• 한국태양에너지학회:학술대회논문집
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• 2008.04a
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• pp.247-251
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• 2008

In this paper. we analyze electrical characteristics of photovoltaic module according to mechanical load test. Using the equipment for giving load on the surface of module, dark current-voltage is measured. By varying load from 0kg to 206kg, slight different I-V curve is detected. From this, reduced shunt resistance is roughly calculated and micro crack is assumed to be happened. system Through this experiment, periodic external force on PV module might give an negative effect. The detailed analysis is described in the following paper.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.48.1-48.1
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• 2011

In this presentation, We monitored weather data, such as global irradiance, ambient temperature, temperature of PV module, relative humidity and windspeed for 2 years, for determining accelerated test condition. then, we determined the temperature limit of accelerated test through weather data and FEM analysis. Detailed procedures will be summarized in this work. After analysing outdoor stress such as thermal stress, we decided main failure modes and mechanisms of PV module, especially solder joint of ribbon wire. we carried out the measurement of material properties such as thermal expansion coefficient for planning of accelerated test. we designed accelerated test based on FEM analysis results. we carried out thermal cycling test with 1 cell mini module for 3 months. We monitored the change of electrical performance every 1 week such as Voc, Isc, Pmax, etc. and then, we analized the ribbon wire/electrode intefaces. Detailed results will be summarized in this work.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.5
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• pp.463-470
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• 2015

Solar cell is typical representative of renewable green energy. Silicon wafer contributes about 66 percent to its cost structure. In its manufacturing, micro-cracks are often occurred due to manufacturing process such as wire sawing, grinding and cleaning. Their detection and classification are important to process feedback information. In this paper, a classification method of micro-cracks is proposed, based on the fusion of principal component analysis(PCA) and neural network. The proposed method shows that it gives higher results than single application of two methods, in terms of shape and size classification of micro-cracks.

• Computers and Concrete
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• v.2 no.2
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• pp.147-164
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• 2005

This paper summarizes an experimental study on the seismic behavior of lower stories of a mid-rise reinforced concrete frame building. Two reinforced concrete frames with two stories and one span were tested and each frame represents lower two stories of an 11-story RC frame building. Both frames were designed in accordance with Japanese design guidelines and were identical except in the variation of axial force. The tests demonstrated that the overall load-displacement relations of the two frames were nearly the same and the first-story column shear was closely related to the column axial load. The columns and beams elongated during both of the tests, with the second-floor beam elongation exceeding 1.5% of the beam clear span length. The frame with higher axial loads developed more cracks that the frame under moderate axial load.

• Structural Engineering and Mechanics
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• v.61 no.3
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• pp.397-406
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• 2017

The use of fiber reinforced polymer (FRP) for torsional strengthening of reinforced concrete (RC) single cell box beams has been analyzed considerably by researchers worldwide. However, little attention has been paid to torsional strengthening of multicell box girders in terms of both experimental and numerical research. This paper reports the experimental work in an overall investigation for torsional strengthening of multicell box section RC girders with externally-bonded Carbon Fiber Reinforced Polymer CFRP strips. Numerical work was carried out using non-linear finite element modeling (FEM). Good agreement in terms of torque-twist behavior, steel and CFRP reinforcement responses, and crack patterns was achieved. The unique failure modes of all the specimens were modeled correctly as well.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2006.04a
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• pp.82-88
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• 2006

In People usually think that smart materials and smart structures have not been developed until recent years. But those kinds of sensors have already been used for sensing damage in a variety of materials and structures. Two typical examples are piezoelectric materials (e.g., PZT) and electric strain gauges. Load cell is an example that utilizes the piezoelectric property to measure the change in physical quantities occurred by applied loads, while strain gauges are used to measure the deformation of compressive and tension members. The feasibility of using smart materials is realized for a monitoring technology when those sensors are used to monitor damages at inside or outsider of the structures. In this study, a fundamental study on the development of self diagnostic smart concrete using PZT, and unsaturated polyester electric resistance sensor.

• Journal of the Korean Society of Industry Convergence
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• v.4 no.4
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• pp.379-386
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• 2001

The lower toughness or brittle materials for mechanical test lead to the additional requirement that applied displacements be controlled with high resolution. Biaxial tension and shear tester using stepper motor with harmonic driver is shown. The device had to be high resolution so that the crack initiation process of slow extension and steady growth could be examined, Grip plates were connected to a linear bearing and actuator. The actuators consisted of stepper motors with harmonic driver connected to pre-loaded ball screw and nut assemblies. The encoders and motor controllers were connected to a personal computer so that arbitrary displacements histories could he prescribed in normal and tangential directions. The linear bearings were used to react loads perpendicular to their axes while allowing low friction, parallel movement of the attached grips. Load cells measured the reactions normal and tangential. the loads measured the reactions were recorded by the computer.

• Resources Recycling
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• v.20 no.6
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• pp.50-55
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• 2011

Using ultrasonic irradiation, the separation and recovery of PV cell, made of silicon wafer, from PV module was carried out through selective decomposition of EVA used as an interlaminated binder. The ultrasonic cleaner of bath-type (Output: 130 W, Frequency: 40 kHz) was used as an ultrasonic apparatus in this research. With the fixed distance of 2 cm, from ultrasonic generator to PV cell, the experiment of EVA decomposition was performed in various organic solvents such as Toluene, Trichloroethylene, O-dichlorobenzene, Benzene. And also their concentrations and temperature was changed to survey the optimum conditions. However EVA can be decomposed perfectly at $55^{\circ}C$ within 160 min in 5 M of all kinds of solvent, PV cell may be recovered with being damaged or broken severely. This damage may be resulted from the swelling of EVA in the process of decomposition. Whereas, at the condition of 5 M at $65^{\circ}C$, PV cell can be recovered with the state of minor damage or crack. This implies that the decomposition rate of EVA increases with an increase of temperature, thereby EVA can be decomposed before the swelling of EVA layer. Conclusively, it is possible for PV cell to be recovered within 40 min, at $65^{\circ}C$ in 5 M, with less damage.

• Journal of the Korean Solar Energy Society
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• v.37 no.2
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• pp.77-85
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• 2017

Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> $250^{\circ}C$), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and $175^{\circ}C$). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at $120^{\circ}C$ decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at $150^{\circ}C$, $175^{\circ}C$. The peel test indicates that the unstable performance of sample laminated at $120^{\circ}C$ is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is $150^{\circ}C$, considering stability and energy consumption during the fabrication.

• Journal of Welding and Joining
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• v.32 no.6
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• pp.75-81
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• 2014

Usage of heavy metal element (Pb, Hg and Cd etc.) in electronic devices have been restricted due to the environmental banning of the European Union, such as WEEE and RoHS. Therefore, it is needed to develop the Pb-free solder plated ribbon in photovoltaic (PV) module. This study described that degradation characteristics of PV module under damp heat (DH, $85^{\circ}C$ and 85% R.H.) condition test for 1,000 h. Solar cell ribbons were utilized to hot dipping plate with Pb-free solder alloys. Two types of Pb-free solder plated ribbons, Sn-3.0Ag-0.5Cu (SAC305) and Sn-48Bi-2Ag, and an electroless Sn-40Pb solder hot dipping plated ribbon as a reference sample were prepared to evaluate degradation characteristics. To detect the degradation of PV module with the eutectic and Pb-free solder plated ribbons, I-V curve, electro-luminescence (EL) and cross-sectional SEM analysis were carried out. DH test results show that the reason of maximum power (Pm) drop was mainly due to the decrease fill factor (FF). It was attributed to the crack or oxidation of interface between the cell and the ribbon. Among PV modules with the eutectic and Pb-free solder plated ribbon, the PV module with SAC305 ribbon relatively showed higher stability after DH test than the case of PV module with Sn-40Pb and Sn-48Bi-2Ag solder plated ribbons.