• Korean Journal of Veterinary Service
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• v.44 no.4
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• pp.185-194
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• 2021

Polyglutamine extension in the coding sequence of mutant huntingtin causes neuronal degeneration associated with the formation of insoluble polyglutamine aggregates in Huntington's disease (HD). Mutant huntingtin can form aggregates within the nucleus and processes of neurons possibly due to misfolding of the proteins. To better understand the mechanism by which an elongated polyglutamine causes aggregates, we have developed an in vitro binding assay system of polyglutamine tract from truncated huntingtin. We made GST-HD exon1 fusion proteins which have expanded polyglutamine epitopes (e.g., 17, 23, 32, 46, 60, 78, 81, and 94 CAG repeats). In the present emergence of new study adjusted nanotechnology on protein chip such as surface plasmon resonance strategy which used to determine the substance which protein binds in drug discovery platform is worth to understand better neurodegenerative diseases (i.e., Alzheimer disease, Parkinson disease and Huntington disease) and its pathogenesis along with development of therapeutic measures. Hence, we used strengths of surface plasmon resonance (SPR) technology which is enabled to examine binding specificity and explore targeted molecular epitope using its electron charged wave pattern in HD pathogenesis utilize conjugated mutant epitope of HD protein and its interaction whether wild type GST-HD interacts with mutant GST-HD with maximum binding affinity at pH 6.85. We found that the maximum binding affinity of GST-HD17 with GST-HD81 was higher than the binding affinities of GST-HD17 with other mutant GST-HD constructs. Furthermore, our finding illustrated that the mutant form of GST-HD60 showed a stronger binding to GST-HD23 or GST-HD17 than GST-HD60 or GST-HD81. These results indicate that the binding affinity of mutant huntingtin does not correlate with the length of polyglutamine. It suggests that the aggregation of an expanded polyglutamine might have easily occurred in the presence of wild type form of huntingtin.

• Nuclear Engineering and Technology
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• v.54 no.7
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• pp.2444-2452
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• 2022

The field-programmable gate array (FPGA) is gaining popularity in industrial automation such as nuclear power plant instrumentation and control (I&C) systems due to the benefits of having non-existence of operating system, minimum software errors, and minimum common reason failures. Separate functions can be processed individually and in parallel on the same integrated circuit using FPGAs in comparison to the conventional microprocessor-based systems used in any plant operations. The use of FPGAs offers the potential to minimize complexity and the accompanying difficulty of securing regulatory approval, as well as provide superior protection against obsolescence. Wireless sensor networks (WSNs) are a new technology for acquiring and processing plant data wirelessly in which sensor nodes are configured for real-time signal processing, data acquisition, and monitoring. ZigBee (IEEE 802.15.4) is an open worldwide standard for minimum power, low-cost machine-to-machine (M2M), and internet of things (IoT) enabled wireless network communication. It is always a challenge to follow the specific topology when different Zigbee nodes are placed in a large network such as a plant. The research article focuses on the hardware chip design of different topological structures supported by ZigBee that can be used for monitoring and controlling the different operations of the plant and evaluates the performance in Vitex-5 FPGA hardware. The research work presents a strategy for configuring FPGA with ZigBee sensor nodes when communicating in a large area such as an industrial plant for real-time monitoring.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.1-10
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• 2022

Recently, semiconductor devices have been used in many fields owing to various applications of mobile electronics, wearable and flexible devices and substrates. During the semiconductor chip bonding process, the mismatch of coefficient of therm al expansion (CTE) between the substrate and the solder, and the excessive heat applied to the entire substrate and components affect the performance and reliability of the device. These problems can cause warpage and deterioration of long-term reliability of the electronic packages. In order to improve these issues, many studies on low-melting temperature solders, which is capable of performing a low-temperature process, have been actively conducted. Among the various low-melting temperature solders, such as Sn-Bi and Sn-In, Sn-58Bi solder is attracting attention as a promising low-temperature solder because of its advantages such as high yield strength, moderate mechanical property, and low cost. However, due to the high brittleness of Bi, improvement of the Sn-Bi solder is needed. In this review paper, recent research trends to improve the mechanical properties of Sn-Bi solder by adding trace elements or particles were introduced and compared.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.43-48
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• 2022

Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

• Journal of the Korean Wood Science and Technology
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• v.32 no.1
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• pp.80-87
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• 2004

This study was carried out to improve the properties of powdered tannin adhesive(PT) by adding liquid tannin resin(LT) to PT in the manufacture of particleboard. Mixing the LT to PT from 50% to 100% by weight did not show any difference in particleboard properties, but the higher the powdered tannin resin ratio, the lower the properties of the board. The proper ratio of PT to LT was 30:70 for the improvement of PT-particleboard, unless LT lower than 70%. Internal bonding strength was in proportional to the amount of LT. Mixing amino adhesives and PT did not show any improvements in mechanical and physical properties of the board but they only acted as scavenger for the free formaldehyde.Manufacturing particle board with the adhesive of 30:70 (PT:LT) and by using double blender resulted in high-performance products of E₀ level of formaldehyde emission with high water resistance (U type; below 12%, M type; below 25%), as well as saving chip drying energy.

• The Journal of the Acoustical Society of Korea
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• v.40 no.6
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• pp.571-577
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• 2021

This study is a study on System On Chip (SOC) that implements virtual engine sound in electric vehicles without engines, and realizes vivid engine sound by combining Adaptive Difference PCM (ADPCM) method and frequency modulation method for satisfaction of driver's needs and safety of pedestrians. In addition, by proposing an electronic sound synthesis algorithm applying Musical Instrument Didital Interface (MIDI), an engine sound synthesis method and a constitutive model of an engine sound generation system are presented. In order to satisfy both drivers and pedestrians, this study uses Controller Area Network (CAN) communication to receive information such as Revolution Per Minute (RPM), vehicle speed, accelerator pedal depressed amount, torque, etc., transmitted according to the driver's driving habits, and then modulates the frequency according to the appropriate preset parameters We implemented an interaction algorithm that accurately reflects the intention of the system and driver by using interpolation for the system, ADPCM algorithm for reducing the amount of information, and MIDI format information for making engine sound easier.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.25 no.12
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• pp.1914-1919
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• 2021

With the development of advanced industries, research on image processing hardware is essential, and timing verification at the gate level is required for actual chip operation. For FPGA-based verification, DDR3 memory interface was previously applied. But recently, as the FPGA specification has improved, DDR4 memory is used. In this case, when a previously used memory interface is applied, the timing mismatch of signals may occur and thus cannot be used. This is due to the difference in performance between CPU and memory. In this paper, the problem is solved through state optimization of the existing interface system FSM. In this process, data read speed is doubled through AXI Data Width modification. For actual case analysis, ZC706 using DDR3 memory and ZCU106 using DDR4 memory among Xilinx's SoC boards are used.

• Journal of IKEEE
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• v.26 no.3
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• pp.373-379
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• 2022

In this paper, since the APD(Avalanche Photo Diode) for LTV(Light to Voltage) conversion uses a high voltage in the operating range unlike other PD(Photo Diode)s, the quenching resistor must be connected in series to prevent overcurrent when using the TIA(Transimpedance Amplifier). In such a case, quenching resistance may affect the transfer function of the TIA circuit, resulting in serious stability. Therefore, in this paper, by analyzing the effect of APD quenching resistance on the voltage and current loop transfer function of TIA, we propose a loop analysis and a method for determining the quenching resistance value to improve stability. TIA circuit with quenching resistance was designed by the proposed method and the stability of operation was verified through simulation and chip fabrication.

• Journal of the Korean Recycled Construction Resources Institute
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• v.10 no.3
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• pp.321-326
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• 2022

In this study, cogeneration power plants that use biomass as a raw material to convert them into energy have recently received a lot of attention worldwide and are gradually increasing in South Korea. Therefore, in order to confirm the possibility of using the generated floor material as a fine aggregate for concrete, properties and stability evaluation experiments were performed. Compared to standard sand, the compressive strength of wood chip aggregate was improved by 11 % to 111 %, the length change rate was 89 %, and the waste processing test results met all criteria for hazardous substances. All of these are satisfied, and it is judged that the floor materials by the cogeneration power plant can be used as a fine aggregate for concrete.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.32 no.5
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• pp.965-973
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• 2022

As IoT(Internet of Things) devices become common, many algorithms have been developed to protect users' personal information. The laser fault injection attack that threatens those algorithms is a side-channel analysis that intentionally injects a laser beam to the outside of a device to acquire confidential information or abnormal privileges of the system. There are many studies to determine the timing of fault injection to reduce the number of necessary fault injections, but the location to inject faults is only repeatedly searched for the entire area of the device. However, when fault injection is performed in an algorithm-independent area, the attacker cannot obtain the intended faulted statement or attempt to bypass authentication, so finding areas vulnerable to fault injection and performing an attack is an important consideration in achieving a high attack success rate. In this paper, we show that a 100% attack success rate can be achieved by determining the vulnerable areas for fault injection by using electromagnetic and thermal information generated from the device's chip. Based on this, we propose an efficient fault injection attack system.