• Transactions of the Korean Society of Mechanical Engineers A
• /
• 제32권4호
• /
• pp.371-377
• /
• 2008

Our precedent study has reported glass-PDMS (polydimethylsiloxane) based biochip for the gene PCR (polymerase chain reaction). To prevent the contamination of bio sample, the once used biochip must not be used repeatedly. However, the fabrication cost of microheater and microsensor of the biochip was not cheap to use it as a disposable chip. This paper proposes new PCR-chip where the glass substrate integrated with the microheater and microsensor is detachable from the reaction chamber where the sample is injected. That makes it possible to reuse the glass substrate repeatedly. The performance of the proposed detachable PCR-chip was compared with that of the precedent monolithic PCR-chip. The results showed that the SRY (sex determining Y chromosome) gene PCR was successfully performed in the detachable chip compared with the monolithic chip. However, the more efforts to improve the efficiency of surface treatment of PDMS chip are needed to increase the possibility of applying the detachable chip to the detecting of male infertility.

• Animal cells and systems
• /
• 제14권1호
• /
• pp.1-10
• /
• 2010

Previously we showed that CHIP, a co-chaperone of Hsp70 and E3 ubiquitin ligase, can promote the degradation of mutant SOD1 linked to familial amyotrophic lateral sclerosis (fALS) via a mechanism not involving SOD1 ubiquitylation. Here we present evidence that CHIP functions in the interaction of mutant SOD1 with 26S proteasomes. Bag-1, a coupling factor between molecular chaperones and the proteasomes, formed a complex with SOD1 in an hsp70-dependent manner but had no direct effect on the degradation of mutant SOD1. Instead, Bag-1 stimulated interaction between CHIP and the proteasome-associated protein VCP (p97), which do not associate normally. Over-expressed CHIP interfered with the association between mutant SOD1 and VCP. Conversely, the binding of CHIP to mutant SOD1 was inhibited by VCP, implying that the chaperone complex and proteolytic machinery are competing for the common substrates. Finally we observed that mutant SOD1 strongly associated with the 19S complex of proteasomes and CHIP over-expression specifically reduced the interaction between S6/S6' ATPase subunits and mutant SOD1. These results suggest that CHIP, together with ubiquitin-binding proteins such as Bag-1 and VCP, promotes the degradation of mutant SOD1 by facilitating its translocation from ATPase subunits of 19S complex to the 20S core particle.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
• /
• pp.146-150
• /
• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• Proceedings of the KIEE Conference
• /
• 대한전기학회 2001년도 합동 추계학술대회 논문집 정보 및 제어부문
• /
• pp.376-379
• /
• 2001

In this paper, I design the control chip that controls inner test sequence of Logic Tester to test chip. Logic tester has the thirteen inner instructions to control test sequence in test. And these instructions are saved in memory with test pattern data. Control chip generates address and control signal such as read, write signal of memory. Before testing, necessary data such as start address, end address, etc. are written to inner register of control chip. When test started, control chip receives the instruction in start address and executes, and generates address and control signals to access tester' inner memory. So whole test sequence is controlled by making the address and control signal in tester's inner memory. Control chip designs instruction's execution blocks, respectively. So if inner instruction is added from now on, a revision is easy. The control chip will be made using FPGA of Xilinx Co. in future.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• 제23권4호
• /
• pp.330-336
• /
• 2014

The continuous chip generated in cutting process deteriorates workpiece, tool, and machine tool system. It is necessary to treat this continuous chip in ductile material machining condition for stable cutting. This paper deals with the chip control method using acoustic emission(AE) signal in pure copper turning operation. AE raw signals, root mean square(RMS) signals and wavelet transformed signals measured in turning process are introduced to analysis for chip patterns. With analysis of AE signals, it is obtained that the produced chip patterns are correlated with the specified AE signals which are transformed by fuzzy pattern algorithm. By this experimental investigation, the chip patterns can be classified at significant level in pure copper machining process and controlled from continuous chips to reduced-length stable chips.

• Journal of the Korean Institute of Intelligent Systems
• /
• 제23권4호
• /
• pp.286-291
• /
• 2013

In this paper, in-line type flip chip bump 3D inspection equipment, using white light interferometer with large F.O.V., which is aimed to be used in flip chip bump test process is developed. Results of flip chip bump height measurement in many substrates and repeatability test results for the bumps in fixed location of each substrate are shown. Test results from test bench and those from developed flip chip bump 3D inspection equipment are compared and as a result repeatability is improved by reducing the impact of system vibration. A valuation basis for the testing quality of flip chip bump 3D inspection equipment is proposed.

• Journal of the Korean Wood Science and Technology
• /
• 제26권1호
• /
• pp.70-75
• /
• 1998

In this paper, the relationships between volumetric mixing ratio of rubber chip and physical and mechanical properties of wood/rubber composite panel was examined in order to investigate the mixture characteristics of wood and rubber chip. Because of the specific gravity of rubber differed from wood chip, physical properties of wood/rubber composite panel was shown very different values by mixing rate of chip element. Specific gravity in air-dry of composite panel was increased rapidly as volumetric percent of rubber chip was increased. Moisture content of composite panel was decreased as volumetric percent of rubber chip element was increased. This results was considered that wood weight is light and porosity material for moisture absorption. Compressive strength and modulus of rupture in bending test were decreased as volumetric percent of rubber chip increased. By mixing ratio control of chip elements, various wood/rubber composite panel can be applicable to every interior materials such as subfloor, playground, and exterior materials such as road blocks for recreational facilities in garden and forest and city parks.

• ETRI Journal
• /
• 제42권6호
• /
• pp.943-950
• /
• 2020

We propose 8.2-GHz band radar RFICs for an 8 × 8 phased-array frequency-modulated continuous-wave receiver developed using 65-nm CMOS technology. This receiver panel is constructed using a multichip solution comprising fabricated 2 × 2 low-noise amplifier phase-shifter (LNA-PS) chips and a 4ch RX front-end chip. The LNA-PS chip has a novel phase-shifter circuit for low-voltage operation, novel active single-to-differential/differential-to-single circuits, and a current-mode combiner to utilize a small area. The LNA-PS chip shows a power gain range of 5 dB to 20 dB per channel with gain control and a single-channel NF of 6.4 dB at maximum gain. The measured result of the chip shows 6-bit phase states with a 0.35° RMS phase error. The input P1 dB of the chip is approximately -27.5 dBm at high gain and is enough to cover the highest input power from the TX-to-RX leakage in the radar system. The gain range of the 4ch RX front-end chip is 9 dB to 30 dB per channel. The LNA-PS chip consumes 82 mA, and the 4ch RX front-end chip consumes 97 mA from a 1.2 V supply voltage. The chip sizes of the 2 × 2 LNA-PS and the 4ch RX front end are 2.39 mm × 1.3 mm and 2.42 mm × 1.62 mm, respectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• 제24권12호
• /
• pp.1120-1127
• /
• 2013

In this paper, novel chip-on-chip(CoC) flip-chip bump structures using chip-on-wafer(CoW) process technology are proposed, designed and fabricated, and their microwave frequency responses are analyzed. With conventional bumps of Cu pillar/SnAg and Cu pillar/Ni/SnAg and novel Polybenzoxazole(PBO)-passivated bumps of Cu pillar/SnAg, Cu pillar/Ni/SnAg and SnAg with the deposition option of $2^{nd}$ Polyimide(PI2) layer on the wafer, 10 kinds of CoC samples are designed and their frequency responses up to 20 GHz are investigated. The measurement results show that the bumps on the wafers with PI2 layers are better for the batch flip-chip process and have average insertion loss of 0.14 dB at 18 GHz. The developed bump structures for chips with fine-pitch pads show similar or slightly better insertion loss of 0.11~0.14 dB up to 18 GHz, compared with that of 0.13~0.17 dB of conventional bump structures in this study, and we find that they could be utilized in various microwave packages for high integration density.

• Journal of the Microelectronics and Packaging Society
• /
• 제20권4호
• /
• pp.17-23
• /
• 2013

As a basic research to develop stretchable electronic packaging technology, CNT-Ag composite pads were formed on top of Cu/Sn chip bumps and flip-chip bonded using anisotropic conductive adhesive. Average contact resistances of the flip-chip joints were measured with respect to bonding pressure and presence of the CNT-Ag composite pads. When Cu/Sn chip bumps with CNT-Ag composite pads were flip-chip bonded to substrate Cu pads at 25MPa or 50 MPa, contact resistance was too high to measure. The specimen processed by flip-chip bonding the Cu/Sn chip bumps with CNT-Ag composite pads to the substrate Cu pads exhibited an average contact resistance of $213m{\Omega}$. On the other hand, the flip-chip specimens processed by bonding Cu/Sn chip bumps without CNT-Ag composite pads to substrate Cu pads at 25MPa, 50MPa, and 100MPa exhibited average contact resistances of $370m{\Omega}$, $372m{\Omega}$, and $112m{\Omega}$, respectively.