• Title/Summary/Keyword: COB-type LED

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COB, COH Package LED Module Thermal Analysis Simulation (COB, COH Package LED Module 열 해석 시뮬레이션)

  • Choi, Keum-Yeon;Eo, Ik-Soo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.11
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    • pp.5117-5122
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    • 2011
  • In this paper, thermal analysis simulation program by taking advantage of COMSOL Multiphysics, LED Module for the production of the most preferred package type, omitting the COH Type COB Type and board simulation of the thermal analysis is in progress. LED Module that passes through the Heat-sink of the simulation results, depending on the location of the COB Type Max. Approximately $78^{\circ}C$ ~ Min. Approximately $62^{\circ}C$, COH Type the Max. Approximately $88^{\circ}C$ ~ Min. Approximately $67^{\circ}C$ has been confirmed that the temperature stability. Compared with COB Type Max. AIthough temperature difference is about $10^{\circ}C$, Min. At a temperature of about $5^{\circ}C$ confirmed to be enough to reduce the gap, LED Point confirming the results of the temperature curves for COB Type Max. Approximately $100^{\circ}C$ ~ Min. Approximately $77^{\circ}C$, COH Type the Max. Approximately $100^{\circ}C$ ~ Min. Approximately $86^{\circ}C$ temperature stability was confirmed that, COB Type COH Type, compared to approximately $10^{\circ}C$ temperature was higher.

Thermal simulation using COB Type LED modules analysis of thermal characteristics (열 시뮬레이션을 이용한 COB Type LED 모듈 방열특성 분석)

  • Seo, Bum-Sik;Kim, Sung-Hyun;Jeong, Young-Gi;Park, Dae-Hee
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1722-1723
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    • 2011
  • LED는 광학적 특성을 유지하기 위해서는 방열설계가 매우 중요한 문제로 요구된다. 대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며 고출력 LED의 인가된 에너지는 20%정도가 광으로 출력되며 나머지 80%정도가 열로 전환된다. 이러한 이유 때문에 LED소자의 신뢰성과 효율 향상을 위한 방열성능의 극대화가 필요하다. 본 연구에서는 AI MCPCB 기판에 기반을 둔 COB Type의 고출력 LED모듈의 구조를 제안 하였으며, LED Chip과 금속base 사이의 절연층 유무의 관점에서의 비교 열 시뮬레이션을 통해 결과를 분석하여 고출력 COB LED모듈의 방열 특성을 최적화 하였다.

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Thermal Characteristics of the design on Residential 13.5W COB LED Down Light Heat Sink (주거용 13.5W COB LED 다운라이트 방열판 설계에 따른 열적 특성 분석)

  • Kwon, Jae-hyun;Lee, Jun-myung;Kim, Hyo-jun;Kang, Eun-young;Park, Keon-jun
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.7 no.1
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    • pp.20-25
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    • 2014
  • There are several severe problems for LED device, the next generation's economy green lighting: as the temperature increases, the lamp efficiency decreases; if the temperature is over $80^{\circ}C$, the lifetime of lighting decreases; Red Shift phenomenon that wavelength of spectrum line moves toward long wavelength occurs; and optical power decreases as $T_j$ increases. Thus, Heat sink design that can minimize the heat of LED device is currently in progress. While the thermal resistance of COB Type LED was reduced by direct coupling of LED chip to the board, residential 13.5W requires Heat sink in order resolve heat issue. This study designed Heat Sink suitable for residential 13.5W COB LED down-light and selected the optimum Fin thickness through flow simulation that packaged the designed Heat Sink and 13.5W COB. And finally it analyzed and evaluated the thermal modes using contacting thermometer.

A Comparative Analysis of Thermal Properties of COB LED based on Thermoelectric Device Structure (열전소자 구조에 따른 COB LED의 방열 성능 비교 분석)

  • Kim, Hyo-Jun;Kang, Eun-Yeong;Im, Seong-Bin;Hoang, Geun-Chang;Kim, Yong-Kab
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.15 no.2
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    • pp.189-194
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    • 2015
  • In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

Design of the Lens Structure for COB type LED Safety Luminaires (COB형 LED 보안등을 위한 렌즈 구조 설계)

  • Jang, Sung-Whan;Jung, Byoung-Jo
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.27 no.8
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    • pp.1-8
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    • 2013
  • The study carried out in this dissertation focuses on the lens structure design and the light distribution for LED safety luminaires using COB type LED module. Lens structures for LED lights has been designed 1) to induce light diffusion by dual process of internal reflection and refraction, 2) to minimize the inherent LED lights' glittering, and 3) to have uniform brightness. The lens designed with the proposed structures function as diffusers for the divergence of the LED lights so that they form a wide angle of view and adjust the light distribution. We designed of lens with stable uniformity factor and average roughness using aspheric optics property. Finally we made the analysis data of the simulated data.

Optimal Design of Secondary Optics for Narrowing the Beam Angle of an LED Lamp with a Large-Area COB-type LED Package (대면적 COB-type LED 패키지를 포함한 LED 램프의 좁은 광속각 구현을 위한 2차 광학계 최적 설계)

  • Kim, Bongjun;Kim, Dae-Chan;O, Beom-Hwan;Park, Se-Geun;Kim, Bongho;Lee, Seung Gol
    • Korean Journal of Optics and Photonics
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    • v.25 no.2
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    • pp.78-84
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    • 2014
  • In this paper secondary optics for an LED lamp with a narrow beam angle of $15^{\circ}$ were optimized by using a two-reflector system, to reduce both its size and the occurrence of satellite rings. The conic constant and the curvature of the primary reflector were determined by considering the relation of the source size to the beam angle, and the optimal position and radius of the secondary reflector were found for reducing the occurrence of satellite rings. Luminous flux efficiency was about 80%.

Applications of Current Limiting Diode to Chip on Board Type Light Source and Lighting Equipment Circuits (정전류다이오드를 이용한 COB 타입 LED 광원 및 조명기기 회로)

  • Park, Hwa Jin;Yu, S.J.;Park, Jong Min;Kim, Y.J.
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.6
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    • pp.488-492
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    • 2013
  • Current limiting diode (CLD) was fabricated using junction field effect transistor (JFET) structured two small cells and eight large cells. Two small cells and eight large cells were connected in parallel and the obtained constant current was 110 mA. The application of CLD in each of the parallel circuits on chip on board (COB) type LED lighting source, could significantly reduce the current deviation within the parallel circuits. The applications of CLD on AC power small lighting source, battery power low voltage parallel lighting source and AC flat lighting source were investigated.

Manufacturing of PAR Illumination Using COB Line Type LEDs (COB Line형 LED를 사용한 PAR 조명의 제작)

  • Youn, Gap-Suck;Yoo, Kyung-Sun;Lee, Chang-Soo;Hyun, Dong-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.4
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    • pp.448-454
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    • 2015
  • In this paper, the band structural design that is typically in a line was arranged in a ring shape, so as to configure the high power LED lighting in such a way as to form a concentrated light distribution angle of less than 15 degrees. The parabolic aluminized reflector PAR38 that facilitates design using area and the area of the optical system to the same extent, applied a multiple light-source condenser lens optical system for the control of integration. The LED used here implemented a single linear light source using ans LED module with ans LED, flip-chip chip-scale package. The optical system was designed based on the energy star standard.

Reliability Testing and Materials Evaluation of Si Sub-Mount based LED Package (실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험)

  • Kim, Young-Pil;Ko, Seok-Cheol
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.29 no.4
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    • pp.1-10
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    • 2015
  • The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

A Study on Aspheric Optics European LED Streetlights Type for the Prevention of Light Pollution (빛 공해 방지를 위한 유럽형 LED 가로등용 비구면 광학계에 관한 연구)

  • Lee, Shi-Woo;Lee, Chang-Soo;Hyun, Dong-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.3
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    • pp.429-436
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    • 2013
  • In this study, we researched a pendant-type aspherical optical system, which could be applied to street lighting and security lighting in Europe. The goal of this research was eco-friendly artificial lighting that could be used for the one-to-one replacement of ordinary lighting. LED lighting was miniaturized by using one COB LED Module and one aspherical optical system, which could control the luminosity of the LED. Through the aspherical optical system, the light distribution angle could be controlled in a range of $140^{\circ}$ for the X-axis and $40^{\circ}$ for the Y-axis. This means that this optical system is appropriate for catenary-type lighting, which is widely used in Europe on both narrow and broad roads. The performance was determined using a lighting simulation program. This lighting system simulation showed that road rates M4 and M5 could be satisfied, with the condition of a 13-m height and 50-m distance (U0 and TI). The simulation program estimated that light pollution, which disturbs sleep, could beeliminated in the European streetlight case. Determining methods for the light distribution control, performance, and optimal lighting setup conditions is very important to prevent light pollution. Moreover, the initial step of developing the lighting system design and post management will require an effort with much analysis.