• Title/Summary/Keyword: CMOS sensor

검색결과 521건 처리시간 0.028초

Direct RTI Fingerprint Identification Based on GCMs and Gabor Features Around Core point

  • Cho, Sang-Hyun;Sung, Hyo-Kyung;Park, Jin-Geun;Park, Heung-Moon
    • Proceedings of the IEEK Conference
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    • 대한전자공학회 2000년도 ITC-CSCC -1
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    • pp.446-449
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    • 2000
  • A direct RTI(Rotation and translation invariant) fingerprint identification is proposed using the GCMs(generalized complex moments) and Gabor filter-based features from the grey level fingerprint around core point. The core point is located as reference point for the translation invariant matching. And its symmetry axis is detected for the rotation invariant matching from its neighboring region centered at the core point. And then, fingerprint is divided into non-overlapping blocks with respect to the core point and, in contrast to minutiae-based method using various processing steps, features are directly extracted from the blocked grey level fingerprint using Gabor filter, which provides information contained in a particular orientation in the image. The Proposed fingerprint identification is based on the Euclidean distance of the corresponding Gabor features between the input and the template fingerprint. Experiments are conducted on 300 ${\times}$ 300 fingerprints obtained from the CMOS sensor with 500 dpi resolution, and the proposed method could obtain 97% identification rate.

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Moving Pixel Displacement Detection using Correlation Functions on CIS Image

  • Ryu, Kwang-Ryol;Kim, Young-Bin
    • Journal of information and communication convergence engineering
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    • 제8권4호
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    • pp.349-354
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    • 2010
  • Moving pixel displacement detection algorithm using correlation functions for making panorama image on the continuous images is presented in this paper. The input images get from a CMOS image sensor (CIS). The camera is maintained by constant brightness and uniform sensing area in test input pattern. For simple navigation and capture image has to 70% overlapped region. A correlation rate in two image data is evaluated by using reference image with first captures, and compare image with next captures. The displacement of the two images are expressed to second order function of x, y and solved with finding the coefficient in second order function. That results in the change in the peak correlation displacement from the reference to the compare image, is moving to pixel length. The navigating error is reduced by varying the path because the error is shown in the difference of the positioning vector between the true pixel position and the navigated pixel position. The algorithm performance is evaluated to be different from the error vector to vary the navigating path grid.

Design and fabrication of the Built-in Testing Circuit for Improving IC Reliability (IC 신뢰성 향상을 위한 내장형 고장검출 회로의 설계 및 제작)

  • Ryu, Jang-Woo;Kim, Hoo-Sung;Yoon, Jee-Young;Hwang, Sang-Joon;Sung, Man-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • 제18권5호
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    • pp.431-438
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    • 2005
  • In this paper, we propose the built-in current testing circuit for improving reliability As the integrated CMOS circuits in a chip are increased, the testability on design and fabrication should be considered to reduce the cost of testing and to guarantee the reliability In addition, the high degree of integration makes more failures which are different from conventional static failures and introduced by the short between transistor nodes and the bridging fault. The proposed built-in current testing method is useful for detecting not only these failures but also low current level failures and faster than conventional method. In normal mode, the detecting circuit is turned off to eliminate the degradation of CUT(Circuits Under Testing). The differential input stage in detecting circuit prevents the degradation of CUT in test mode. It is expected that this circuit improves the quality of semiconductor products, the reliability and the testability.

Breakage Detection of Small-Diameter Tap Using Vision System in High-Speed Tapping Machine with Open Architecture Controller

  • Lee, Don-Jin;Kim, Sun-Ho;Ahn, Jung-Hwan
    • Journal of Mechanical Science and Technology
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    • 제18권7호
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    • pp.1055-1061
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    • 2004
  • In this research, a vision system for detecting breakages of small-diameter taps, which are rarely detected by the indirect in-process monitoring methods such as acoustic emission, cutting torque and motor current, was developed. Two HMI (Human Machine Interface) programs to embed the developed vision system into a Siemens open architecture controller, 840D, were developed. They are placed in sub-windows of the main window of the 840D and can be activated or deactivated either by a softkey on the operating panel or the M code in the NC part program. In the event that any type of tool breakage is detected, the HMI program issues a command for an automatic tool change or sends an alarm signal to the NC kernel. An evaluation test in a high-speed tapping machine showed that the developed vision system was successful in detecting breakages of small-diameter taps up to M1.

The Optical Measurement and Quantitative Analysis of Algesia in Spodoptera litura Larva

  • Chen, Ying-Yun;Chang, Rong-Seng;Tsai, Mi-Yin;Chen, Der-Chin
    • Journal of the Optical Society of Korea
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    • 제19권2호
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    • pp.169-174
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    • 2015
  • Muscle vibration measurement has long been an unique scientific study, in general, and the direct reaction of animals to feel pain (algesia), either from vascular or muscle contraction, is a complex perceptual experience. Thus this paper proposes a way to measure animal algesia quantitatively, by measuring the changes in muscle vibration due to a pinprick on the surface of the skin of a Spodoptera litura larva. Using the laser optical triangulation measurement principle, along with a CMOS image sensor, linear laser, software analysis, and other tools, we quantify the subtle object point displacement, with a precision of up to $10{\mu}m$, for our chosen Spodoptera litura larva animal model, in which it is not easy to identify the tiny changes in muscle contraction dynamics with the naked eye. We inject different concentrations of formalin reagent (empty needle, 12% formalin, and 37% formalin) to obtain a variety of different muscle vibration frequencies as the experimental results. Because of the high concentrations of reagent applied, we see a high frequency shift of muscle vibration, which can be presented as pain indices, so that the algesia can be quantified.

Real-Time Obstacle Avoidance of Autonomous Mobile Robot and Implementation of User Interface for Android Platform (자율주행 이동로봇의 실시간 장애물 회피 및 안드로이드 인터페이스 구현)

  • Kim, Jun-Young;Lee, Won-Chang
    • IEMEK Journal of Embedded Systems and Applications
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    • 제9권4호
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    • pp.237-243
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    • 2014
  • In this paper we present an real-time obstacle avoidance technique of autonomous mobile robot with steering system and implementation of user interface for mobile devices with Android platform. The direction of autonomous robot is determined by virtual force field concept, which is based on the distance information acquired from 5 ultrasonic sensors. It is converted to virtual repulsive force around the autonomous robot which is inversely proportional to the distance. The steering system with PD(proportional and derivative) controller moves the mobile robot to the determined target direction. We also use PSD(position sensitive detector) sensors to supplement ultrasonic sensors around dead angle area. The mobile robot communicates with Android mobile device and PC via Ethernet. The video information from CMOS camera mounted on the mobile robot is transmitted to Android mobile device and PC. And the user can control the mobile robot manually by transmitting commands on the user interface to it via Ethernet.

A Reliability and warpage of wafer level bonding for CIS device using polymer (폴리머를 이용한 CIS(CMOS Image Sensor) 디바이스용 웨이퍼 레벨 접합의 warpage와 신뢰성)

  • Park, Jae-Hyun;Koo, Young-Mo;Kim, Eun-Kyung;Kim, Gu-Sung
    • Journal of the Microelectronics and Packaging Society
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    • 제16권1호
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    • pp.27-31
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    • 2009
  • In this paper, the polymer adhesive bonding technology using wafer-level technology was investigated and warpage results were analyzed. Si and glass wafer was bonded after adhesive polymer layer and dam pattern for uniform state was patterned on glass wafer. In this study, warpage result decreased as the low of bonding temperature of Si wafer, bonding pressure and height of adhesive bonding layer. The availability of adhesive polymer bonding was confirmed by TC, HTC, Humidity soak test after dicing. The result is that defect has not found without reference to warpage.

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Optical Design of a Reflecting Telescope for CubeSat

  • Jin, Ho;Lim, Juhee;Kim, Youngju;Kim, Sanghyuk
    • Journal of the Optical Society of Korea
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    • 제17권6호
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    • pp.533-537
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    • 2013
  • Space telescope optics is one of the major parts of any space mission used to observe astronomical targets or the Earth. This kind of space mission typically involves bulky and complex opto-mechanics with a long optical tube, but attempts have been made to observe a target with a small satellite. In this paper, we describe the optical design of a reflecting telescope for use in a CubeSat mission. For this design we adopt the off-axis segmented method for astronomical observation techniques based on a Ritchey-Chr$\acute{e}$tien type telescope. The primary mirror shape is a rectangle with dimensions of $8cm{\times}8cm$, and the secondary mirror has dimensions of $2.4cm{\times}4.1cm$. The focal ratio is 3 which can yield a 0.383 degree diagonal angle in a $1280{\times}800$ CMOS color image sensor with a pixel size of $3{\mu}m{\times}3{\mu}m$. This optical design can capture a ${\sim}4km{\times}{\sim}2.3km$ area of the earth's surface at 700 km altitude operation.

Manufacture of TSVs (Through-Silicon Vias) based on Single-Walled Nanotubes (SWNTs)/Sn Composite at Low Temperature (저온 공정을 통해 제작이 가능한 Sn/SWNT 혼합 파우더 기반의 TSV구조 개발)

  • Jung, Dong Geon;Jung, Daewoong;Kong, Seong Ho
    • Journal of Sensor Science and Technology
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    • 제28권2호
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    • pp.127-132
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    • 2019
  • In this study, the fabrication of through-silicon vias (TSVs) filled with SWNTs/Sn by utilizing surface/bulk micromachining and MEMS technologies is proposed. Tin (Sn) and single-walled nanotube (SWNT) powders are used as TSV interconnector materials in the development of a novel TSV at low temperature. The measured resistance of a TSV filled with SWNT/Sn powder is considerably reduced by increasing the fraction of Sn and is lower than that of a TSV filled with only Sn. This is because of a decrease in the surface scattering of electrons along with an increase in the grain size of sintered SWNTs/Sn. The proposed method is conducted at low temperatures (< $400^{\circ}C$) due to the low melting temperature of Sn; hence, the proposed TSVs filled with SWNTs/Sn can be utilized in CMOS based applications.

A 2-GHz 8-bit Successive Approximation Digital-to-Phase Converter (2 GHz 8 비트 축차 비교 디지털-위상 변환기)

  • Shim, Jae Hoon
    • Journal of Sensor Science and Technology
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    • 제28권4호
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    • pp.240-245
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    • 2019
  • Phase interpolation is widely adopted in frequency synthesizers and clock-and-data recovery systems to produce an intermediate phase from two existing phases. The intermediate phase is typically generated by combining two input phases with different weights. Unfortunately, this results in non-uniform phase steps. Alternatively, the intermediate phase can be generated by successive approximation, where the interpolated phase at each approximation stage is obtained using the same weight for the two intermediate phases. As a proof of concept, this study presents a 2-GHz 8-bit successive approximation digital-to-phase converter that is designed using 65-nm CMOS technology. The converter receives an 8-phase clock signal as input, and the most significant bit (MSB) section selects four phases to create two sinusoidal waveforms using a harmonic rejection filter. The remaining least significant bit (LSB) section applies the successive approximation to generate the required intermediate phase. Monte-Carlo simulations show that the proposed converter exhibits 0.46-LSB integral nonlinearity and 0.31-LSB differential nonlinearity with a power consumption of 3.12 mW from a 1.2-V supply voltage.