• Title/Summary/Keyword: CVD reaction

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Crystal growth of uniform 3C-SiC thin films by CVD (CVD에 의한 균일한 다결정 3C-SiC 박막 결정 성장)

  • Yoon, Kyu-Hyung;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.234-235
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    • 2008
  • The surface flatness of heteroepitaxially grown 3C-SiC thin films is a key factor affecting electronic and mechanical device applications. This paper describes the surface flatness of poly(polycrystalline) 3C-SiC thin films according to Ar flow rates and the geometric structures of reaction tube, respectively. The poly 3C-SiC thin film was deposited by APCVD (Atmospheric pressure chemical vapor deposition) at $1200^{\circ}C$ using HMDS (Hexamethyildisilane : $Si_2(CH_3)_6)$ as single precursor, and 1~10 slm Ar as the main flow gas. According to the increase of main carrier gas, surface fringes and flatness are improved. It shows the distribution of thickness is formed uniformly.

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Characteristics of ZnO Thin Films Prepared by Photo-CVD (광 CVD법으로 제작한 ZnO박막의 특성)

  • 박계춘;정해덕;정운조;류용택
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1992.05a
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    • pp.117-121
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    • 1992
  • Zinc oxide thin films were obtained from zinc acetate-2-water and oxygen by photo-CVD method. (1) The formation of ZnO films sarts from 100[$^{\circ}C$] and the deposition rate increases with increasing substrate temperature. (2) The rate of deposition was also affected by flow rates of O$_2$(reaction gas) and N$_2$(Carrier gas). (3) The deposition rate decreases with increasing O$_2$mole rate. (4) The transmission of the films was independent of oxygen mole rate and it was largely affected substrate temperature. (5) The electric resistivity of th films was largely varied at oxygen mole rate 10[%] and above 20[%], a plateau was encountered. Also, it increases with increasing substrate temperature. As the results, at substrate temperature: 200[$^{\circ}C$]; O$_2$gas mole rate:10[%]; reation time:10[min] pressure: 10$\^$-2/[atm], deposition rate; transmittance; resistivity were 780[A$\^$0/; 94[%]; 7${\times}$10$\^$-2/[$\Omega$$.$cm] respectively.

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Domain Size and Density in Graphene Grown with Different CVD Growth

  • Gang, Cheong;Jeong, Da-Hui;Nam, Ji-Eun;Lee, Jin-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.264.1-264.1
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    • 2013
  • Graphene is a two-dimensional carbon material whose structure is one-atom-thick planar sheet of sp2-bonded carbon atoms densely packed in a honeycomb crystal lattice. It has drawn significant attention with its distinguished structural and electrical properties. Extremely high mobility and a tunable band gap make graphene potentially useful for innovative approaches to electronics. Although mechanical exfoliation of graphite and decomposition of SiC surfaces upon thermal treatment have been the main method for graphene, they have some limitations in quality and scalability of as-produced graphene films. Solutionphase and solvothermal syntheses of graphene achieved a major improvement for processing, however for device fabrication, a reproducible method such as chemical vapor deposition (CVD) growth yielding high quality films of controlled thickness is required. In this research, we synthesized hexagonal graphene flakes on Cu foils by CVD method and controlled its coverage, density and the size of graphene domains by changing reaction parameters. It is important to control these parameters of graphene growth during synthesis in order to achieve tunable properties and optimized device performance.

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A Study on the Surface Polishing of Diamond Thin Films by Thermal Diffusion (열확산에 의한 다이아몬드 박막의 표면연마에 관한 연구)

  • Bae, Mun Ki;Kim, Tae Gyu
    • Journal of the Korean Society for Heat Treatment
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    • v.34 no.2
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    • pp.75-80
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    • 2021
  • The crystal grains of polycrystalline diamond vary depending on deposition conditions and growth thickness. The diamond thin film deposited by the CVD method has a very rough growth surface. On average, the surface roughness of a diamond thin film deposited by CVD is in the range of 1-100 um. However, the high surface roughness of diamond is unsuitable for application in industrial applications, so the surface roughness must be lowered. As the surface roughness decreases, the scattering of incident light is reduced, the heat conduction is improved, the mechanical surface friction coefficient can be lowered, and the transmittance can also be improved. In addition, diamond-coated cutting tools have the advantage of enabling ultra-precise machining. In this study, the surface roughness of diamond was improved by thermal diffusion reaction between diamond carbon atoms and ferrous metals at high temperature for diamond thin films deposited by MPCVD.

Rotary CVD Process for Surface Treatment of Powders (분말소재의 표면처리를 위한 회전형 CVD 공정)

  • Jong-Hwan Lee;Goo-Hwan Jeong
    • Journal of Surface Science and Engineering
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    • v.56 no.6
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    • pp.341-352
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    • 2023
  • This paper reviews the potentials of a rotary chemical vapor deposition (RCVD) process for nanomaterial synthesis and coating on powder-based materials. The rotary reactor offers a significant improvement over traditional CVD methods having horizontal and fixed reaction chambers. The RCVD system yields enhanced productivity and surface coating uniformity of nanoparticles applied in various purposes, such as efficient heat dissipation, surface hardness enhancement, and enhanced energy storage performances. The effectiveness of the RCVD system would open up new possibilities in various applications because uniform coating on powder-based materials with massive productivity is inevitable to develop multi-functional materials with high reliability.

Preparation of $WO_3$ Films by CVD and their Application in Electrochromic Devices (화학기상 증착법을 이용하여 제조된 텅스텐 산화막의 전기변색 소자 응용 연구)

  • Jung, Hun;SunWoo, Changshin;Kim, Do-Heyoung
    • Korean Chemical Engineering Research
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    • v.49 no.4
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    • pp.405-410
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    • 2011
  • A study on chemical vapor deposition(CVD) of $WO_3$ and the electrochromic properties of the CVD $WO_3$ films have been carried out. The crystalinity, purity, and growth rate of the films depending on substrate temperatures are investigated. The highest growth rate is $8{\mu}m/min$ at the substrate temperatures above $300^{\circ}C$ and the estimated activation energy for overall film growth is about 45.9 kJ/mol at the temperatures of $225{\sim}275^{\circ}C$, where the CVD process is controlled by a surface reaction kinetics. The films grown below $275^{\circ}C$ are amorphous, while those deposited above $300^{\circ}C$ are crystalline. The effects of thickness and deposition temperature of the $WO_3$ films on electrochromic activity are also investigated. The coloration efficiency of the films increases with increase in film thickness and decrease in deposition temperature.

Oxidation of CVD β-SiC in Impurity-Controlled Helium Environment at 950℃ (950℃ 불순물을 포함한 헬륨 환경에서 CVD β-SiC의 산화)

  • Kim, Dae-Jong;Kim, Weon-Ju;Jang, Ji-Eun;Yoon, Soon-Gil;Kim, Dong-Jin;Park, Ji-Yeon
    • Journal of the Korean Ceramic Society
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    • v.48 no.5
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    • pp.426-432
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    • 2011
  • The oxidation behavior of CVD ${\beta}$-SiC was investigated for Very High Temperature Gas-Cooled Reactor (VHTR) applications. This study focused on the surface analysis of the oxidized CVD ${\beta}$-SiC to observe the effect of impurity gases on active/passive oxidation. Oxidation test was carried out at $950^{\circ}C$ in the impurity-controlled helium environment that contained $H_2$, $H_2O$, CO, and $CH_4$ in order to simulate VHTR coolant chemistry. For 250 h of exposure to the helium, weight changes were barely measurable when $H_2O$ in the bulk gas was carefully controlled between 0.02 and 0.1 Pa. Surface morphology also did not change based on AFM observation. However, XPS analysis results indicated that a very small amount of $SiO_2$ was formed by the reaction of SiC with $H_2O$ at the initial stage of oxidation when $H_2O$ partial pressure in the CVD ${\beta}$-SiC surface placed on the passive oxidation region. As the oxidation progressed, $H_2O$ consumed and its partial pressure in the surface decreased to the active/passive oxidation transition region. At the steady state, more oxidation did not observable up to 250 h of exposure.

A Study on the Surface Modification of Graphite by CVD SiC -Growth Characteristics of SiC in a Horizontal CVD Reactor- (화학증착 탄화규소에 의한 흑연의 표면개질 연구 -수평형 화학증착반응관에서 탄화규소 성장특성-)

  • 김동주;최두진;김영욱;박상환
    • Journal of the Korean Ceramic Society
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    • v.32 no.4
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    • pp.419-428
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    • 1995
  • Polycrystalline silicon carbide (SiC) thick films were depostied by low pressure chemical vapor deposition (LPCVD) using CH3SiCl3 (MTS) and H2 gaseous mixture onto isotropic graphite substrate. Effects of deposition variables on the SiC film were investigated. Deposition rate had been found to be surface-reaction controlled below reactor temperature of 120$0^{\circ}C$ and mass-transport controlled over 125$0^{\circ}C$. Apparent activation energy value decreased below 120$0^{\circ}C$ and deposition rate decreased above 125$0^{\circ}C$ by depletion effect of the reactant gas in the direction of flow in a horizontal hot wall reactor. Microstructure of the as-deposited SiC films was strongly influenced by deposition temperature and position. Microstructural change occurred greater in the mass transport controlled region than surface reaction controlled region. The as-deposited SiC layers in this experiment showed stoichiometric composition and there were no polytype except for $\beta$-SiC. The preferred orientation plane of the polycrystalline SiC layers was (220) plane at a high reactant gas concentration in the mass transfer controlled region. As depletion effect of reactant concentration was increased, SiC films preferentially grow as (111) plane.

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Size and Density of Graphene Domains Grown with Different Annealing Times

  • Jung, Da Hee;Kang, Cheong;Nam, Ji Eun;Kim, Jin-Seok;Lee, Jin Seok
    • Bulletin of the Korean Chemical Society
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    • v.34 no.11
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    • pp.3312-3316
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    • 2013
  • Single crystals of hexagonal graphenes were successfully grown on Cu foils using the atmospheric pressure chemical vapor deposition (CVD) method. We investigated the effects of reaction parameters, such as the growth temperature and annealing time, on the size, coverage, and density of graphene domains grown over Cu foil. The mean size of the graphene domains increased significantly with increases in both the growth temperature and annealing time, and similar phenomena were observed in graphene domains grown by low pressure CVD over Cu foil. From the comparison of micro Raman spectroscopy in the graphene films grown with different annealing times, we found that the nucleation and growth of the domains were strongly dependent on the annealing time and growth temperature. Therefore, we confirmed that when reaction time was same, the number of layers and the degree of defects in the synthesized graphene films both decreased as the annealing time increased.