• Title/Summary/Keyword: CHIP

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The design and development of Control/Storage and TRX Module for Small Satellite Synthetic Aperture Radar Application (초소형위성 영상레이다를 위한 제어/저장 및 송수신 모듈의 설계 및 제작)

  • Lee, Juyoung;Kim, Hyunchul;Kim, Jongpil;Yu, Kyungdeok;Kim, Dongsik
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.22 no.6
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    • pp.31-36
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    • 2022
  • In this paper, we present the design, manufacture and test results of Backend unit for SAR(Synthetic Aperture Radar) that can be applied on a small satellite. The Backend unit for SAR was designed with a control/storage board, TRX(transmission and receiving) board and a power supply board as a single unit in consideration of the applying of a small satellite. The control/storage board uses RFSoC to generate wideband chirp signal, generate operating timings, and perform control and calculations for SAR operation. The TRX board is designed to convert the wideband chirp signal generated by the control/storage board to the operating frequency of X-band by up-converting the frequency. Since small size, light weight, and low cost are important consideration for small satellite, MIL/Industrial grade components were appropriately applied and the at the same time it was designed to ensure mission life through the radiation test, analysis and space environment tests.

Paper Based Point-of-Care Diagnosis for Appropriate Technology (적정기술을 위한 종이기반 현장 진단 기술)

  • Shin, Kwanwoo;Kwon, Oh-Sun
    • Journal of Appropriate Technology
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    • v.5 no.1
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    • pp.46-53
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    • 2019
  • It should be supported by the ease and economic production in terms of appropriate technology to be widely used in the real applying fields. In particular, the diagnosis of diseases is one of the most difficult areas to apply to the developing countries compared to other fields because of the high costs of professional manpower, equipment, and medial reagents. In recent years, paper, which is one of the most common materials around, has been used to fabricate the disease diagnostic chips, particularly without any special facilities or the equipment. These new technologies lead the possibility of using point-of-care testing devices that can be manufactured quickly in the field by lowering the production cost. These paperbased technologies will contribute to solve many of the deadliest medical problems in developing countries and ultimately improve the quality of human life.

Robustness Evaluation of GaN Low-Noise Amplifier in Ka-band (Ka-대역 GaN 저잡음 증폭기의 강건성 평가)

  • Lee, Dongju;An, Se-Hwan;Joo, Ji-Han;Kwon, Jun-Beom;Kim, Younghoon;Lee, Sanghun;Seo, Mihui;Kim, Sosu
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.22 no.6
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    • pp.149-154
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    • 2022
  • Due to high power capabilities and high linearity of GaN devices, GaN Low-Noise Amplifiers (LNAs) without a limiter can be implemented in order to improve noise figure and reduce chip area in radar receivers. In this paper, a GaN LNA is presented for Ka-band radar receivers. The designed LNA was realized in a 150-nm GaN HEMT process and measurement results show that the voltage gain of >23 dB and the noise figure of <6.5 dB including packaging loss in the target frequency range. Under the high-power stress test, measured gain and noise figure of the GaN LNA is degraded after the first stress test, but no more degradation is observed under multiple stress tests. Through post-stress noise and s-parameter measurements, we verified that the GaN LNA is resilient to pulsed input power of ~40 dBm.

Investigating the Cause of Ash Deposition and Equipment Failure in Wood Chip-Fueled Cogeneration Plant (우드칩을 연료로 하는 열병합발전소의 회분 퇴적 및 설비 고장 원인 분석)

  • Min Ji Song;Woo Cheol Kim;Heesan Kim;Jung-Gu Kim;Soo Yeol Lee
    • Corrosion Science and Technology
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    • v.22 no.3
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    • pp.187-192
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    • 2023
  • The use of biomass is increasing as a response to the convention on climate change. In Korea, a method applied to replace fossil fuels is using wood chips in a cogeneration plant. To remove air pollutants generated by burning wood chips, a selective denitrification facility (Selective catalytic reduction, SCR) is installed downstream. However, problems such as ash deposition and descaling of the equipment surface have been reported. The cause is thought to be unreacted ammonia slip caused by ammonia ions injected into the reducing agent and metal corrosion caused by an acidic environment. Element analysis confirmed that ash contained alkali metals and sulfur that could cause catalyst poisoning, leading to an increase in the size of ash particle and deposition. Measurement of the size of ash deposited inside the facility confirmed that the size of ash deposited on the catalyst was approximately three times larger than the size of generally formed ash. Therefore, it was concluded that a reduction in pore area of the catalyst by ash deposition on the surface of the catalyst could lead to a problem of increasing differential pressure in a denitrification facility.

Characterization analysis of Rongchang pig population based on the Zhongxin-1 Porcine Breeding Array PLUS

  • Dong Leng;Liangpeng Ge;Jing Sun
    • Animal Bioscience
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    • v.36 no.10
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    • pp.1508-1516
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    • 2023
  • Objective: To carry out a comprehensive production planning of the existing Rongchang pig population from both environmental and genetic aspects, and to establish a closed population with stable genetic diversity and strict pathogen control, it is necessary to fully understand the genetic background of the population. Methods: We genotyped 54 specific pathogen free (SPF) Rongchang pigs using the Zhongxin-1 Porcine Breeding Array PLUS, calculated their genetic diversity parameters and constructed their families. In addition, we also counted the runs of homozygosity (ROH) of each individual and calculated the value of inbreeding coefficient based on ROH for each individual. Results: Firstly, the results of genetic diversity analysis showed that the effective population size (Ne) of this population was 3.2, proportion of polymorphic markers (PN) was 0.515, desired heterozygosity (He) and observed heterozygosity (Ho) were 0.315 and 0.335. Ho was higher than He, indicating that the heterozygosity of all the selected loci was high. Secondly, combining the results of genomic relatedness analysis and cluster analysis, it was found that the existing Rongchang pig population could be divided into four families. Finally, we also counted the ROH of each individual and calculated the inbreeding coefficient value accordingly, whose mean value was 0.09. Conclusion: Due to the limitation of population size and other factors, the genetic diversity of this Rongchang pig population is low. The results of this study can provide basic data to support the development of Rongchang pig breeding program, the establishment of SPF Rongchang pig closed herd and its experimental utilization.

Fabrication of Flexible Micro LED for Beauty/Biomedical Applications (미용/의료용 유연 마이크로 발광 다이오드 디바이스 제작 공정)

  • Jae Hee Lee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.6
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    • pp.563-569
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    • 2023
  • Micro light-emitting diodes (LEDs), with a chip size of 100 micrometers or less, have attracted significant attention in flexible displays, augmented reality/virtual reality (AR/VR), and bio-medical applications as next-generation light sources due to their outstanding electrical, optical, and mechanical performance. In the realm of bio-medical devices, it is crucial to transfer tiny micro LED chips onto desired flexible substrates with low precision errors, high speed, and high yield for practical applications on various parts of the human body, including someone's face and organs. This paper aims to introduce a fabrication process for flexible micro LED devices and propose micro LED transfer techniques for cosmetic and medical applications. Flexible micro LED technology holds promise for treating skin disorders, cancers, and neurological diseases.

Heat Dissipation Trends in Semiconductors and Electronic Packaging (반도체 및 전자패키지의 방열기술 동향)

  • S.H. Moon;K.S. Choi;Y.S. Eom;H.G. Yun;J.H. Joo;G.M. Choi;J.H. Shin
    • Electronics and Telecommunications Trends
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    • v.38 no.6
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

Configurable Smart Contracts Automation for EVM based Blockchains

  • ZAIN UL ABEDIN;Muhammad Shujat Ali;Ashraf Ali;Sana Ejaz
    • International Journal of Computer Science & Network Security
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    • v.23 no.10
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    • pp.147-156
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    • 2023
  • Electronic voting machines (EVMs) are replacing research ballots due to the errors involved in the manual counting process and the lengthy time required to count the votes. Even though these digital recording electronic systems are advancements, they are vulnerable to tampering and electoral fraud. The suspected vulnerabilities in EVMs are the possibility of tampering with the EVM's memory chip or replacing it with a fake one, their simplicity, which allows them to be tampered with without requiring much skill, and the possibility of double voting. The vote data is shared among all network devices, and peer-to-peer verification is performed to ensure the vote data's authenticity. To successfully tamper with the system, all of the data stored in the nodes must be changed. This improves the proposed system's efficiency and dependability. Elections and voting are fundamental components of a democratic system. Various attempts have been made to make modern elections more flexible by utilizing digital technologies. The fundamental characteristics of free and fair elections are intractability, immutability, transparency, and the privacy of the actors involved. This corresponds to a few of the many characteristics of blockchain-like decentralized ownership, such as chain immutability, anonymity, and distributed ledger. This working research attempts to conduct a comparative analysis of various blockchain technologies in development and propose a 'Blockchain-based Electronic Voting System' solution by weighing these technologies based on the need for the proposed solution. The primary goal of this research is to present a robust blockchain-based election mechanism that is not only reliable but also adaptable to current needs.

Development of an FPGA-based Sealer Coating Inspection Vision System for Automotive Glass Assembly Automation Equipment (자동차 글라스 조립 자동화설비를 위한 FPGA기반 실러 도포검사 비전시스템 개발)

  • Ju-Young Kim;Jae-Ryul Park
    • Journal of Sensor Science and Technology
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    • v.32 no.5
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    • pp.320-327
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    • 2023
  • In this study, an FPGA-based sealer inspection system was developed to inspect the sealer applied to install vehicle glass on a car body. The sealer is a liquid or paste-like material that promotes adhesion such as sealing and waterproofing for mounting and assembling vehicle parts to a car body. The system installed in the existing vehicle design parts line does not detect the sealer in the glass rotation section and takes a long time to process. This study developed a line laser camera sensor and an FPGA vision signal processing module to solve this problem. The line laser camera sensor was developed such that the resolution and speed of the camera for data acquisition could be modified according to the irradiation angle of the laser. Furthermore, it was developed considering the mountability of the entire system to prevent interference with the sealer ejection machine. In addition, a vision signal processing module was developed using the Zynq-7020 FPGA chip to improve the processing speed of the algorithm that converted the profile to the sealer shape image acquired from a 2D camera and calculated the width and height of the sealer using the converted profile. The performance of the developed sealer application inspection system was verified by establishing an experimental environment identical to that of an actual automobile production line. The experimental results confirmed the performance of the sealer application inspection at a level that satisfied the requirements of automotive field standards.

Ka-band CMOS 2-Channel Image-Reject Receiver (Ka-대역 CMOS 2채널 이미지 제거 수신기)

  • Dongju Lee;Se-Hwan An;Ji-Han Joo;Jun-Beom Kwon;Younghoon Kim;Sanghun Lee
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.23 no.5
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    • pp.109-114
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    • 2023
  • In this paper, a 2-channel Image-Reject receiver using a 65-nm CMOS process is presented for Ka-band compact radars. The designed receiver consists of Low-Noise Amplifier (LNA), IQ mixer, and Analog Baseband (ABB). ABB includes a complex filter in order to suppress unwanted images, and the variable gain amplifiers (VGAs) in RF block and ABB have gain tuning range from 4.5-56 dB for wide dynamic range. The gain of the receiver is controlled by on-chip SPI controllers. The receiver has noise figure of <15 dB, OP1dB of >4 dBm, image rejection ratio of >30 dB, and channel isolation of >45 dB at the voltage gain of 36 dB, in the Ka-band target frequency. The receiver consumes 420 mA at 1.2 V supply with die area of 4000×1600 ㎛.