Wafer-Level MEMS Capping Process using Electrodeposition of Ni Cap and Debonding with SnBi Solder Layer (Ni 캡의 전기도금 및 SnBi 솔더 Debonding을 이용한 웨이퍼 레벨 MEMS Capping 공정)
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- Journal of the Microelectronics and Packaging Society
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- v.16 no.4
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- pp.23-28
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- 2009