• Title/Summary/Keyword: Capillary Phenomenon

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Simulation of Capillary Phenomenon for Solution Coating of High-uniformity Organic thin Films (고균일 유기박막 코팅을 위한 모세관 현상 전산모사)

  • Shin, Dong-Kyun;Hong, Gi-Young;Park, Jong-Woon;Seo, Hwa-Il
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.1
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    • pp.106-111
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    • 2017
  • When a substrate with a pixel-defining layer (bank) is coated, there arises capillary force due to surface tension and adhesive forces between a solvent and the bank layer. It brings in a degradation of film thickness and emission uniformities within pixels. With an attempt to suppress it, we have performed fluid flow simulations of capillary arise by varying the contact angle of bank and the bank structure. We have first demonstrated that the fluid flow model can reproduce the capillary phenomenon that was observed experimentally. It has been found that capillary arise can be suppressed using a hydrophobic material for the bank layer. Furthermore, it was suppressed by tilting the sidewalls outwardly (i.e., using a positive photoresistor). We can obtain very uniform films when the slope is $50^{\circ}$ with the contact angle of $40^{\circ}$.

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Three-dimensional CFD simulation of geyser boiling in high-temperature sodium heat pipe

  • Dahai Wang;Yugao Ma;Fangjun Hong
    • Nuclear Engineering and Technology
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    • v.56 no.6
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    • pp.2029-2038
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    • 2024
  • A deep understanding of the characteristics and mechanism of geyser boiling and capillary pumping is necessary to optimize a high-temperature sodium heat pipe. In this work, the Volume of Fluid (VOF) two-phase model and the capillary force model in the mesh wick were used to model the complex phase change and fluid flow in the heat pipe. Computational Fluid Dynamics (CFD) simulations successfully predicted the process of bubble nucleation, growth, aggregation, and detachment from the wall in the liquid pool of the evaporation section of the heat pipe in horizontal and tilted states, as well as the reflux phenomenon of capillary suction within the wick. The accuracy and stability of the capillary force model within the wick were verified. In addition, the causes of geyser boiling in heat pipes were analyzed by extracting the oscillation distribution of heat pipe wall temperature. The results show that adding the capillary force model within the wick structure can reasonably simulate the liquid backflow phenomenon at the condensation; Under the horizontal and inclined operating conditions of the heat pipe, the phenomenon of local dry-out will occur, resulting in a sharp increase in local temperature. The speed of bubble detachment and the timely reflux of liquid sodium (condensate) replenishment in the wick play a vital role in the geyser temperature oscillation of the tube wall. The numerical simulation method and the results of this study are anticipated to provide a good reference for the investigation of geyser boiling in high-temperature heat pipes.

Simulation of Capillary Flow Along a Slot-die Head for Stripe Coatings (Stripe 코팅용 슬롯 다이 헤드 모세관 유동 전산모사)

  • Yoo, Su-Ho;Lee, Jin-Young;Park, Jong-Woon
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.92-96
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    • 2019
  • In the presence of ${\mu}-tip$ embedded in a slot-die head for stripe coatings, there arises the capillary flow that limits an increase of the stripe density, which is required for the potential applications in organic light-emitting diode displays. With an attempt to suppress it, we have employed a computational fluid dynamics software and performed simulations by varying the ${\mu}-tip$ length and the contact angles of the head lip and ${\mu}-tip$. We have first demonstrated that such a capillary flow phenomenon (a spread of solution along the head lip) observed experimentally can be reproduced by the computational fluid dynamics software. Through simulations, we have found that stronger capillary flow is observed in the hydrophilic head lip with a smaller contact angle and it is suppressed effectively as the contact angle increases. When the contact angle of the head lip increases from $16^{\circ}$ to $130^{\circ}$, the distance a solution can reach decreases sharply from $256{\mu}m$ to $44{\mu}m$. With increasing contact angle of the ${\mu}-tip$, however, the solution flow along the ${\mu}-tip$ is disturbed and thus the capillary flow phenomenon becomes more severe. If the ${\mu}-tip$ is long, the capillary flow also appears strong due to an increase of flow resistance (electronic-hydraulic analogy). It can be suppressed by reducing the ${\mu}-tip$ length, but not as effectively as reducing the contact angle of the head lip.

Effects of Capillary Force on Salt Cementation Phenomenon (소금의 고결화 현상에서 모세관 효과)

  • Truong, Q. Hung;Byun, Yong-Hoon;Eom, Yong-Hun;Lee, Jong-Sub
    • Journal of the Korean Geotechnical Society
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    • v.26 no.4
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    • pp.37-45
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    • 2010
  • Salt cementation, a typical naturally-cemented phenomenon, may occur due to water evaporation under the change of climate. Capillary force may influence the distribution of cement in granular soils. This study addresses the effect of capillary force on salt cementation using five different techniques: cone penetration test, electrical conductivity measurement, photographic imaging technique, nondestructive imaging technique, and process monitoring by elastic wave. Glass beads modeling a particulate media was mixed with salt water and then dried in an oven to create the cementation condition. Experimental results show that salt cementation highly concentrates at the top of the small particle size specimens and at the middle or the bottom of the large particle specimens. The predicted capillary heights are similar to the locations of high salt concentration in the cemented specimens. Five suggested methods show that the behavior of salt-cemented granular media heavily depends on the capillary force.

Suspended Solid Removal using Capillary-syphon Phenomenon -Evaluation of Possibility for Adapting Water Supply Process- (모세관 사이폰 현상을 이용한 부유물질 제거 - 상수처리공정 적용 가능성 평가 -)

  • Park, Dong-keun;Kim, Su-jung;Lee, Hae-goon;Jang, Jung-kuk;Han, Kee-baek;Kim, Chang-won
    • Journal of Korean Society of Environmental Engineers
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    • v.22 no.7
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    • pp.1285-1294
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    • 2000
  • In this study, we investigated the possibility of the elimination of suspended solid and the factors affecting effluent water quality, and the amount of treated water, using the SS removal equipment adapted capillary-syphon phenomenon. Treated water quantity decreased as the accumulation time and the increase of head of capillary syphon, whereas the effluent water quality was improved. At coagulant dosage 0, 0.45, $1.82mg/{\ell}$ (as $Al^{+3}$) and limiting flux $107{\ell}/m/day$. turbidity of treated water was 2, 1, 0.5 NTU in each case. During operating period 15~17 days, the amount of washing water was just used 0.5~0.7% of the amount of treating water. So it is expected that coagulation & sedimentation and rapid filtration process can be replaced with the SS removal equipment adapted capillary-syphon phenomenon in water purification process.

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Capillary Electrophoresis of Microbes

  • Moon, Byoung-Geoun;Lee, Yong-Ill;Kang, Seong-Ho;Kim, Yong-seong
    • Bulletin of the Korean Chemical Society
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    • v.24 no.1
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    • pp.81-85
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    • 2003
  • Direct analysis of microbes such as either gram-positive or gram-negative bacteria without cell lysis was investigated using capillary electrophoresis. Bacteria cells were directly introduced into the microbore fusedsilica capillary, then separated under high electric field in less than 15 min. It was found that a proper dispersion of bacteria cells was important for reproducible results. Migration behavior of bacteria at different storage condition was investigated and many unexpected peaks were observed from bacteria stored at room temperature due to the distortion of cells. This phenomenon was attributed to the change of size and shape of the same bacterium and confirmed by the scanning electron microscopic images.

Flow Near the Meniscus of a Pressure-Driven Water Slug in Microchannels

  • Kim Sung-Wook;Jin Song-Wan;Yoo Jung-Yul
    • Journal of Mechanical Science and Technology
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    • v.20 no.5
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    • pp.710-716
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    • 2006
  • Micro-PIV system with a high speed CCD camera is used to measure the flow field near the advancing meniscus of a water slug in microchannels. Image shifting technique combined with meniscus detecting technique is proposed to measure the relative velocity of the liquid near the meniscus in a moving reference frame. The proposed method is applied to an advancing front of a slug in microchannels with rectangular cross section. In the case of hydrophilic channel, strong flow from the center to the side wall along the meniscus occurs, while in the case of the hydrophobic channel, the fluid flows in the opposite direction. Further, the velocity near the side wall is higher than the center region velocity, exhibiting the characteristics of a strong shear-driven flow. This phenomenon is explained to be due to the existence of small gaps between the slug and the channel wall at each capillary corner so that the gas flows through the gaps inducing high shear on the slug surface. Simulation of the shape of a static droplet inside a cubic cell obtained by using the Surface Evolver program is supportive of the existence of the gap at the rectangular capillary corners. The flow fields in the circular capillary, in which no such gap exists, are also measured. The results show that a similar flow pattern to that of the hydrophilic rectangular capillary (i.e., center-to-wall flow) is always exhibited regardless of the wettability of the channel wall, which is also indicative of the validity of the above-mentioned assertion.

Visualization for racing effect and meniscus merging in underfill process (언더필 공정에서 레이싱 효과와 계면 병합에 대한 가시화)

  • Kim, Young Bae;Kim, Sungu;Sung, Jaeyong;Lee, MyeongHo
    • Journal of Advanced Marine Engineering and Technology
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    • v.37 no.4
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    • pp.351-357
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    • 2013
  • In flip chip packaging, underfill process is used to fill epoxy bonder into the gap between a chip and a substrate in order to improve the reliability of electronic devices. Underfill process by capillary motion can give rise to unwanted air void formations since the arrangement of solder bumps affects the interfacial dynamics of flow meniscus. In this paper, the unsteady flows in the capillary underfill process are visualized and then the racing effect and merging of the meniscus are investigated according to the arrangement of solder bumps. The result is shown that at higher bump density, the fluid flow perpendicular to the main direction of flow becomes stronger so that more air voids are formed. This phenomenon is more conspicuous at a staggered bump array than at a rectangular bump array.

Experimental study of the heat pipe phenomenon in porous media heated from above (상부가열인 다공물질내의 열파이프 현상에 관한 실험적 연구)

  • 이진호;김홍제;함윤영;남궁규완
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.12 no.4
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    • pp.825-832
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    • 1988
  • An experiment was performed to study the heat pipe phenomenon of porous media heated above at one-dimensional steady state for the range of heat flux, 300 W/ $m^{2}$ ~ 2000w/ $m^{2}$. Glass beads, sand, and copper particles were used as porous media and distilled water was used as a working fluid. Result of experiment shows that the length of the two-phase zone increases with the decreasing particle size for the same heat flux. At relatively lower heat flux the length of the two-phase zone increases with the increasing heat flux, which contradicts the result of earlier work. However, its length remains nearly constant when the heat flux increases above a certain value. The length of the two-phase zone is proportional to the product of the heat flux by the hydrostatic capillary height under the limited value on heat flux, that is, $l_{t}$ = A(q. $l_{cap}$)+B, q.leg.1/A(C+B/ $l_{cap}$) where A is 1.7*10$^{-4}$ $m^{2}$/w, B is 1.9*10$^{-2}$ m, and C is 0.43 for copper particles and 0.31 for glass beads and sand.d.d.d.

A Visualization Study on the Characteristics of Droplets Impinging on a Hot Surface (고온 열판에 충돌하는 액적의 거동에 대한 유동가시화 연구)

  • Kim, Dong-Yeon;Yi, Seung-Jae;Kim, Kyung-Chun
    • Journal of the Korean Society of Visualization
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    • v.10 no.1
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    • pp.21-26
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    • 2012
  • Hydrophobic characteristics of high temperature metal surface were investigated by high-speed visualization of water droplet impact. An aluminum plate was used as the sample plate and the initial diameter of a water droplet was 2 mm. Transient behavior of a single droplet impinging on the surface with and without heating was captured by using a high speed camera running at 4,000 frames per second. The Leidenfrost phenomenon was demonstrated for the case of $300^{\circ}C$ surface temperature, however there was no rebounding of droplet on the cold plate due to hydrophilic nature. The experimental results show that the shape evolution of a droplet impinging on the surface varies with the Weber number, i.e. the ratio of impact inertia to capillary force. The overall water-repellent characteristics of the heated surface was very similar to that of the super hydrophobic surfaces.