• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2015년도 추계학술대회 논문집
• /
• pp.280-280
• /
• 2015

플라즈마 진단법 중 내부에 삽입하여 측정하는 단일 랭뮤어 탐침법은 플라즈마 특성을 정확하게 측정할 수 있다. 탐침에 (-)극을 걸어서 들어오는 전류를 통해서 이온포화 전류밀도를 측정할 수 있다. 본 연구에서는 유도결합플라즈마에 흐르는 가스와 압력에 따라서 변화를 확인하였다. $H_2$, Ar, $CF_4$ gas로 10 mTorr, 70 mTorr, $CF_4$ 주입위치의 조건으로 플라즈마 밀도를 구하였다.

• Bulletin of the Korean Chemical Society
• /
• 제8권3호
• /
• pp.174-179
• /
• 1987

The results of an ab initio (6-31G) molecular orbital calculations of the dipole moment derivatives and gas phase IR intensities in $CH_3F$ and $CF_4$ are reported. The results are compared with corresponding values obtained from a CNDO calculation. We have also analyzed the theoretical polar tensors into the charge, charge flux, and overlap contributions. The effective term charges of hydrogen atom appeared to be transferable among the fluoromethane molecules.

• 한국전기전자재료학회논문지
• /
• 제16권4호
• /
• pp.286-291
• /
• 2003

(Pb,Sr)TiO$_3$(PST) thin films have attracted great interest as new dielectric materials of capacitors for Gbit dynamic random access memories. In this study, inductively coupled CF$_4$/Ar plasma was used to etch PST thin films. The maximum etch rate of PST thin films was 740 $\AA$/min at a CF$_4$(20 %)/Ar(80 %) 9as mixing ratio, an RF power of 800 W, a DC bias voltage of -200 V, a total gas flow of 20 sccm, and a chamber pressure of 15 mTorr. To clarify the etching mechanism, the residue on the surface of the etched PST thin films was investigated by X-ray photoelectron spectroscopy. It was found that Pb was mainly removed by physically assisted chemical etching. Sputter etching was effective in the etching of Sr than the chemical reaction of F with Sr, while Ti can almost removed by chemical reaction.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2009년도 춘계학술대회 논문집
• /
• pp.95-95
• /
• 2009

대기압 플라즈마 발생장치를 이용한 식각장비 개발은 낮은 공정단가, 저온 공정, 다양한 표면처리 응용 효과와 같은 이점을 가지고 있어 현재, 많은 분야에서 연구되고 있다. 본 연구에서는, dielectric barrier discharge(DBD) 방식을 이용한 대기압 발생장치를 통해 평판형 디스플레이 제작에 응용이 가능한 $SiO_2$ 층의 식각에 대한 연구를 하였다. $N_2/NF_3$ gas 조합에 $CF_4$ 또는 $C_{4}F_{8}$ gas를 부가적으로 첨가하였다. 이때 N2 60 slm / NF3 600 sccm/CF4 7 slm/Ar 200 sccm의 gas composition에서 최대 260 nm/min의 식각 속도를 얻을 수 있었다.

• 한국전기전자재료학회논문지
• /
• 제15권4호
• /
• pp.319-324
• /
• 2002

In this study, the reduce of plasma etching damage in PZT thin film with addictive gas and re-annealing after etching have been investigated. The PZT thin films were etched as a function of $Cl_2/CF_4$ with addition of Ar and $O_2$ with inductively coupled plasma. The etch rates of PZT thin films were 1450 ${\AA}/min$ at 30% additive Ar and 1100 ${\AA}/min$ at 10% auditive $O_2$ into $Cl_2/CF_4$ gas mixing ratio of 8/2. In order to reduce plasma damage of PZT thin films after etching, the etched PZT thin films were re-annealed at various temperatures at $O_2$ atmosphere. From the hysteresis curries, the ferroelectric properties are improved by $O_2$ re-annealing process. The improvement of ferroelectric behavior at annealed PZT films is consistent wish the increase of the (100) and (200) PZT peaks revealed by x-ray diffraction (XRD). From x ray photoelectron spectroscopy (XPS) analysis, the intensity of Pb-O, Zr-O and Ti-O peak are increased and the chemical residue peak is reduced by $O_2$ re-annealing. The ferroelectric behavior consistent with the dielectric nature of $Ti_xO_y$ is recovered by $O_2$ recombination during rapid thermal annealing process.

• 동굴
• /
• 제82호
• /
• pp.1-4
• /
• 2007

In this paper, the etching of Au films using photoresist masks on Si substrates was investigated using a capacitively coupled plasma etch reactor. The advantages of plasma etch techniques over current methods for Au metalization include the ability to simplify the metalization process flow with respect to resist lift-off schemes, and the ability to cleanly remove etched material without sidewall redeposition, as is seen in ion milling. The etch properties were measured for different gas mixing ratios of CF4/Ar, and chamber pressures while the other conditions were fixed. According to statistical design of experiment (DOE), etching process of Au films was characterized and also 20 samples were fabricated followed by measuring etch rate, selectivity and etch profile. There is a chemical reaction between CF4 and Au. Au- F is hard to remove from the surface because of its high melting point. The etching products can be sputtered by Ar ion bombardment.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
• /
• pp.194-198
• /
• 2002

Energy Distribution Function in pure $CH_4$, $CF_4$ and mixtures of $CF_4$ and Ar, have been analyzed over a range of the reduced electric field strength between 0.1 and 350[Td] by the two-tenn approximation of the Boltzmann equation (BEq.) method and the Monte Carlo simulation (MCS). The results of the Boltzmann equation and the Monte Carlo simulation have been compared with the data presented by several workers. The deduced transport coefficients for electrons agree reasonably well with the experimental and simulation data obtained by Nakamura and Hayashi. The energy distribution function of electrons in $CF_4-Ar$ mixtures shows the Maxwellian distribution for energy. That is, f(${\varepsilon}$) has the symmetrical shape whose axis of symmetry is a most probably energy

• 한국토양비료학회지
• /
• 제48권5호
• /
• pp.477-484
• /
• 2015

Environmental effect of water-saving irrigation on the emissions of greenhouse gases (GHGs) has not been well investigated. The objective of this study was to measure the effect of water-saving irrigation on GHGs as well as water use and rice production yield in paddy field condition in Korea. Four experimental runoff plots of 4x35 m in size were prepared at an existing paddy field. GHGs emission was measured during the 2012~2013 growing seasons while a Japonica rice variety was cultivated. Four different water management methods, 1) Continuous Flooding (CF), 2) Intermittent Drainage (ID), 3) Water Saving (WS), and 4) CF+WS, were used during a rice growing season to compare the effects of water management methods on GHGs emission. CF method is flooding all the time, ID method makes paddy water drained 40 days after transplanting for about two weeks, WS method maintains 2~3 cm water-level, which should be refilled when the water-level decreased to about 0 cm, and CF+WS method combines CF method before 30 days after transplanting (DAT) and WS method after 30 DAT. Regardless of water management methods, paddy field water was drained about 30 days before harvest. Amount of GHGs emission from WS plot was reduced by 69.3% compared to that from CF plot and by 59.0% compared to that from ID plot. Amount of GHGs emission from CF+WS plot was reduced by 60.7% compared to that from CF plot and by 47.5% compared to that from ID plot. Weed occurrence in CF+WS plots was reduced to 62.2% in comparison with the WS plot, implying that CF+WS plot showed the best effect to mitigation of the greenhouse gas emission in the atmosphere.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
• /
• pp.16-19
• /
• 2002

(Ba,Sr)TiO3(BST) thin film is an attractive material for the application in high-density dynamic random access memories (DRAMs) because of the high relative dielectric constant and small variation in dielectric properties with frequency. In this study, (Ba0.6,Sr0.4)TiO3 thin films on Pt/Ti/SiO2/Si substrates were deposited by a sol-gel method and the CF4/Ar inductively coupled plasma (ICP) etching behavior of BST thin films had been investigatedby varying the process parameters such as chamber pressure, ICP power, and substrate bias voltage. To analysis the composition of surface residue following etching BST films etched with different Ar/CF4 gas mixing ratio were investigated using x-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometer (SIMS).

• 한국전기전자재료학회논문지
• /
• 제15권11호
• /
• pp.933-938
• /
• 2002

(Ba,Sr)TiO$_{4}$ (BST) thin films on Pt/Ti/SiO$_{2}$/Si substrates were deposited by a sol-gel method and the etch characteristics of BST thin films have been investigated as a function of gas mixing ratio. The maximum etch rate of the BST films was 440 $AA$/min under such conditions as: CF$_{4}$(CF$_{4}$＋Ar) of 0.2, RF-power of 700 W, DC-bias voltage of -200 V, pressure of 15 mTorr and substrate temperature of 30 $^{circ}C$. The selectivities of BST to Pt, SiO$_{2}$ and PR were 0.38, 0.25 and 0.09, respectively. In the XPS (X-ray photoelectron spectroscopy) analysis, Barium (Ba) and Strontium (Sr) component in BST thin films formed low volatile compounds such as BaFx, SrFx, which are forms by the chemical reaction with F atoms and is removed by Ar ion bombardment. Titanium (Ti) is removed by chemical reaction such as TiF with ease. The result of secondary ion mass spectrometry (SIMS) analysis confirmed the existence of the BaFx, SrFK, TiFx.