• 조명전기설비학회논문지
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• 제29권4호
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• pp.1-10
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• 2015

The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

• 광학세계
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• 통권141호
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• pp.24-25
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• 2012

한국산업기술대학교가 주최하고 (주)모던하이테크가 후원한 '글로벌 COB형 LED 조명 솔루션 기술교류회'가 지난 7월 6일 한국산업기술대학교 TIP 아트센터에서 개최됐다. 이에 (주)모던하이테크는 독일 옵시라(opsira) 제품을 전시하였으며, 강연자로 옵시라의 폴케르 슈마커(Volker Schumacher) 대표를 초청해 'Near-field 측정과 COB 광원 모델링'을 주제로 강의를 진행했다.

• 한국생산제조학회지
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• 제24권4호
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• pp.448-454
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• 2015

In this paper, the band structural design that is typically in a line was arranged in a ring shape, so as to configure the high power LED lighting in such a way as to form a concentrated light distribution angle of less than 15 degrees. The parabolic aluminized reflector PAR38 that facilitates design using area and the area of the optical system to the same extent, applied a multiple light-source condenser lens optical system for the control of integration. The LED used here implemented a single linear light source using ans LED module with ans LED, flip-chip chip-scale package. The optical system was designed based on the energy star standard.

• 한국생산제조학회지
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• 제23권6호
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• pp.609-617
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• 2014

We have studied a chip-on-board LED lighting optical system for various luminous-intensity-distribution angles of the LED. An optical system that can accept different LEDs was made to reduce the systems's weight and size as we selected the chip-on-board LED, which is easy to apply to optical systems, unlike existing package-on-board LEDs. The luminous-intensity-distribution angles were $45^{\circ}$, $60^{\circ}$, $90^{\circ}$, and $120^{\circ}$. We researched these four types of optical systems. The $45^{\circ}$ and $60^{\circ}$ units were developed into reflectors, and the $90^{\circ}$ and $120^{\circ}$ units, into lenses. We checked the performance of the designed optical system through simulation and made a mock-up. Then we made a prototype of the chip-on-board LED high bay for use with the mock-up. After measuring its performance, we tested the luminous-intensity-distribution angles and compared them with simulation data. The resulting prototype was developed considering brightness, light uniformity, age, and economics which are suitable for a factory environment.

• 한국생산제조학회지
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• 제22권3호
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• pp.429-436
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• 2013

In this study, we researched a pendant-type aspherical optical system, which could be applied to street lighting and security lighting in Europe. The goal of this research was eco-friendly artificial lighting that could be used for the one-to-one replacement of ordinary lighting. LED lighting was miniaturized by using one COB LED Module and one aspherical optical system, which could control the luminosity of the LED. Through the aspherical optical system, the light distribution angle could be controlled in a range of $140^{\circ}$ for the X-axis and $40^{\circ}$ for the Y-axis. This means that this optical system is appropriate for catenary-type lighting, which is widely used in Europe on both narrow and broad roads. The performance was determined using a lighting simulation program. This lighting system simulation showed that road rates M4 and M5 could be satisfied, with the condition of a 13-m height and 50-m distance (U0 and TI). The simulation program estimated that light pollution, which disturbs sleep, could beeliminated in the European streetlight case. Determining methods for the light distribution control, performance, and optimal lighting setup conditions is very important to prevent light pollution. Moreover, the initial step of developing the lighting system design and post management will require an effort with much analysis.

• 한국생산제조학회지
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• 제21권3호
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• pp.487-492
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• 2012

In this study we researched a spotlight in LED lighting. Ordinary LED spotlight was manufactured with characterized property of traveling straightness of LED light source, but multiple use of shell type LED, a yellow band has formed caused by light source interference between the LED. Also, there was a high miscellaneous light efficiency with losing light source homogeneity and efficiency due to light source control uneasiness. The study uses aspheric reflector and aspheric lens, so we can control the light source of LED spotlight with effectively and we reached surface light source by using COB/COM for LED module. Furthermore it can change its use by a reduced scale of light system. It has been designed to make its various application from low power consumption of bicycle lamp, up to high power consumption of automobile lamps and lighthouse.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2015년도 제46회 하계학술대회
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• pp.1285-1285
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• 2015

현재 전력난에 의해 에너지 절감이라는 말은 가정 및 산업 현장 곳곳에서 들을 수 있다. 에너지 절감 대책 중 하나가 몇 년전 정부에서 발표한 백열등 수입 및 유통금지가 있다. 그 효과로 LED 산업이 각광 받게 되었다. 다양한 LED 산업 및 기술에서도 신뢰성 및 성능 분야는 항상 진화하고 많은 기업들이 집중하고 있다. LED에서 중요한 요소인 방열성능을 개선시키기 위해 많은 연구를 행하고 있다. 그리고 광원 개발분야에서도, 반도체 광원의 LED PKG의 다량 실장으로 고출력을 행하는 것 보다는 기판위에 Blue Chip을 실장하여 제작하는 고출력 광원의 기술로 집중되고 있다. 이 논문에서는 고출력 광원인 COB(Chip On Board) LED의 방열성능 개선을 다루었다. 기판의 구조 변형으로 방열특성 개선 대안을 제시하였다. Via hole과 Cavity를 이용한 구조를 제안하였다. 그에 대한 해석 방법으로는, 구조적인 해석과 수치적인 해석을 활용하였다. 그 결과로는 약 13~40%의 방열성능 개선을 나타내었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1609_1610
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• 2009

LED는 광학특성을 유지하기 위해서 최적의 방열설계가 요구된다. 이 논문에서는 입력FR-4의 Top Layer의 면적을 506.25[$mm^2$]이상으로 확대함으로써, 인가 전력 0.5W 조건하에서 FR-4 PCB로 MCPCB와 유사한 방열 특성을 발휘할 수 있음을 열화상카메라를 통한 측정 및 전산모사를 이용하여 확인하였다.

• 한국광학회지
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• 제31권2호
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• pp.81-87
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• 2020

본 연구에서는 좁은 지향각, 높은 최대 중심광도를 갖는 탐조등 광학계 설계 기술 연구를 진행하였다. 기존 탐조등 광원인 할로겐램프와 제논램프는 진동과 충격에 취약하며, 크기가 크고 무거워 운반에 많은 어려움이 있다. 또한 탐조등 후면부에 위치한 포물경은 제작 시 광원과 조립 오차에 따른 성능 저하와 낮은 광 효율의 단점을 지니고 있다. 이를 해결하기 위해 본 논문에서는 1 kW 할로겐램프를 150 W급 고출력 COB LED로 대체하고 목표 성능을 만족하기 위한 고효율 TIR 렌즈를 설계하였다. 이후 광학계 사출 시 발생하는 표면 오차를 해결하는 방안으로 TIR 렌즈 어레이를 제시하여 제작 신뢰성을 확보하였다. 설계된 광학계를 바탕으로 시제품을 제작한 후 시중 할로겐램프 탐조등과 성능을 비교하여 광학 성능의 우수함을 확인하였다.

• International Journal of Internet, Broadcasting and Communication
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• 제7권2호
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• pp.161-167
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• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.