• Transactions on Electrical and Electronic Materials
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• 제6권2호
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• pp.46-50
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• 2005

BST thin films were etched with inductively coupled CF$_{4}$/(Cl$_{2}$+Ar) plasmas. The etch characteristics of BST thin films as a function of CF$_{4}$/(Cl$_{2}$+Ar) gas mixtures were analyzed using optical emission spectroscopy (OES) and Langmuir probe. The BST films in CF$_{4}$/Cl$_{2}$/Ar plasma is mainly etched by the formation of metal chlorides which depends on the emission intensity of the atomic Cl and the bombarding ion energy. The maximum etch rate of the BST thin films was 53.6 nm/min because small addition of CF$_{4}$ to the Cl$_{2}$/Ar mixture increased chemical and physical effect. A more fast etch rate of BST films can be obtained by increasing the DC bias and the RF power, and lowering the working pressure.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2006년도 제30회 학술논문발표회 초록집
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• pp.119-119
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• 2006

• 한국진공학회:학술대회논문집
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• 한국진공학회 2002년도 제22회 학술발표회 초록집
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• pp.169-169
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• 2002

• 한국표면공학회지
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• 제34권1호
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• pp.10-16
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• 2001

Recently plasma etching research has been focused on the metal surfaces in the nuclear industry. In this study, surface etching reaction of metallic Co and Mo, principal contaminants in the spent nuclear components, in CF$_4$/O$_2$, gas plasma has been experimentally investigated to look into the applicability and the effectiveness of the technique for the surface decontamination. Experimental variables are $CF_4$/$O_2$ ratio and substrate temperature between 29$0^{\circ}C$ and 38$0^{\circ}C$. Experimental results Show that the optimum gas composition is 80%CF$_4$-20%$O_2$ and the metallic Co and Mo are etched out well enough in the temperatures range. Cobalt starts to be etched above $350^{\circ}C$ and the etching rate increases with increasing substrate temperature. Maximum rate achieved at 38$0^{\circ}C$ under 220 W r.f. plasma power is 0.06 $\mu\textrm{m}$/min. On the other hand, the metallic Mo is etched easily even at low temperature and the reaction rate drastically increases as the substrate temperature goes up. Highest rate obtained under the same conditions is $1.9\mu\textrm{m}$/min. OES (Optical Emission Spectroscopy) analysis reveals that the intensities of F atom and CO molecule reach maximum at the optimum gas composition, which demonstrates that the principal reaction mechanism is fluorination and/or carbonyl reaction. It is confirmed, therefore, that dry processing technique using reactive plasma is quite feasible and applicable for the decontamination of surface-contaminated parts or equipments.

• 멤브레인
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• 제20권2호
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• pp.106-112
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• 2010

본 연구에서는 poly(phenylene oxide) (PPO)의 막 표면에 100 ppm의 농도를 갖는 불소가스를 접촉시켜 표면불소화하였다. 표면 개질된 막의 특성을 알아보기 위하여 표면접촉각, XPS, 기체투과 실험을 수행하였다. 표면특성 분석 결과 불소처리 시간이 증가함에 따라 막 표면에 $-CF_2$, $-CF_3$의 perfluoro group의 결합으로 인해 막의 소수성이 증가함을 알 수 있었다. 기체투과 측정으로부터 불소화시간이 증가함에 따라 기체에 대한 투과도는 감소하였으며, 불소노출이 60분 경과한 막의 경우 질소 33%, 산소 23%, 이산화탄소 3%의 감소율을 나타내었다. 선택도의 경우 질소 대비 산소의 경우 3.92로부터 4.47로, 이산화탄소에 대한 질소의 경우 18.09에서 25.4로 증가함을 얻었다.

• 멤브레인
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• 제22권1호
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• pp.23-34
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• 2012

중공사 고분자 분리막을 이용한 SF6를 분리 농축을 위한 운전조건을 결정하기 위해서는, 온도와 압력이 투과특성에 미치는 영향에 관한 연구가 필요하다. 본 연구에서는 다양한 온도와 압력이 부과된 조건에서 단일기체 투과실험을 수행하여, 중공사 고분자 분리막(PSF, PC, PI)을 통한 기체($N_2$, $O_2$, $SF_6$, $CF_4$)의 투과특성을 연구하였다. 실험결과, 기체의 투과플럭스는 온도와 압력의 증가에 따라 일반적으로 증가하는 것으로 나타났으나, 분리막에 따른 투과플럭스의 차이가 관찰되었으며, 온도, 압력에 따른 투과플럭스 변화율은 기체의 특성(분자크기)에 따라 다른 것으로 나타났다. 온도 압력에 대한 투과플럭스를 3차원적으로 표현했을 때, 투과플럭스는 근사적인 평면 위에서 변화하는 것으로 관측되었다. 온도와 압력에 의한 투과플럭스 변화를 열역학적으로 분석하였으며, 투과플럭스 예측을 위한 경험적 모델로 평면특성의 1차 다항식 모델과 곡면 특성을 가진 2차 다항식 모델을 제안하였다. 그 결과 두 경험적 모델 모두 관측자료에 대한 높은 적합도를 보여 적용가능성을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.21-25
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• 2001

In this study, recovery of plasma etching· damage in PZT thin film with additive gas and re-annealing after etching have been investigated. The PZT thin films were etched as a function of $Cl_2/CF_4$ with addition of Ar and $O_2$ with inductively induced plasma. The etch rates of PZT thin films were 1450 $\AA$/min at 30% additive Ar into $(Cl_2(80%)+CF_4 (20%))$ and 1100 $\AA$/min at 10% additive $O_2$ into $C(Cl_2(80%)+CF_4(20%))$. In order to recovery properties of PZT thin films after etching, the etched PZT thin films were re-annealed at various temperatures in at $O_2$ atmosphere. From the hysteresis curves, ferroelectrical properties are improved by $O_2$ re-annealing process. The improvement of ferroelectric behavior at annealed sample is consistent with the increase of the (100) and (200) PZT peaks revealed by x-ray diffraction (XRD). From x-ray photoelectron spectroscopy (XPS) analysis, intensity of Pb-O, Zr-O and Ti-O peak are increased and the chemical residue peak is reduced by $O_2$ re-annealing. The ferroelectric behavior consistent with the dielectric nature of $Ti_xO_y$ is recovered by $O_2$ recombination during rapid thermal annealing process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.21-25
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• 2001

In this study, recovery of plasma etching damage in PZT thin film with additive gas and re-annealing after etching have been investigated. The PZT thin films were etched as a function of Cl$_2$/CF$_4$ with addition of Ar and $O_2$ with inductively induced plasma. The etch rates of PZT thin films were 1450$\AA$/min at 30% additive Ar into (Cl$_2$(80%)+CF$_4$ (20%)) and 1100$\AA$/min at 10% additive $O_2$ into C(Cl$_2$(80%)+CF$_4$ (20%)). In order to recovery properties of PZT thin films after etching, the etched PZT thin films were re-annealed at various temperatures in at $O_2$ atmosphere. From the hysteresis curves, ferroelectrical properties are improved by $O_2$ re-annealing process. The improvement of ferroelectric behavior at annealed sample is consistent with the increase of the (100) and (200) PZT peaks revealed by x-ray diffraction (XRD). From x-ray photoelectron spectroscopy (XPS) analysis, intensity of Pb-O, Zr-O and Ti-O peak are increased and the chemical residue peak is reduced by $O_2$ re-annealing. The ferroelectric behavior consistent with the dielectric nature of Ti$_{x}$O$_{y}$ is recovered by $O_2$ recombination during rapid thermal annealing process.s.s.

• 멤브레인
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• 제20권3호
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• pp.249-258
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• 2010

IPCC (Intergonvernmental Pane1 of Climate Change)에서 $CO_2$의 23,900배에 해당하는 지구온난화지수를 가진 $SF_6$ (Sulphur hexafluoride) 가스와 중전기 산업에서 아크 발생에 의해 생긴 $SF_6$의 주요 분해 부산물 중 하나이며 $CO_2$의 6,300배에 해당하는 지구온난화지수를 가진 $CF_4$ (Tetrafluoromethane) 가스의 배출에 대한 규제가 적극 검토되고 있다. 본 연구는 $O_2$, $CF_4$에 대한 $SF_6$의 분리 회수의 기초 연구로써, 상용화된 PSF (polysulfone), PC (tetra-bromo polycarbonate)와 PI (polyimide) 고분자 분리막을 사용하여 $O_2$, $CF_4$와 $SF_6$ 가스의 압력과 온도 변화에 따른 투과도 및 투과선택도 연구를 수행하였다. 압력 변화에 따른 $O_2$의 투과도는 PSF 중공사 분리막에서 압력 1.1 MPa일 때, 37.5 GPU로 가장 높게 나타났고, $SF_6$와 $CF_4$의 경우 압력 1.1 MPa에서 PC 중공사 분리막이 각각 2.7 GPU와 2.5 GPU로 가장 높은 투과플럭스를 나타냈다. 온도 변화에 따른 $O_2$의 투과플럭스는 막의 온도가 $45^{\circ}C$일 때 PSF 중공사 분리막이 41.2 GPU로 가장 높게 나타났고, $SF_6$와 $CF_4$는 막의 온도가 $25^{\circ}C$일 때, PC 중공사 분리막이 각각 2.4 GPU와 2.3 GPU로 가장 높은 투과플럭스를 나타냈다. 압력과 온도 변화에 따른 $O_2/SF_6$와 $CF_4/SF_6$의 투과선택도 결과, 높은 단일 기체 투과플럭스를 보인 PSF와 PC 중공사 분리막이 가장 낮은 투과선택도를 나타내고, 가장 낮은 투과플럭스를 보인 PI 중공사 분리막이 가장 높은 투과선택도를 나타냄을 확인할 수 있다.

• Nuclear Engineering and Technology
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• 제35권6호
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• pp.507-514
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• 2003

Recently dry decontamination/surface-cleaning technology using plasma etching has been focused in the nuclear industry. In this study, the applicability of this new dry processing technique are experimentally investigated by examining the etching reaction of $UO_2$, Co, and Mo in r.f. plasma with the etchant gas of $CF_4/O_2$ mixture. $UO_2$ is chosen as a representing material for uranium and TRU (TRans-Uranic) compounds while metallic Co and Mo are selected because they are the principal contaminants in the used metallic nuclear components such as valves and pipes made of stainless steel or inconel. Results show that in all cases maximum etching rate is achieved when the mole fraction of $UO_2\;in\;CF_4/O_2$ mixture gas is $20\%$, regardless of temperature and r.f. power. In case of $UO_2$, the highest etching reaction rate is greater than 1000 monolayers/min. at $370^{\circ}C$ under 150 W r.f. power which is equivalent to $0.4{\mu}m/min$. As for Co, etching reaction begins to take place significantly when the temperature exceeds $350^{\circ}C$. Maximum etching rate achieved at $380^{\circ}C\;is\;0.06{\mu}m/min$. Mo etching reaction takes place vigorously even at relatively low temperature and the reaction rate increases drastically with increasing temperature. Highest etching rate at $380^{\circ}C\;is\;1.9{\mu}m/min$. According to OES (Optical Emission Spectroscopy) and AES (Auger Electron Spectroscopy) analysis, primary reaction seems to be a fluorination reaction, but carbonyl compound formation reaction may assist the dominant reaction, especially in case of Co and Mo. Through this basic study, the feasibility and the applicability of plasma decontamination technique are demonstrated.