• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.187-187
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• 2016

진공 압력에 따른 플라즈마 발생의 관계, 전압에 따른 방전 밝기, gas와 방전 전극에 따른 플라즈마 색의 변화 등 실험을 통하여 학부생들에게 진공 시스템과 플라즈마의 이해도를 높이기 위해 Geissler tube cart를 제작하였다. Pump는 TMP station (PFEIFFER Vacuum Hi Cube ECO 80)을 사용하였으며 reducer를 이용하여 CF-4.5"에서 CF-2.75" adaptor를 설치, gate valve를 연결하여 진공도를 조절 할 수 있게 하였으며, 5-way를 이용하여 왼쪽은 gas line, 정면 view port, 상단 geissler tube, 후면 compact full range gauge를 설치하였고, cart 제작 결과를 Fig. 1에 나타내었다. Geissler tube의 수치모델은 Fig. 2에 나타내었다. 저진공(<10-3 Torr) 영역부터 고진공(<10-4 Torr) 영역까지 진공도에 따른 방전을 관찰 할 수 있으며, 표면과 플라즈마 사이의 전위 변화에 따른 쉬스(sheath) 관찰, trans 와 slidacs를 이용하여 전압 조정이 가능하기 때문에 전압에 따른 방전 관찰과 gas line을 통한 gas 주입에 따른 색의 변화를 관찰이 가능하도록 설계하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.12
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• pp.996-1002
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• 2000

Ferroelectric (Ba, Sr) TiO$_3$(BST) thin films have attracted much attention for use in new capacitor materials of dynamic random access memories (DRAMs). In order to apply BST to the DRAMs, the etching process for BST thin film with high etch rate and vertical profile must be developed. However, the former studies have the problem of low etch rate. In this study, in order to increase the etch rate, BST thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP) that have much higher plasma density than RIE (reactive ion etching) and ICP (inductively coupled plasma). Experiment was done by varying the etching parameters such as CF$_4$/(CF$_4$+Ar) gas mixing ratio, rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 170nm/min under CF$_4$/CF$_4$+Ar) of 0.1, 600 W/-350 V and 5 mTorr. The selectivities of BST to Pt and PR were 0.6 and 0.7, respectively. Chemical reaction and residue of the etched surface were investigated with X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS).

• Fibers and Polymers
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• v.3 no.4
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• pp.174-178
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• 2002

A plasma treatment using saturated $CF_4$ gas was employed to improve the resistance of polypropylene fabrics to water wetting. The fabrics were significantly fluorinated even within a short treatment time of 30 seconds. The result of contact angle measurement indicated that such highly hydrophobic surface was considerably durable even after 150 days of aging.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.4
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• pp.298-303
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• 2003

Bi$_4$-$_{x}$EU$_{x}$Ti$_3$O$_{12}$ (BET) thin films were etched by inductively coupled CF$_4$/Ar plasma. We obtained the maximum etch rate of 78 nm/min at the gas mixing ratio of CF$_4$(10%)/Ar(90%). The variation of volume density for F and Ar atoms are measured by the optical emission spectroscopy. As CF$_4$increased in CF$_4$/Ar plasma, the emission intensities of F increase, but Ar atoms decrease, which confirms our suggestion that emission intensity is proportional to the volume density of atoms. From X-ray photoelectron spectroscopy, the intensities of the Bi-O, the Eu-O and the Ti-O peaks are changed. By pure Ar plasma, intensity peak of the oxygen-metal (O-M : TiO$_2$, Bi$_2$O$_3$, Eu$_2$O$_3$) bond was seemed to disappear while the intensity of pure oxygen peak showed an opposite tendency. After the BET thin films was etched by CF$_4$/Ar plasma, the peak intensity of O-M bond increase slowly, but more quickly than that of peak belonged to pure oxygen atoms due to the decrease of Ar ion bombardment. Scanning electron microscopy was used to investigate etching Profile. The Profile of etched BET thin film was over 85$^{\circ}$./TEX>.

• Journal of Convergence for Information Technology
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• v.12 no.2
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• pp.149-156
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• 2022

In this paper, it was attempted to form a titanium (Ti: Titanium) thin film using the atmospheric pressure plasma process technology for the conductor, which is the main component of the optical sensor. The atmospheric plasma equipment was remodeled. A 4-inch Ti target for sputter was etched using CF4 gas, and the by-product was coated on a glass sample. These by-products were formed up to about 2 cm, and could be divided into 15 areas according to color. Surface shape and constituent elements were analyzed using scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS), respectively. Electrical properties using 4-point probe equipment were also measured. If the process is performed by positioning the sample at about 4.5 mm to 5 mm from the target, a uniform Ti thin film will be deposited. However, it was found that the thin film contained a significant amount of fluorine, which greatly affects the electrical properties of the thin film. Therefore, additional experiments and studies should be performed to remove or minimize fluorine during deposition.

• Membrane Journal
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• v.21 no.3
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• pp.256-262
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• 2011

This study describes the performance of PSF and PC membranes for separation and recovery of $SF_6$ from gas mixtures (10% $SF_6$/70% $N_2$/19% $O_2$/1% $CF_4$) containing low concentration of $SF_6$. The $SF_6$ concentration in retentate, recovery efficiency and selectivity of mixed gases were measured as a function of retentate flow rate and temperature. The concentration of $SF_6$ in the gas recovered from PSF and PC membrane respectively decreased with increase of retentate flow rate and increased with increase of temperature. The values of $SF_6$ concentration in retentate of PSF membrane were higher than those of PC membrane at constant experimental conditions. The maximum value of recovery efficiency of PSF and PC membranes are 95.9% and 67.8%, respectively, under 298.15 K and 150 cc/min of retentate flow rate. With the exception of $CF_4/SF_6$, the real selectivities of $N_2/SF_6$ and $O_2/SF_6$ at PSF membrane were higher than those of PC membrane.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.299-304
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• 2004

In recent years, silicon carbide has emerged as an important material for MEMS application. In order to fabricate an SiC film based MEMS structure by using chemical etching method, high operating temperature is required due to high chemical stability Therefore, dry etching using plasma is the best solution. SiC film was deposited by thermal CVD at the temperature of 100$0^{\circ}C$ and pressure of 10 torr. SiC was dry etched with a reactive ion etching (RIE) system, using SF$_{6}$/O$_2$ and CF$_4$/O$_2$ gas mixture. Etch rate has been investigated as a function of oxygen concentration in the gas mixture, rf power, working pressure and gas flow rate. Etch rate was measured by surface profiler and FE-SEM. SF$_{6}$/O$_2$ gas mixture showed higher etch rate than CF$_4$/O$_2$ gas mixture. Maximum etch rate appeared at RF Power of 450W. $O_2$ dilute mixtures resulted in an increasing of etch rate up to 40％, and the superior anisotropic cross section was observe

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2545-2552
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• 2018

$SF_6$ has been widely used in high voltage power equipment, such as gas insulated switchgear (GIS) and gas insulated transmission line (GIL), because of its excellent insulation and arc extinguishing performance. However, $SF_6$ faces two environmental problems: greenhouse effect and high liquefaction temperature. Therefore, to find the $SF_6$ substitute gases has become a research hotspot in recent years. In this paper, the liquefaction characteristics of $SF_6$ substitute gases were studied. Peng-Robinson equation of state with the van der Waals mixing rule (PR-vdW model) was used to calculate the dew point temperature of the binary gas mixtures, with $SF_6$, $C_3F_8$, $c-C_4F_8$, $CF_3I$ or $C_4F_7N$ as the insulating gas and $N_2$ or $CO_2$ as the buffer gas. The sequence of the dew point temperatures of the binary gas mixtures under the same pressure and composition ratio was obtained. $SF_6/N_2$ < $SF_6/CO_2$ < $C_3F_8/N_2$ < $C_3F_8/CO_2$ < $CF_3I/N_2$ < $CF_3I/CO_2$ < $c-C_4F_8/N_2$ < $C_4F_7N/N_2$ < $c-C_4F_8/CO_2$ < $C_4F_7N/CO_2$. $SF_6/N_2$ gas mixture showed the best temperature adaptability and $C_4F_7N/CO_2$ gas mixture showed the worst temperature adaptability. Furthermore, the dew point temperatures of the $SF_6$ substitute gases at different pressures and the upper limits of the insulating gas mole fraction at $-30^{\circ}C$, $-20^{\circ}C$ and $-10^{\circ}C$ were obtained. The results would supply sufficient data support for GIS/GIL operators and researchers.

• Journal of Korean Society for Atmospheric Environment
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• v.20 no.5
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• pp.625-632
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• 2004

Perfluorocompounds ($PFC_s$), such as tetrafluoromethane ($CF_4$) and hexafluoroethane ($C_2F_6$), have been widely used as plasma etching and chemical vapor deposition (CVD) gases for semiconductor manufacturing processes. Since these $PFC_s$ are known to cause a greenhouse effect intensively, there has been a growing interest in reducing $PFC_s$ emissions. Among various $CF_4$ decomposing techniques, a dielectric barrier discharge (DBD) is considered as one of a promising candidate because it has been successfully used for generating ozone ($O_3$) and decomposing nitrogen oxide (NO). Firstly, optimal concentration of oxygen for $CF_4$ decomposition was found to figure out how many primary and secondary reactions are associated with DBD process. Secondary, to find effective discharge method for $CF_4$ decomposition, a streamer and a glow mode in DBD are experimentally compared, which includes (i) coaxialcylinder DBD, (ii) DBD reactor packed with glass beads. and (iii) a glow mode operation with a helium gas. The test results showed that optimal concentration of oxygen was ranged 500 ppm~1% for treating 500 ppm of $CF_4$ and helium glow discharge was the most efficient one to decompose $CF_4$.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1512-1514
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• 2001

In this work, PZT thin films were etched as a function of $Cl_2$/Ar and additive $CF_4$ into $Cl_2$(80%)/Ar(20%). The etch rates of PZT films were 1600 $\AA$/min at $Cl_2$(80%)/Ar(20%) gas mixing ratio and 1973 $\AA$/min at 30% additive $CF_4$ into $Cl_2$(80%)/Ar(20%). Therefore the etch rate of PZT in $CF_4/Cl_2/Ar$ plasma is faster than in $Cl_2$/Ar. From XPS and SIMS analysis, metal halides and C-O, FCI and $CClF_2$ were detected. The etching of PZT films in Cl-based plasma is primarily chemically assisted ion etching and the remove of nonvolatile etch byproducts is the dominant step. Consequently, we suggest that the increase of Cl radicals and the volatile oxy-compound such as $CO_y$ are made by adding $CF_4$ into $Cl_2$/Ar plasma. Therefore, the etch rate of PZT in $CF_4/Cl_2/Ar$ plasma is faster than in $Cl_2$/Ar. The etched profile of PZT films was obtained above 70$^{\circ}$ by the SEM micrograph.