• Title/Summary/Keyword: Ceramic package

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Design Parameter Optimization for Hall Sensor Application

  • Park, Chang-Sung;Cha, Gi-Ho;Kang, Hyun-Soon;Song, Chang-Sup
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.86.3-86
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    • 2001
  • Hall effect sensor using 7um, 1.7 ohm-cm or 10um, 3.5 ohm-cm Bipolar process was successfully developed. The Hall sensor consists of various patterns, such as regular shapes, rectangles, diamond, hexagon and cross shapes to optimize offset voltage and sensitivity for proper applications. In order to measure offset voltage in chip scale the Agilent company´s 4156C and Nano-Voltage Meter were used and the best structure in offset voltage was finally selected by using ceramic package. The patterns appear to be the quadri-rectangular patterns entirely and three-parallelogram patterns. The measured offset voltages were found to be about 173-365uV. Meanwhile, in ...

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Effect of underlayer electroless Ni-P plating on deposition behavior of cyanide-free electroless Au plating (비시안 무전해 Au 도금의 석출거동에 미치는 하지층 무전해 Ni-P 도금 조건의 영향)

  • Kim, DongHyun;Han, Jaeho
    • Journal of Surface Science and Engineering
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    • v.55 no.5
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    • pp.299-307
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    • 2022
  • Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.

Modified Atmosphere Packaging of Shiitake Mushroom Packed with Perforated Film and Ceramic Films (기공필름과 광물질 연입 필름 포장한 표고버섯의 MAP효과)

  • 정문철;남궁배;이호준;임정호
    • Food Science and Preservation
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    • v.8 no.1
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    • pp.47-53
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    • 2001
  • In order to investigate the effect of two type of ceramic film(15% SiO$_2$ incorporated LDPE, 10% zeolite incorporated LDPE), perforated film and LDPE film on freshness of shiitake mushroom, weight loss, surface color and marketability of mushroom were measured during MA storage at 5 $\^{C}$ and 20$\^{C}$. The effect of packaging films on weight loss and marketability index of shiitake mushroom at 20$\^{C}$ was negligible due to its rapid physiological changes. However, the effect of packaging films on surface color of shiitake mushroom was significant at 20$\^{C}$ storage, but not at 5$\^{C}$ storage. During MA storage of shiitake mushroon, discoloration were reduced effectively by ceramic films and weight loss were by LDPE film, but they had little difference between packaging 51ms. However, there were significant differences among the packaging films in marketability of mushroom induced by water vapor inside package and accelerate its spoilage and browning. Ceramic film(15% SiO$_2$ incorporated LDPE) showed best result to maintain marketability of shiitake mushroom and zeolite incorporated film, perforated film, LDPE film in order.

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Effect of High Concentration Carbon Dioxide and Pre-Cooling Treated with Solid Carbon Dioxide on the Storability of Radish Sprout in MA Storage (고체 이산화탄소를 이용한 고농도 이산화탄소와 예냉 처리가 싹채소의 저장성에 미치는 영향)

  • Kang, Ho-Min;Choi, In-Lee;Kim, Il-Seop;Park, Keun-Woo
    • Journal of Bio-Environment Control
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    • v.18 no.3
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    • pp.285-290
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    • 2009
  • The solid carbon dioxide used for prolongation shelf life of radish sprout that was just 7days. The developed equipment for treated carbon dioxide consisted of solid carbon dioxide evaporated part and high carbon dioxide and low temperature treated part that can hold products. The inner temperature of equipment decreased temperature to below $5^{\circ}C$ from room temperature for 10minutes and carbon dioxide concentration increased to 80%. The radish sprouts treated 4 different conditions that was nontreated condition (control), solid carbon dioxide put into package (CO2-1), solid carbon dioxide treated before storage using the developed equipment (CO2-2), solid carbon dioxide treated before storage and during storage, and sprout packaged with solid carbon dioxide (CO2-3). These radish sprout packaged with $25{\mu}m$ ceramic film stored at $8^{\circ}C$. The high carbon dioxide treatment did not affect the fresh weight loss. The carbon dioxide and oxygen content in package changed 40% and 10%, respectively in CO2-1 and CO2-2 at 1day after treatments. But carbon dioxide content of all treatments was decreased to 5% and stabilized. The high carbon dioxide showed the effect of reduction ethylene production, but did not affect to visual quality and offodor.

Process design for solution growth of SiC single crystal based on multiphysics modeling (다중물리 유한요소해석에 의한 SiC 단결정의 용액성장 공정 설계)

  • Yoon, Ji-Young;Lee, Myung-Hyun;Seo, Won-Seon;Shul, Yong-Gun;Jeong, Seong-Min
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.26 no.1
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    • pp.8-13
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    • 2016
  • A top-seeded solution growth (TSSG) is a method of growing SiC single crystal from the Si melt dissolved the carbon. In this study, multiphysics modeling was conducted using COMSOL Multiphysics, a commercialized finite element analysis package, to get analytic results about electromagnetic analysis, heat transfer and fluid flow in the Si melt. Experimental results showed good agreements with simulation data, which supports the validity of the simulation model. Based on the understanding about solution growth of SiC and our set-up, crystal growth was conducted on off-axis 4H-SiC seed crystal in the temperature range of $1600{\sim}1800^{\circ}C$. The grown layer showed good crystal quality confirmed with optical microscopy and high resolution X-ray diffraction, which also demonstrates the effectiveness of the multiphysics model to find a process condition of solution growth of SiC single crystal.

Comparison Packing Materials for Proper MAP of Mixed Sprout Vegetables (혼합 싹채소의 MAP를 위한 포장재 비교)

  • Kang, Ho-Min;Choi, In-Lee;Kim, Il-Seop
    • Journal of Bio-Environment Control
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    • v.17 no.3
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    • pp.226-230
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    • 2008
  • A comparison was made of the effect of different packaging materials on storability of mixed sprout vegetables (alfalfa, broccoli, cabbage, radish, and red radish) stored at $8^{\circ}C$. They were packaged by several kinds of films that were 50 fm thickness low-density polyethylene film (PE 50), 50 fm thickness polypropylene film (PP 50), $50{\mu}m$ thickness ceramic film (CE 50), $25{\mu}m$ thickness ceramic film (CE 25), $10\sim13{\mu}m$ thickness polyethylene film (wrap), and polyethylene terephthalate box with ventilation hole (box). The fresh weight of mixed sprouts packaged with different materials decreased below to 2% except box packages that decreased around 7% compared with initial weight. The atmospheres that were developed inside the different materials during storage differed significantly. The carbon dioxide and oxygen concentration of packages were kept properly with 5% in CE 25, but the PE 50 and CE 50 treatments showed higher carbon dioxide and lower oxygen concentration. So the off-flavor of mixed sprouts was more severe in the PE 50 and CE 50 treatment. The ethylene concentration of packages showed lowest in box treatment, followed by PP 50, wrap and CE 25 treatment. The overall quality of mixed sprouts was lower in PE 50 and CE 50 than CE 25 treatment after 10 days storage, supposed to be resulted from highest ethylene concentration and lowest oxygen concentration. Conclusionally, the CE 25 film that showed below 1% fresh weight loss, 5% carbon dioxide, 5% oxygen and below 4 ppm ethylene concentration in package may be a proper packaging material for mixed sprout vegetables.

Removal of Aqueous Calcium Ion by Micellar Enhanced Ceramic Membranes Adding Surfactant (계면활성제를 첨가한 미셀 형성 세라믹 분리막에 의한 칼슘이온 제거)

  • Park, Jin-Yong;Park, Bo-Reum
    • Membrane Journal
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    • v.18 no.1
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    • pp.7-25
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    • 2008
  • Sodium dodecyl sulfate, which was anionic surfactant, at a concentration higher than its critical micellar concentration was added to calcium solution for forming micelles. Then aggregates were formed by adsorption or binding of calcium ions on the surface of micelles, and gathering between them, and then rejected by two kinds of ceramic membranes to remove calcium ions. As result, rejection rates of calcium were higher than 99.98%. And in our experimental range the higher TMP trended to increase the resistance of membrane fouling ($R_f$), total permeate volume ($V_T$), dimensionless permeate flux ($J/J_o$) and permeate flux (J) because TMP was driving force. And we investigated effects of $N_2$-back-flushing time and filtration time, that was back-flushing period, during periodic $N_2$-back-flushing on ceramic membranes. As result, optimal BTs for NCMT-623l ($0.07{\mu}m$ pore size) and NCMT-7231 membrane ($0.10{\mu}m$) were 10 sec and 15 sec, respectively. Also, optimal FT was 5 min for both membranes, and the frequent $N_2$-back-flushing could decrease membrane fouling effectively. Then, the optimal conditions resulting from our experiments for synthetic calcium solution were applied to groundwater using as washing process of soymilk package. As result, rejection rates of calcium were higher than 99.98%.

Porosity Control of the Sealing Glass for Joining Alumina Components in a NaS Battery Cell Packaging (NaS 배터리 셀 패키지의 알루미나 컴포넌트 접합용 Sealing Glass의 기공율 제어)

  • Kim, Chi Heon;Heo, Yu Jin;Kim, Hyo Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.57-61
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    • 2016
  • Thick film sealing glass paste is required for cell packaging of NaS based battery for energy storage system, to join the beta-alumina electrolyte tube and the alpha-alumina battery cell cap components. This paper presents the effect of the particle sizes of seal glass powder and the sealing temperatures on the microstructure of the glass sealants was investigated. It was found that the larger in the particle size of seal glass powder, the smaller the pore volume and the number of pores in a unit area. Also, the number of pores decreased with increasing the sealing temperatures while the pore size was increased. This result enables the control of porosity, pore distribution and number of pores in a microstructure of glass sealing component by proper selection of glass powders particle size and sealing temperature.

Importance of Hardness and Elasticity of Polymer Powders on Growth of Ceramic-based Polymer Composite Thick Films Using Aerosol Deposition Method (Aerosol Deposition Method를 이용한 세라믹 기반 폴리머 복합체 후막의 성장에 있어 폴리머 파우더의 경도와 탄성의 중요성)

  • Na, Hyun-Jun;Yoon, Young-Joon;Kim, Jong-Hee;Nam, Song-Min
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.345-345
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    • 2008
  • 최근 전자 소자의 고주파화, 소형화에 대한 요구가 증대 되면서 많은 소자들을 하나의 시스템에 3차원적으로 실장시키는 SOP (System-on-Package)가 새로운 대안으로 떠오르고 있으며 SOP를 실현하기 위해서는 집적기판에 대한 저온화 공정 기술이 절실히 필요한 실정이다. 현재 집적기판에 사용되는 재료로서 세라믹이 널리 알려져 있지만 세라믹은 취성이 있으며 $1000^{\circ}C$ 이상의 고온화 공정 프로세스를 필요로 하는 근본적인 약점이 있다. 이에 본 연구에서는 상온에서 고속으로 치밀한 성막을 가능케 하는 Aerosol Deposition Method (ADM)를 이용하여 최초로 세라믹-폴리머 복합체 후막을 성공적으로 제작하였다. XRD와 FT-IR 분석 결과 $Al_2O_3$-PMMA, $Al_2O_3$-PI 혼합물을 출발 파우더로 사용하여 제조한 후막이 세라믹-폴리머 복합체임을 확인할 수 있었다. 또한 SEM 분석결과 $Al_2O_3$-PMMA 복합체와 $Al_2O_3$-PI 복합체의 표면 양상이 매우 다르다는 점을 확인하였으며 $Al_2O_3$-PMMA 복합체의 성막률이 $Al_2O_3$-PI 복합체의 성막률에 비해 매우 낮음을 확인하였다. 이러한 현상들은 폴리머 파우더들의 경도와 탄성 차이 때문인 것으로 사료되어 이를 증명하기 위한 실험을 실시하였다. 결국 PMMA 막과 PI 막에 대한경도측정결과와 PMMA 파우더와 PI 파우더의 유성 볼밀링 전후에 대한 SEM 이미지를 통해 PMMA 파우더가 PI 파우더에 비해 경도가 낮으며 반면 탄성이 높다는 것을 간접적으로 확인할 수 있었다. 이와 같은 분석을 통하여 ADM을 이용한 세라믹-폴리머 복합체 후막의 제조에 있어 폴리머 파우더의 경도와 탄성이 매우 큰 영향을 미친다는 것을 알 수 있었다. 본 연구에서는 세라믹-폴리머 복합체 후막을 성공적으로 제조하기 위해서 폴리머 파우더의 적절한 선택이 중요함을 알 수 있었으며 ADM을 이용한 세라믹-폴리머 복합체 후막의 제조에 대한 가이드 라인을 제시할 수 있을 것으로 기대된다.

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Realization of gas sensor using LTCC(Low Temperature Cofired Ceramic) technology (LTCC 기술을 이용한 가스센서 구현)

  • Jeon, J.I.;Choi, H.J.;Lee, Y.B.;Kim, K.S.;Park, J.H.;Kim, M.Y.;Im, C.I.;Mun, J.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.369-370
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    • 2005
  • LTCC (Low Temperature Cofired Ceramic) technology is one of technologies which can realize SIP (System-In-a-Package). In this paper realization of gas sensor using LTCC technology was described. In the conventional gas sensor structure, wire bonding method is generally used as an interconnection method whereas in the LTCC sensor structure, via was used for the interconnection. As sensing materials, $SnO_2$ was adopted. The effect of frit glass portion on the adhesion of the sensing material to the LTCC substrate and the electrical conductivity of the sensing material were analyzed. AgPd, PdO, Pt was added to the sensing material as an additive for improving the gas sensitivity and electrical conductivity and the effect of the amount of additives in the sensing material on the electrical conductivity was investigated. The effect of the amount of frit glass in the termination on the sensor performance, especially mechanical integrity, was considered and the crack initiation and propagation in the boundary between the sensing material and the termination was studied.

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