the process technology for increasing the packing density of magnetic particles in an injection molding process is very important. However, little research has been reported in this regard. In order to improve the packing density, we investigated and compared the sedimentation heights of pastes for three types of soft magnetic alloy powders as a function of the mixing ratios and the type of resin used. Experimental results showed that the packing density was the highest (71.74%) when the mixing ratio was 80 : 16 : 4 (Sendust : Fe-S : CIP) according to the particle size using an SE-4125 resin. In addition, the packing density was found to be inversely related to the layer separation distance. As a result, it was confirmed that the dispersion of solid particles in the paste was important for curing; however, the duration of the curing process can greatly affect the packing density of the final composite.

• Journal of the Korean Ceramic Society
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• v.35 no.5
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• pp.421-428
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• 1998

The effect of silane coupling agents on the water stability of HAC/PVA based MDF cement composites which were modified with urethane and epoxy resin were studied as a function of the functional groups and addition amount of silane coupling agent. According to the composition of polymer matrix the silanes with different functional groups showed the different effectiveness. In case of the only PVA matrix the silane with vinyl functional group was more effective than other silanes. When the epoxy resin was added the silane of epoxy-methodxy group enhanced the flexural strength of dry and wet state more than other. In case of urethane-added MDF cement the silane of diamine group was effective and enhanced the water sta-bility fo MDF cement composite more and more as the addition amount of silane increased, Especially in case of warm-presed composite the effect of silane was enhanced By addition of 2wt% of silane with 야-amine group the flexural strength of urethane-added composites were enhanced by 20% more in dry state 40-70% in wet state in accord with the porosity analysis. The flexural strength of the poxy resin-added MDF cement composite was increased by addition of 1wt% and 2wt% silane of epoxy-methoxy group However the addition of 4wt% of silane decreased the flexural strength of dry and wet state by formation of closed pore in the polymer matrix.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.332-335
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• 2012

A molded transformer is maintenance-free, which makes it unnecessary to replace the insulating material, like in an oil-filled transformer, because the epoxy, which is a molded insulating resin, does not suffer variations in its insulating performance for heat cycles over a long time, as compared to insulating oil. In spite of these advantages, a molded transformer may still be accessed by the user, which is not good in regards to reliability or noise compared to the oil transformers. In particular, a distrust exists regarding reliability due to the long-term insulating performance. These properties have been studied in regards to the improvement of epoxy composites and molded transformer insulation. There have nevertheless been insufficient investigations into the insulation properties of epoxy composites. In this study, it is a researching of the epoxy for insulating material. In order to prepare the specimens, a main resin, a hardener, an accelerator, and a nano/micro filler were used. Varying amounts of TiO2 and ZnO nano fillers were added to the epoxy mixture along with a fixed amount of micro silica. This paper presents the DC insulation breakdown test, thermal expansion coefficient, and thermal conductivity results for the manufactured specimens. From these results, it has been found that the insulating performance of nano/micro epoxy composites is improved as compared to plain molded transformer insulation, and that nano/micro epoxy composites contribute to the reliability and compactness of molded transformers.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.167-170
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• 2003

In this paper, the electromechanical displacements of curved actuators using laminated composites are calculated by finite element method to design the optimal configuration of curved actuators. To predict the pre-stress in the device due to the mismatch in coefficients of thermal expansion, the carbon-epoxy and glass- epoxy as well as PZT ceramic is also numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers causes the numbers of degree of freedom to increase, large-scale structural analyses are performed in a cluster system in this study. The curved shape and pre-stress in the actuator are obtained by the cured curvature analysis. The displacement under the piezoelectric force by an applied voltage is also calculated to compare the performance of curved actuator. The thickness of composite is chosen as design factor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.6
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• pp.495-500
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• 2009

The ceramic($BaTiO_3$)-polymer(epoxy) composites have been widely investigated as dielectric materials for embedded capacitors in printed circuit boards (PCBs). The dielectric properties of $BaTiO_3$/epoxy composites prepared using the agglomerated $BaTiO_3$ particles were investigated in the present study. The dielectric constants of the composites prepared using the agglomerated $BaTiO_3$ particles were about 2 times higher than those of the composites with the dispersed $BaTiO_3$ particles. The insulation resistance of the composites prepared using the agglomerated $BaTiO_3$ particles were lower than those of the composites with dispersed $BaTiO_3$ particles. As a result, there is tradeoff between high dielectric constant and insulation resistance in the $BaTiO_3$/epoxy composites. So it is important to select proper agglomerated or dispersed $BaTiO_3$ particles in accordance with needs.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.12
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• pp.751-756
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• 2017

A molding-type power inductor is an inductor that uses a hybrid material that is prepared by mixing a ferrite metal powder coated with an insulating layer and an epoxy resin, which is injected into a coil-embedded mold and heated and cured. The fabrication of molding-type inductors requires various techniques such as for coil formation and insertion, improving the magnetic properties of soft magnetic metal powder, coating an insulating film on the magnetic powder surface, and increasing the packing density by well dispersing the powder in the epoxy resin. Among these aspects, researches on additives that can disperse the metal soft magnetic powder having the greatest performance in the epoxy resin with high charge have not been reported yet. In this study, we investigated the effect of silanes, KBM-303 and KBM-403, and a commercial dispersant on the dispersion of metal soft magnetic powders in epoxy resin. The sedimentation height and viscosity were measured, and it was confirmed that the silane KBM-303 was suitable for dispersion. For this silane, the packing density was as high as about 72.49%. Moreover, when 1.2 wt% of dispersant BYK-103 was added, the packing density was about 80.5%.