• Journal of Sensor Science and Technology
• /
• v.21 no.1
• /
• pp.34-38
• /
• 2012

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.1
• /
• pp.31-37
• /
• 1999

In this study, the thermal property and adhesion of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu /TaN /Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature for the multilayered Cu /TaN /Si specimen which was annealed at atmospheres of $H_2$and Ar gases, respectively. The adhesion strength of Cu films was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than that of sputtered Cu film and evaporated Cu film.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.6
• /
• pp.549-554
• /
• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05e
• /
• pp.11-14
• /
• 2003

Sintered Cu-W has been used for the electrode of GIS for interrupting the abnormal current. In this study the effect of Ni addition in Cu-W electrode was investigated. Cu-W electrodes used contains 0.1~0.2wt% Ni and were conducted the experiments which was attacked by DC arc test (70V-70A) for 300 times periodically. As the contents of Ni in Cu-W electrode increase, the hardness and electrical conductivity were decreased. The weight change ($\Delta$mg) of electrode after DC arc test increased with increasing Ni contents and test times. The hardness and electrical conductivity of electrode after DC arc test were decreased compared with non-arc affected electrode, which was owing to the defects near surface of electrode and degradation by arc heat. It was considered that Cu in the Cu-W electrode was scattered to all directions by arc heat, therefore, the electrodes were damaged and deformed in the surface and cross-section of electrode. It is difficult to estimate directly the characteristics of Cu-W electrode for GIS related with high voltage and current from the results of DC arc test conducted in this study. However, the results of the effect of Ni addition in Cu-W electrode could be applied for the research of electrode for GIS.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.360.2-360.2
• /
• 2016

CuSn thin films were fabricated by rf magnetron co-sputtering method on the Si(100) substrate for evaluation of the antibacterial effect. The co-sputtering process was performed with different rf powers and sputtering times to regulate the thickness of the films and relative atomic ratio of Cu to Sn. The physicochemical properties of the CuSn thin films were characterized by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), X-ray induced Auger electron spectroscopy (XAES), Optical microscope (OM), 4-point probe, and antibacterial test. An antibacterial test was conducted with Escherichia coli (E. coli) and Staphylococcus aureus (S. aureus) as changing contact times between CuSn fillms and bacteria suspension. We compared to the crystalline structures of films before sterilization and after sterilization by XRD measurement. The changes of oxidation states of Cu and Sn and the chemical environment of films before and after antibacterial test were investigated with high resolution XPS spectra in the regions of Cu 2p, Cu LMM, and Sn 3d. After antibacterial test, the morphology of the films was checked with an OM images. The electrical properties of the CuSn films such as surface resistance and conductivity were measured by using 4-point probe.

• Journal of Life Science
• /
• v.30 no.4
• /
• pp.321-330
• /
• 2020

The aim of this study was to investigate the effect of copper (II) chloride (CuCl₂) on zebrafish. Zebrafish were exposed to various CuCl₂ concentrations and subjected to different exposure times to determine the median lethal concentration (LC₅₀) values. To evaluate stress responses, we measured whole-body cortisol levels and behavioral parameters using the open field test (OFT) or the novel tank test (NTT). The zebrafish were exposed to CuCl₂ solution at concentrations of 1.5-150 ㎍/l or a vehicle for 1 hr before behavioral tests or sample collection for whole-body cortisol. The LC₅₀ values were 30.3, 25.3, and 14.8 ㎍/l at 24, 48, and 96 hr, respectively. The NTT showed that mobility, velocity, and distance covered were significantly lower in zebrafish exposed to CuCl₂ than in the control group (p<0.05), while the turn angle was significantly higher in zebrafish exposed to a CuCl₂ concentration of 150 ㎍/l than in the control group (p<0.05). The OFT also showed that mobility, velocity, and distance covered were significantly lower and the turn angle and meandering were significantly higher in zebrafish exposed to all concentrations of CuCl₂ than in the control group (p<0.05). The whole-body cortisol levels were significantly higher in zebrafish exposed to CuCl₂ than in the control group (p<0.05). These results suggest that exposure to lethal CuCl₂ concentrations induces an intense toxic and stress response in zebrafish, causing behavioral changes and increasing whole-body cortisol levels.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.2
• /
• pp.29-37
• /
• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Nuclear Engineering and Technology
• /
• v.42 no.6
• /
• pp.662-669
• /
• 2010

To develop the manufacturing methods for the blanket first wall (FW) of the International Thermonuclear Experimental Reactor (ITER) and to verify the integrity of the joint, Be/Cu mockups were fabricated and tested at the KoHLT-1 (Korea Heat Load Test facility), a graphite heater facility located at the Korea Atomic Energy Research Institute (KAERI). Since Be and Cu joining is the focus of the present study, the fabricated mockups had a CuCrZr heat sink joined with three Be tiles as an armor material, unlike the original ITER blanket FW, which has a stainless steel structure and coolant tubes. Hot isostatic pressing (HIP) was carried out at $580^{\circ}C$ and 100 MPa for 2 hours as the method for Be/Cu joining. Three interlayers, namely, $1{\mu}mCr/10{\mu}mCu$, $1{\mu}mTi/0.5{\mu}mCr/10{\mu}mCu$, and $5{\mu}mTi/10{\mu}mCu$ were applied as a coating to the Be tiles by a physical vapor deposition (PVD) method. A shear test was performed with the specimens, which were fabricated by the same methods as those used to fabricate the mockups. The average values were 125 MPa to 180 MPa, and the samples with the $1{\mu}mCr/10{\mu}mCu$ interlayer showed the lowest value. No defect or delamination was found in the joints of the mockups by the developed ultrasonic test using a flat-type probe with a 10 MHz frequency and a 0.25 inch diameter. High heat flux (HHF) tests were performed at $1.0\;MW/m^2$ heat flux for each mockup using the given conditions, and the results were analyzed by ANSYS-CFX code. For the test criteria, an expected fatigue lifetime about 1,000 cycles was obtained by analysis with ANSYS-mechanical code. Mockups using the interlayers of $1{\mu}mTi/0.5{\mu}mCr/10{\mu}mCu$ and $5{\mu}mTi/10{\mu}mCu$ survived up to 1,100 cycles over the required number of cycles. However, one of the Be tiles in the other two mockups using the $1{\mu}mCr/10{\mu}mCu$ interlayer was detached during the screening test, and others were detached by discharge after 862 cycles. The integrity of the joints using the proposed interlayers was proven by the HHF test, but the other interlayer requires more study before it can be used for the joining of Be to Cu. Moreover, it was confirmed that the measured temperatures agreed well with the analysis temperatures, which were used to estimate the lifetime and that the developed facility showed its capability of the long time operation.

• Journal of the Korean Vacuum Society
• /
• v.15 no.3
• /
• pp.325-330
• /
• 2006

In order to verify the integrity of the first wall (FW) of the International Thermonuclear Experimental Reactor (ITER), the fabricated Cu/SS mock-up is tested in the JAEA Electron Beam Irradiation Test Stand (JEBIS). To fabricate the Cu/SS mock-up, CuCrZr and 316L authentic stainless steel (SS316L) are used for Cu alloy and steel, respectively The hot isostatic pressing (HIP) is used as a manufacturing method with a $1050^{\circ}C$ and 150 MPa. The high heat flux (HHF) test is performed using an electron beam with a heat flux of $5MW/m^2$ and a cycle of 15-sec on time and 30-sec off time. The temperature measurement in the HHF test shows good agreement with the results obtained from ANSYS code analysis, which is used for determining the HHF test conditions.

• Korean Journal of Metals and Materials
• /
• v.47 no.4
• /
• pp.217-222
• /
• 2009

Cu as a tramp element has been reported to encourage transverse cracking upon straightening operation during continuous casting or mini-mill processing. Therefore, the hot workability of steels containing Cu should be investigated. The purpose of the present study was to examine the effect of Cu contents on the hot ductility of low carbon steels by using hot compression test. Hot compression test was carried out using a Gleeble. The specimens were heated to $1300^{\circ}C$ for solution treatment and then held for 300s before cooling at a rate of $1^{\circ}C/s$ to test temperatures in the range of $650{\sim}1150^{\circ}C$ ($50^{\circ}C$ intervals) with strain rate of $5{\times}10^{-3}/s$. In Cu containing steels, the hot ductility was decreased with increasing Cu content at high temperature region which is to be attributed to copper enriched phase formed at scale/steel interface, and low hot ductility with increasing Cu content at low temperature region is attributable to the strengthening of matrix by the formation of ${\varepsilon}-Cu$. The width of ductility trough region was decreased with increasing Cu content.