• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1930-1932
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• 2005

Colloidal Silica(CS)/methyltrimethoxy silane(MTMS) and CS/MTMS/epoxy silane(Es) sol solutions were prepared in variation with synthesizing parameters such as kinds of CS, kinds of silane and reaction time. In order to understand its physical and chemical properties, sol-gel coating films on glass were fabricated. In the case of CS/MTMS sol, the coating films had high contact angle and more enhanced flat surface than those in the case of CS/MTMS/ES sol. Also, the coating films obtained from single CS had a better flat surface than those obtained from mixed CS. In the case of thermal stability, thermal dissociation of CS/MTMS and CS/MTMS/ES sol-gel coating films did not occur up to $550^{\circ}C$ and $440^{\circ}C$ respectively. The thickness of coating films obtained from CS/MTMS sol increased than those of CS/MTMS/ES sol. In addition, the coating films obtained from single CS were more thicker than those obtained from mixed CS.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.9
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• pp.967-972
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• 2004

Hardness and surface property of coated gel materials are considerably different according to kinds(particle size/stabilized ion) of colloidal silica(CS), kinds of silanes, content ratio of silane versus CS, and reaction degree in sol solution. We report the properties of sol-gel coating materials in which the factors of reaction are kinds of CS, contents ratio of CS and MTMS, and reaction time of sol. The contact angles of the coated films obtained from the mixed CS system showed a little good relationship with MTMS content increase to those from HSA CS reaction system and the change of contact angle didn't have much effect on reaction time of sol. In the coating films obtained from HSA CS reaction system, the surface was much rough in case of that the content MTMS decreased and the reaction of sol kept long. The surface roughness of films obtained from the mixed CS reaction system showed similar tendency, though its degree was a little different. In synthesis of sol-gel coating materials, we could identify that choice of CS kinds and content ratio of CS and silane were important and it was desirable the reaction time of sol is not long.

• Applied Chemistry for Engineering
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• v.16 no.6
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• pp.822-826
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• 2005

Colloidal Silica (CS)/methyltrimethoxysilane (MTMS) and CS/MTMS/epoxysilane (ES) sol solutions were prepared using various synthesizing parameters such as reaction time and types of CS and silane. In order to understand their physical and chemical properties, sol-gel coating films on glass were fabricated. In the case of the CS/MTMS sol, the coating films had high contact angle and more enhanced flat surface than the CS/MTMS/ES sol. In the case of thermal stability, thermal degradation of the CS/MTMS and CS/MTMS/ES coating films did not occur up to $550^{\circ}C$ and $440^{\circ}C$, respectively. The coating films prepared from the CS/MTMS sol were thicker than those of the CS/MTMS/ES sol. In addition, the coating films prepared from single CS were thicker than those of mixed CS. Hardness of the coating films prepared from CS/MTMS increased by adding ES. In case of the mixed CS, the hardness decreased by adding ES.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.33-36
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• 2005

Colloidal Silica(CS)/silane sol solutions were prepared in variation with synthesizing parameters such as ratio of CS to silane and reaction time. In the case of LHSA CS/tetramethoxysilane(TMOS)/methyltrimethoxysilane(MTMS) CS/silane sol, coating film had stable contact angle with increasing reaction time excepting for 48hours. Also, the LHSA CS/TMOS/MTMS coating film had more enhanced flat surface with increasing the amount of MTMS and increasing reaction time. In the case of thermal stability, thermal dissociation of LHSA CS/MTMS sol did not occur up to $550^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.230-231
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• 2006

We synthesized sol according to kinds(particle size/stabilized ion) of colloidal silica(CS), content ratio of alkoxysilane versus CS and reaction degree in sol solution and studied the surface property of coated gel materials. The contact angle of the thin films prepared from LHSA/N1030 CS/tetramethoxysilane(TMOS)/methyltrimethoxysilane(MTMS) sol-gel reaction system showed a little good relationship with content ratio of TMOS/MTMS silanes. The surface roughness of LHSA CS/TMOS/MTMS reaction system showed flatter than that of LHSA/N1030 CS. The thermal degradation of LHSA CS/TMOS/MTMS coating flim occurred at $550^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.214-215
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• 2006

Colloidal Silica(CS)와 유기수지를 혼합하여 서로의 단점을 보완하는 나노복합재료를 합성하기 위해 친수성인 CS를 유기실란으로 표면처리하여 소수성화하고 유기수지와 복합체를 제조하였다. CS표면의 -OH기와 실란의 -OH기가 축합반응하여 화학결합을 형성함으로서 CS의 표면은 실란의 $CH_3$에 의해 소수성화되어 CS sol이 제조된다. CS sol과 유기수지는 공동용매에 의해 균일한 분산이 가능하고 필름 및 코팅제로의 제조가 가능하다. 사용된 무기물은 40nm 의 크기를 가지므로 가시광선영역의 빛을 산란하지 않아 투명하고 사용된 수지 또한 투명하여 우수한 광학적 특성을 나타낸다. 만들어진 필름은 CS의 영향으로 유기수지의 내열성보다 향상된 열분해온도와 높은 접촉각, 높은 절연율을 보였다.

• Polymer(Korea)
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• v.29 no.3
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• pp.242-247
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• 2005

Two kinds of colloidal silica(CS)/silane sol solutions were prepared in variation with synthesizing parameters such as kinds of CS, ratio of CS to silane and reaction time. Such sol solutions were obtained from 1034A Cs/methyl-trimethoxysilane(MTMS) and HSA CS/MTMS solutions. In the case of 1034A CS/MTMS CS/silane sol, coating film had high contact angle and more enhanced flat surface than those in the case of HSA CS/MTMS sol. In the case of thermal stability, thermal dissociation of 1034A CS/MTMS sol did not occur up to $550^{circ}$. The thickness of coating film obtained from 1034A CS/MTMS sol increased with increasing the amount of MTMS. The hardness of coating films obtained from 1034A CS/MTMS sol decreased with increasing the amount of MTMS. Surface free energy of CS/silane sol-gel coating film decreased with increasing amount of MTMS.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.1
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• pp.35-40
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• 2007

The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1927-1929
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• 2005

Colloidal Silica(CS)/methyltrimethoxy silane(MTMS) sol solutions were prepared in variation with synthesizing parameters such as kinds of CS, acidity and reaction time. In order to understand its surface properties, sol-gel coating films on glass were fabricated. The coating film obtained from CS/MTMS sol had stable contact angle and more enhanced flat surface at reaction time of 24 hours. In case of the initial and final period of reaction, the coating films had unstable contact angle and more rough surface. In addition, surface of CS/MTMS sol-gel coating film was more rougher with increasing of acidity.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.428-432
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• 2012

Polyamidimide (PAI)-colloidal silica (CS) nanohybrid films were synthesized by an advanced sol-gel process. The synthesized PAI-CS hybrid films have a uniform and stable chemical bonding and there is no interfacial defects observed by TEM. The thermal degradation ratio of PAI-CS (10 wt%) hybrid films is delayed by 100 ℃ compared with pure PAI sample determined by on set temperature range in TGA. The dielectric constant of PAI-CS (10 wt%) hybrid films decreases with increasing CS content up to about 5 wt% but increases at higher CS content, which is not explained simply by effective medium therories (EMT). The duration time of PAI-CS (10 wt%) hybrid coil is 38 sec, which is very longer than that of pure PAI coil sample. The PAI-CS (10 wt%) hybrid film has a higher breakdown voltage resistance than the pure PAI film at surge environment and exhibits superior heat resistance. The PAI-CS (10 wt%) sample shows the advanced and stable thermal emission properties in transformer module compared with the pure PAI sample. This result illustrates that the advanced thermal conductivity and expansion properties of PAI-CS sample in the case of appropriate sol-gel processes brings the stable thermal emission in transformer system. Therefore, new PAI-CS hybrid samples with such stable thermal emission properties are expected to be used as a high functional coating application in ET, IT and electric power products.