• Biotechnology and Bioprocess Engineering:BBE
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• 제5권3호
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• pp.159-163
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• 2000

The genome sequencing project has generated and will contitute to generate enormous amounts of sequence data. Since the first complete genome sequence of bacterium Haemophilus in fluenzae was published in 1995, the complete genome sequences of 2 eukaryotic and about 22 prokaryotic organisms have detemined. Given this everincreasing amounts of sequence information, new strategies are necessary to efficiently pursue the phase of the geome project- the elucidation of gene expression patterns and gene product function on a whole genome scale. In order to assign functional information to the genome sequence, DNA chip technology was developed to efficienfly identify the differential expression pattern of indepondent biogical samples. DNA chip provides a new tool for genome expreesion analysis that may revolutionize revolutionize many aspects of human kife including mew surg discovery and human disease diagnostics.

• 한국전기전자재료학회논문지
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• 제18권6호
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• pp.506-509
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• 2005

This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.

• 센서학회지
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• 제18권2호
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• pp.160-167
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• 2009

In this study, secondary antibody-containing quartz crystal microbalance(QCM) sensor chip was prepared and utilized for the detection of human and bovine haptoglobin. Anti-goat immunoglobulin G antibody, which is a secondary antibody capable of capturing primary antibodies raised in goat, was immobilized through the reaction between hydrazide and aldehyde group prepared on the QCM surface and antibody respectively. The resulting sensor chip showed higher stability in the repeated surface regeneration with acidic dissociation solution as well as requiring lower amount of primary antibody when compared to the protein G sensor chip. The secondary antibody sensor chip was applied for the estimation of bovine and human haptoglobin.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 추계학술대회논문집 - 한국공작기계학회
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• pp.279-284
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• 2000

The object of this paper is to evaluate the chip breakability using the experimental equation of surface roughness, which is developed in turning by an orthogonal array method. L$\sub$9/(3$^4$) orthogonal array method, one of fractional factorial design has been used to study effects of main cutting parameters such as cutting speed, feed rate and depth of cut, on the surface roughness. The evaluation of chip breakability is used the chip breaking index(C$\sub$B/), non-dimensional parameter. And the analysis of variance (ANOYA)-test has been used to check the significance of cutting parameters. Using the result of ANOYA-test, the experimental equation of chip breakability, which consists of significant cutting parameters, has been developed. The coefficient of determination of this equation is 0.866.

• 한국공작기계학회논문집
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• 제17권3호
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.366-370
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• 2002

A kinematic ball bar measurement system can analyze the various errors of a machine tool easily and rapidly in a procedure and can measure many types of equipment such as chip mounter, PCB router, precision stage, etc. In this paper, the thermally induced errors are loused among various errors of a chip mounter because it affects the accuracy of the machine very much. Linear regression technique is adapted for the thermal error modeling. While the measurement and calibration of a chip mounter is difficult in general, this developed system is not only easy to apply for it but also improves the accuracy by 4 times or more.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.356-356
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• 2012

InGaN/GaN로 제작된 Blue chip의 파장에 따른 백색 LED의 성능 저하를 전기적, 광학적 특성을 고려하여 조사하였다. 4가지 파장으로 제작된 백색 LED Sample들은 60 mA, 75 mA, 90 mA의 주입 전류로 장 시간동안 스트레스를 주었다. 또한 형광체가 없는 상태와 있는 상태를 구분하여 패키지의 감쇠 특성을 확인하였다. Blue 피크 파장 437 nm, 주입전류 90 mA, 형광체가 있는 상태와 형광체가 없는 상태에서 패키지의 출력 광세기는 각각 20%, 36%까지 감소하였다. 이는 Blue Chip에서 출력되는 단파장이 페키지 몰드의 노화(황변)현상에 직접적인 영향을 주기 때문이다. 전기적 특성은 Blue chip의 파장영역에 의존하지 않고, 스트레스 시간에 따른 LED내부 저항이 커지는 현상을 확인하였다. 따라서 InGaN/GaN로 제작된 백색 LED의 장 수명을 얻기 위해서는 Blue chip의 출력 파장 영역과 페키지 몰드 재료 특성의 신뢰성 관계가 중요하다.

• 한국통신학회논문지
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• 제22권7호
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• pp.1590-1598
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• 1997

The paper first introduces the new concept of potential diversity and signal decomposability, which establish a foundaton to generalize the existing concepts of path and frequency diversities. Then it presents a new DS/CDMA system called chip-spreading OCDM system, which is an embodiment of the petential diversity concept that combines the path diversity of the DS/CDMA system and the frequency diversity of the OFDM/CDMA system. In the chip-spreading OCDM system the chip sequences in each symbol interval are first converted into aralled streams, which then simultaneously modulate different orthogonal Walsh basis functions. In the receiver, the received signal is matched to each extended basis-function which is the union of the transmitter basis-functions and their delayed replicas, and the matched-filtered chip samples are combined together after individual channel compensation. The conventional DS/CDMA system using the maximal ratio combining. In addition, it effectively resolves the high PAR and high sensitivity to frequency offset problems which are critical in multi-carrier systems.

• 대한전자공학회논문지TC
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• 제48권11호
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• pp.28-34
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• 2011

최근 들어 CDMA 기반 시스템에서 고속 데이터 서비스 지원을 위한 수신 성능 개선 방법의 하나로 chip-level equalization 기법에 대한 연구가 활발히 진행되고 있다. 이와 관련된 연구의 하나로 본 논문에서는 D-TxAA (dual stream transmit antenna array) 방식을 사용하는 HSDPA MIMO 시스템에 적용 가능한 Griffiths algorithm 기반 chip-level 적응 LMMSE equalizer의 구조를 제안하고자 한다. 먼저 Griffiths 알고리즘을 D-TxAA 방식에 적용할 경우 사용 가능한 두 가지 형태의 적응 LMMSE equalizer 구조를 유도할 것이며, 여러 채널 환경에 대한 컴퓨터 모의실험을 통해 두 수신기의 성능을 비교 분석하고자 한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.10-10
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• 2008

Flip chip technology is keeping pace with the increasing connection density of the ICs and is capable of transferring semiconductor performance to the printed circuit board. One of the most general flip chip technology is CPB technology presented by Intel. The CPTB technology has similar benefits with CPB but has simpler process and better reliability characteristics. In this paper, process sequence and structure of CPTB are presented.