Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Characterization of the Sn-Ag-Cu and Sn-Cu Lead-free Solder by adding P

P의 함량에 따른 Sn-Ag-Cu 및 Sn-Cu 무연솔더의 특성평가

  • Published : 2003.06.01
Download PDF
⟨ Previous Next ⟩

Abstract

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

Keywords

References

  1. Principles of Soldering and Braizing Gilles Humpston;David M.Jacobson
  2. International Materials Reviews Metallurgy of low temperature Pb-free solders for electronic assembly J.Glazer
  3. Sandia Report, SAND96-1431 J.A.Kern;M.W.Weiser;C.A.Drewien;F.J.Yost;S.Sackinger
  4. ASTM E8-98 Standard Test Method for Tension Testing of Metallic Materials American Society For Testing and Materials
  5. 전기전자재료학회논문지 v.6 no.6 전자부품의 접합재료로서의 Sn도금막 형성 조건 및 도금막 특성에 관한 연구 신영의;임민빈;김경섭;Shuji Nakata
  6. 전기전자재료학회 99 춘계학술대회논문집 무전해 니켈/금도금에서의 내부 금속층의 결함에 대한 연구 박수길;정승준;김재용
  7. J. Electron mater Characterization of eutectic Sn-Bi solder joint Z.Mei;J.W.Morris
  8. Matterials Transaction v.42 The effect of Bi concentration on wettability of Cu substrate by Sn-Bi solder Chang-Bae Lee;Seung-Boo Jung;Young-Eui Shin;Chang-Chae Shur https://doi.org/10.2320/matertrans.42.751
  9. 대한용접학회지 v.2 no.1 등온시효에 따른 Sn-3.5Ag 솔더 접합부의 금속간 화합물 성장에 관한 연구 이인영;이창배;정승부;서창제