• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.817-824
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• 2016

A simultaneous bidirectional transceiver over a single wire has been developed in a 65 nm CMOS technology for a command and control bus. The echo signals of the simultaneous bidirectional link are cancelled by controlling the decision level of receiver comparators without power-hungry operational amplifier (op-amp) based circuits. With the clock information embedded in the rising edges of the signals sent from the source side to the sink side, the data is recovered by an open-loop digital circuit with 20 times blind oversampling. The data rate of the simultaneous bidirectional transceiver in each direction is 75 Mbps and therefore the overall signaling bandwidth is 150 Mbps. The measured energy efficiency of the transceiver is 56.7 pJ/b and the bit-error-rate (BER) is less than $10^{-12}$ with $2^7-1$ pseudo-random binary sequence (PRBS) pattern for both signaling directions.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.629-631
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• 2004

The proposed output buffer is presented for driving large-size LCD panels. This output buffer is designed by adding some simple circuitry to the conventional two-stage operational amplifier. The proposed circuit is simulated in a high-voltage 0.35um CMOS process with HSPICE. The simulated result is more improved settling time than that of conventional one.

• Journal of Sensor Science and Technology
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• v.3 no.3
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• pp.22-27
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• 1994

Design of potentiostat and I-V converter for micro pO2 sensor is described. Also, The operation of the designed circuit, in connection with the eqivalent model of micro pO2 sensor, is simulated. The potentiostat showed low output resistance of $l.1k{\Omega}$ and input voltage range of $-3{\sim}2.5V$. And the I-V converter showed low input resistance of $30{\Omega}$ and good linearity between input and output.

• Journal of Power Electronics
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• v.15 no.4
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• pp.1131-1138
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• 2015

This study presents an input-powered high-efficiency interface circuit for energy harvesting systems, and introduces a zero standby power design to reduce power consumption significantly while removing the external power supply. This interface circuit is composed of two stages. The first stage voltage doubler uses a positive feedback control loop to improve considerably the conversion speed and efficiency, and boost the output voltage. The second stage active diode adopts a common-grid operational amplifier (op-amp) to remove the influence of offset voltage in the traditional comparator, which eliminates leakage current and broadens bandwidth with low power consumption. The system supplies itself with the harvested energy, which enables it to enter the zero standby mode near the zero crossing points of the input current. Thereafter, high system efficiency and stability are achieved, which saves power consumption. The validity and feasibility of this design is verified by the simulation results based on the 65 nm CMOS process. The minimum input voltage is down to 0.3 V, the maximum voltage efficiency is 99.6% with a DC output current of 75.6 μA, the maximum power efficiency is 98.2% with a DC output current of 40.4 μA, and the maximum output power is 60.48 μW. The power loss of the entire interface circuit is only 18.65 μW, among which, the op-amp consumes only 2.65 μW.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.12
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• pp.77-84
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• 1998

A voltage controlled chaotic circuit has been designed in integrated circuit and fabricated by using 0.8$\mu\textrm{m}$ single poly CMOS technology. The fabricated chaotic circuit consist of sample and hold circuits, op-amps, nonlinear function generator and two phase clock generator. The test results of the chaotic circuit show that periodic state, quasi-periodic state and chaotic state can be obtained according to the input control voltage with the ${\pm}$2.5V power supply and clock rate of 20kHz. In addition, two dimensional chaotic patterns have been observed by connecting this circuit in parallel or series

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.273-279
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• 2002

This paper presents a fabrication technology for the integration of single crystal Si microstructures with on-chip circuitry. It is a dissolved wafer technique that combines an electro-chemical etch-stop for the protection of circuitry with an impurity-based etch-stop for the microstructures, both of which are defined in an n-epi layer on a p-type Si wafer. A CMOS op. amp. has been integrated with $p^{++}$ Si accelerometers using this process. It has a gain of 68 dB and an output swing within 0.2 V of its power supplies, unaffected by the wafer dissolution. The accelerometers have $3{\;}\mu\textrm{m}$ thick suspension beams and $15{\;}\mu\textrm{m}$ thick proof masses. The structural and electrical integrity of the fabricated devices demonstrates the success of the fabrication process. A variety of lead transfer methods are shown, and process details are discussed.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1862-1863
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• 2007

Testing the analog/mixed-signal circuitry of a mixed-signal IC has become a difficult task. Offset error, gain error, Non-monotonic behavior, Differential Non-linearity(DNL) error, Integral Non-linearity(INL) error are important specifications used as test parameters for DAC. In this paper, we propose an efficient BIST structure for DAC testing. The proposed BIST adds the circuit which uses the capacitor and op-amp, and accomplishes a test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.347-348
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• 2007

On-chip micro humidity sensor, using $CN_x$ films for the sensing material, was designed, simulated, and fabricated with Op amp based readout circuit and diode temperature sensors. To compensate the temperature and other gases, two methods were applied. One is wheatstone-bridge with reference FET that eliminates other undesirable chemical species, and the other is a diode temperature sensor to compensate the temperature effect. $CN_x$ film can be a new humidity sensing material, and has a strong potential to adapt to smart sensors or multi-sensors using MEMS or nano-technology. A particular design technology for integration of sensors and systems together was proposed that whole fabrication process could be achieved by a standard CMOS process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.7
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• pp.42-48
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• 2016

In this paper, a high-precision peak detector circuit that detects the output voltage information of a fly-back converter is proposed. The proposed design consists of basic analog elements with only one operational amplifier and three transistors. Because of its simple structure, the proposed circuit can minimize the delay time of the detection process, which has a strong impact on the precision of the regulation aspect of the fly-back converter. Furthermore, by using an amplifier and several transistors, the proposed detector can be fully integrated on-chip, instead of using discrete circuit elements, such as capacitors and diodes, as in conventional designs, which reduces the production cost of the fly-back converter module. In order to verify the performance of the proposed scheme, the peak detector was simulated and implemented by using a 0.35 m MagnaChip process. The gained results from the simulation with a sinusoidal stimulus signal show a very small detection error in the range of 0.3~3.1%, which is much lower than other reported detecting circuits. The measured results from the fabricated chip confirm the simulation results. As a result, the proposed peak detector is recommended for designs of high-performance fly-back converters in order to improve the poor regulation aspect seen in conventional designs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.3
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• pp.160-165
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• 2009

A 12b 2 MS/s cyclic ADC processing 3.3 Vpp single-ended rail-to-rail input signals is presented. The proposed ADC demonstrates an offset voltage less than 1 mV without well-known calibration and trimming techniques although power supplies are directly employed as voltage references. The SHA-free input sampling scheme and the two-stage switched op-amp discussed in this work reduce power dissipation, while the comparators based on capacitor-divided voltage references show a matched full-scale performance between two flash sub ADCs. The prototype ADC in a $0.18{\mu}m$ 1P6M CMOS demonstrates the effective number of bits of 11.48 for a 100 kHz full-scale input at 2 MS/s. The ADC with an active die area of $0.12\;mm^2$ consumes 3.6 m W at 2 MS/s and 3.3 V (analog)/1.8 V (digital).