• Title/Summary/Keyword: Caps

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Developing a water discharge anchor & trap bolt to prevent basic salt from penetrating to harbor structures (해수 염기 침투방지를 위한 항만구조물 보수보강용 물배출 앵커 및 트랩볼트 개발에 관한 연구)

  • Ock, Jong-Ho;Moon, Sang-Deok;Lee, Hwa-Sun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.3
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    • pp.535-541
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    • 2018
  • Most construction methods for the repair and reinforcement of old reinforced concrete harbor structures involve a process of applying a fiber complex or fiber complex panel just like wallpaper to the bottom of structures, such as slabs or beams. On the other hand, these techniques result in the sealing of repaired and reinforced portions of the structures by the fiber products, preventing moisture, such as rainwater entering the structures through the upper surfaces of the slabs or beams from being released, and causing the entire concrete covering of the structures to be peeled off in the long run. To prevent this, it is necessary to develop a technique to protect the basic salt from the sea water from penetrating into the structures while expelling the water absorbed in the structures swiftly. This study attempted to solve the problem by modifying the anchor bolts currently used to repair and reinforce the port structure. That is, by drilling holes into the body of anchor bolts and modifying the caps of the bolts to produce a structure that would let the water flow like a toilet trap, the moisture inside of the structure could be drained through the holes in the anchor bolts. The water discharge anchor bolts developed were tested and observed for 6 months; the water was discharged in 73% of the anchors (200 anchor installation, 145 anchors).

Comparison of amino acid and free amino acid contents between cap and stipe in Flammulina velutipes and Pleurotus ostreatus (팽이와 느타리버섯 자실체의 갓과 대에서 아미노산 및 유리아미노산 함량 비교)

  • Kim, Jung-Tae;Kim, Mi-Jung;Jhune, Chang-Sung;Shin, Pyung-Gyun;Oh, YounLee;Yoo, Young-Bok;Suh, Jang-Sun;Kong, Won-Sik
    • Journal of Mushroom
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    • v.12 no.4
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    • pp.341-349
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    • 2014
  • The composition and content of amino acid and free amino acid were separately compared in cap and stipe of fruitbody obtained from different color strains in winter mushroom and oyster mushroom strains. The result showed different kinds and amount of amino acids according to the mushroom parts, strains and kinds. Tryptophane was not detected in any mushrooms. Alanine was also not detected in all oyster mushroom strains. The content of glutamic acid was the highest and that of methionine, phenylalanine and cysteine were very low in all mushroom strains. When compared by parts, the ratio of amono acids showed similar tendency in composition. Generally the content of amono acids showed higher in caps than in stipes. The profile and content of free amino acid showed a lot of variation between cap and strip in the intra and inter mushrooms.

Damages and Developmental Characteristics of Fungus Gnat, Lycoriella ingenua (Diptera: Sciaridae) in Button Mushroom Cultivation (양송이버섯 재배에서의 긴수염버섯파리(Lycoriella ingenua)의 발달과 피해)

  • Lee, Byung-joo;Lee, Mi-Ae;Kim, Yong-Gyun;Lee, Kwang-won;Lee, Byung-eui;Seo, Geon-sik
    • Journal of Mushroom
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    • v.13 no.2
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    • pp.145-150
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    • 2015
  • Mushroom sciarid fly Lycoriella ingenua (Dufour), syn. L. mali (Fitch) is one of the most common fly pests affecting the mushroom cultivation in Korea. This study was carried out to investigate the development at different temperatures and damages of L. ingenua in A. bisporus mushroom cultivation. Rearing of mushroom flies were carried out on mycelial culture in Petri dishes. The development of L. ingenua from egg to adult at the temperature of 16, 20, 24, $28^{\circ}C$ were 35.2, 25.8, 23.5, and 22.2 days, respectively. Adult flies invade mushroom farms and oviposit in freshly spawned compost. Damages are mainly caused by the larvae of 1-7 mm, which feed on growing mycelium and also developing stipes and caps of mushrooms. Adult flies spoil the appearance of the fruiting bodies, spread various fungal and bacterial disease, and transmit mites. The damages by mushroom flies increased without pest control causing yield loss of up to 27%.

Identification of the Volatile Compounds in Polyethylene Terephthalate Bottles and Determination of Their Migration Content into Mineral Water (PET 생수병 내 휘발성 물질의 동정 및 이행량 분석)

  • Jung, Eui Min;Kim, Dong Joo;Lee, Keun Taik
    • Korean Journal of Food Science and Technology
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    • v.46 no.1
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    • pp.19-24
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    • 2014
  • This study was carried out to identify the volatile organic compounds (VOCs) in polyethylene terephthalate (PET) bottles and to determine the extent to which VOCs migrate into mineral water during the bottling process and storage. A greater amount of nonanal and decanal was generated from the PET bottles than from the PET preforms. Benzene, ethylbenzene, nonanal, and vinyl benzoate were identified from the PET bottles when the incubation temperature of the headspace solid-phase microextraction (HS-SPME) sampler was set to 60, 80, and $100^{\circ}C$. As the incubation temperature increased, the concentrations of nonanal, vinyl benzoate, and decanal increased significantly. When the high-density polyethylene (HDPE) PET bottle caps were extracted with dichloromethane, the level of Irgafos 168 was found to be $206{\pm}20.1\mu}g/g$. The concentration of 2,4-di-tert-butylphenol in water was $4.80{\pm}0.2{\mu}g/L$. Therefore, it is necessary to avoid exposing PET and HDPE resins to high temperatures during the manufacturing process and storage of bottled water.

Building an Analytical Platform of Big Data for Quality Inspection in the Dairy Industry: A Machine Learning Approach (유제품 산업의 품질검사를 위한 빅데이터 플랫폼 개발: 머신러닝 접근법)

  • Hwang, Hyunseok;Lee, Sangil;Kim, Sunghyun;Lee, Sangwon
    • Journal of Intelligence and Information Systems
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    • v.24 no.1
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    • pp.125-140
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    • 2018
  • As one of the processes in the manufacturing industry, quality inspection inspects the intermediate products or final products to separate the good-quality goods that meet the quality management standard and the defective goods that do not. The manual inspection of quality in a mass production system may result in low consistency and efficiency. Therefore, the quality inspection of mass-produced products involves automatic checking and classifying by the machines in many processes. Although there are many preceding studies on improving or optimizing the process using the data generated in the production process, there have been many constraints with regard to actual implementation due to the technical limitations of processing a large volume of data in real time. The recent research studies on big data have improved the data processing technology and enabled collecting, processing, and analyzing process data in real time. This paper aims to propose the process and details of applying big data for quality inspection and examine the applicability of the proposed method to the dairy industry. We review the previous studies and propose a big data analysis procedure that is applicable to the manufacturing sector. To assess the feasibility of the proposed method, we applied two methods to one of the quality inspection processes in the dairy industry: convolutional neural network and random forest. We collected, processed, and analyzed the images of caps and straws in real time, and then determined whether the products were defective or not. The result confirmed that there was a drastic increase in classification accuracy compared to the quality inspection performed in the past.

Flip Chip Process by Using the Cu-Sn-Cu Sandwich Joint Structure of the Cu Pillar Bumps (Cu pillar 범프의 Cu-Sn-Cu 샌드위치 접속구조를 이용한 플립칩 공정)

  • Choi, Jung-Yeol;Oh, Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.4
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    • pp.9-15
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    • 2009
  • Compared to the flip-chip process using solder bumps, Cu pillar bump technology can accomplish much finer pitch without compromising stand-off height. Flip-chip process with Cu pillar bumps can also be utilized in radio-frequency packages where large gap between a chip and a substrate as well as fine pitch interconnection is required. In this study, Cu pillars with and without Sn caps were electrodeposited and flip-chip-bonded together to form the Cu-Sn-Cu sandwiched joints. Contact resistances and die shear forces of the Cu-Sn-Cu sandwiched joints were evaluated with variation of the height of the Sn cap electrodeposited on the Cu pillar bump. The Cu-Sn-Cu sandwiched joints, formed with Cu pillar bumps of $25-{\mu}m$ diameter and $20-{\mu}m$ height, exhibited the gap distance of $44{\mu}m$ between the chip and the substrate and the average contact resistance of $14\;m{\Omega}$/bump without depending on the Sn cap height between 10 to $25\;{\mu}m$.

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Preference of Herbal Medicine Packagings for Caregivers (환아 보호자 대상으로 실시한 한약 용기 선호도 조사)

  • Jeong, A Ram;Lee, Hye Yoon;Cheon, Jin Hong;Kim, Ki Bong
    • The Journal of Pediatrics of Korean Medicine
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    • v.28 no.4
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    • pp.71-84
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    • 2014
  • Objectives The aim of this study is to investigate preferred herbal medicine packaging. Methods The study used questionnaires for the caregivers, who have administered their children herbal and western medicine. 106 of them were visited the Department of Pediatrics, the Oriental Medicine Hospital of ${\bigcirc}{\bigcirc}$ University, during the period between in 2014. We used PASW Stastics 18.0 to analyze different dosing methods, and preferred packaging and drug formulations. Results 1. 77.4% answered that they use cups to administer medications, 9.4% transferred it to other plastic bottles, 8.5% used straw to drink from the pouch, 4.7% drank as it is inside the pouch. Method of taking it was not very significant depending on the age. 2. Compare to pills and capsules, 48 responders answered that pills and capsules are easier to take, 11 answered herbal medication is easier to take. 32 answered that there were no significant difference. 3. 45.3% reported vinyl pouch was preferable, 44.3% answered spout pouch was preferred, 5.7% answered bottles are convenient, and another 5.7% responders thought cup was fine. Others include syrup bottles had 1 person. These varying preferences were not depending on the age variations. 4. 56.3% answered that price was the main reason why they prefer one over the other. Others 29.2% stated convenience, 12.5% reported safety, and 10.4% people answered ease of administration as their main reason for their preferences. Conclusions Based on this study, numbers of parents felt inconvenient administering herbal medicine as a vinyl pouch, and felt necessary to improve this. However, price and other reasons made vinyl pouch still more preferable option. Vinyl pouch that we are using today didn't show any safety issues. Therefore, it is recommended to still use vinyl pouch, but with caps on top to improve administration and distinguishing issues.

Quantitation of Phthalate and Adipate in Natural Mineral Water and PET Container (먹는 샘물 및 PET 용기 중 Phthalate와 Adipate의 정량분석)

  • Shin, Ueon-Sang;Ahn, Hye-Sil;Shin, Ho-Sang
    • Analytical Science and Technology
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    • v.15 no.5
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    • pp.475-481
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    • 2002
  • The determination of phthalates and adipate in natural mineral water and its container is described. Phthalates and adipate were extracted from natural mineral water by liquid-liquid extraction with methylene chloride, concentrated and then injected in GC-MS (SIM). Phthalates and adipate from 1) PET, cap, label and glue were extracted in Soxhlet with 50 mL of carbon tetrachloride, purified with silicagel and detected with GC-MS (SIM). Peak shapes and quantitation of phthalates and adipate were excellent, with linear calibration curves over a range of $0.1{\sim}10{\mu}g/L$ in water sample ($r^2$ > 0.996) and over a range of $1{\sim}1,000{\mu}g/Kg$ in solid samples ($r^2$>0.994). The detection limits of analytes were $0.002{\sim}0.010{\mu}g/L$ in water and $0.01{\sim}0.02{\mu}g/Kg$ in solid samples. Five kinds of natural mineral water samples, two PETs, two labels, two caps and two glues were quantified by the described procedure. As a results, the concentrations of total phthalates in natural mineral water ranged from ND ~ 1.2 ng/mL. Otherwise, the concentrations of total phthalate extracted from PET ranged from 0.55 ~ 1.2 mg/Kg. We found that the accurate determination of phthalte and adipate in natural mineral water and container must be considered blank correction and the removal of label and glue in PET sample.

Breeding on a new cultivar of golden Flammulina velutipes 'Auram' (황금색 팽이 신품종 '아람' 육성)

  • Im, Ji-Hoon;Jang, Kab-Yeul;Oh, Youn-Lee;Oh, MinJi;Raman, Jegadeesh;Kong, Won-Sik
    • Journal of Mushroom
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    • v.17 no.4
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    • pp.218-223
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    • 2019
  • Flammulina velutipes, known as winter mushroom or Enokitake, is an important edible mushroom in Korea. In 2017, approximately 28,000 tons of this mushroom were produced in Korea, putting its output at the third place, behind the oyster and king oyster mushrooms. Despite its high production, F. velutipes has the lowest distribution rate of domestic cultivars, estimated to be about 28 percent. To increase the income of farms and provide more options to consumers, we developed a new golden domestic cultivar 'Auram'. 'Auram' was bred by mating two monokaryotic strains isolated from ASI 4103 and ASI 4111. Auram has bright golden, hemispheric shaped caps, and light brown stipes, making it strikingly different from the control. The optimum mycelial growth temperature was 25℃, but Auram mostly displayed higher mycelial growth than the control in a wide range of temperatures. The yield of Auram (257.4 ± 13.5 g) was high, and the period of fruit body growth was also a couple of days ahead in bottle cultivation, compared with the control. Auram received a more favorable evaluation from farms and distributors than the control for its appearance, because the fruit body of Auram had an attractive golden color, and the spotted cap often seen in the control was not observed.

Thermal Compression of Copper-to-Copper Direct Bonding by Copper films Electrodeposited at Low Temperature and High Current Density (저온 및 고전류밀도 조건에서 전기도금된 구리 박막 간의 열-압착 직접 접합)

  • Lee, Chae-Rin;Lee, Jin-Hyeon;Park, Gi-Mun;Yu, Bong-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.102-102
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    • 2018
  • Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

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