• 제목/요약/키워드: C-H bond elongation

검색결과 10건 처리시간 0.022초

Generation of Si-O-C Bond without Si-$CH_3$ Bond in Hybrid Type SiOC Film

  • Oh, Teresa
    • 반도체디스플레이기술학회지
    • /
    • 제7권3호
    • /
    • pp.1-4
    • /
    • 2008
  • The chemical shift of SiOC film was observed according to the flow rate ratio. SiOC film had the broad main band of $880\sim1190cm^{-1}$ and the sharp Si-$CH_3$ bond at $1252cm^{-1}$, and the peak position of the main bond in the infrared spectra moved to high frequency according to the increasing of an BTMSM flow rate. So the increment of the alkyl group induced the C-H bond condensation in the film, and shows the blueshift in the infrared spectra. In the case of P5000 system of Applied Materials Corporation, the strong bond of Si-CH3 bond in precursor does not enough to dissociated and ionized, because low plasma energy due to the capactive coupled CVD. Therefore, there was the sharp peak of Si-$CH_3$ bond at $1252cm^{-1}$.

  • PDF

2가지 서로 다른 기능에 의해 생성된 박막의 물리적인 특성의 기원 (Physical Properties of Thin Films Generated by Two Kinds of Different Function)

  • 오데레사
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2008년도 하계종합학술대회
    • /
    • pp.487-488
    • /
    • 2008
  • SiOC films containing alkyl groups have a low dielectric constant because of the interaction between the C-H hydrogen bonds and the oxygen of high electro-negative atom. The Si-$CH_3$ in a void is broken by the $O_2$, therefore the strength of CH bond in Si-O-O-$CH_3$ bond increases. The Si-O-O-$CH_3$ bond is broken by nucleophilic attack due to Si atom, again. The elongation of C-H bond causes the red shift, and the compression of C-H bond causes the blue shift. Among these chemical shifts, the blue shift from $1000\;cm^{-1}$ to $1250\;cm^{-1}$ was related with the formation of pores. If the oxygen is deficient condition, the methylradicals of the electron-rich substitution group terminate easily the Si-O-Si cross-link, and the pore is originated from the cross-link breakdown due to much methyl radicals of Si-$CH_3$. The dielectric constant of the films decreases due to pore generation.

  • PDF

푸리에변환 적외선분광분석법에 의한 누설전류의 발생 원인에 대한 연구 (Study on the Generation of Leakage Current by the Fourier Transform Infrared Analysis)

  • 오데레사
    • 한국전기전자재료학회논문지
    • /
    • 제20권6호
    • /
    • pp.514-519
    • /
    • 2007
  • The surfaces of $SiO_2$ films were treated by PMMA diluted solutions, and analyzed the chemical shift from Fourier Transform Infrared Spectrometer. The $SiO_2$ film treated by PMMA diluted solution changed the properties of the surface, and showed the blue and red shift according to the concentration of PMMA. The C-H bond elongation effect due to the high electro-negative atom chlorine showed the red shift, and makes the final material with the cross-link structure. The leakage current was efficiently reduced at the sample No 7 with the red shift, witch depends on the electron deficient group.

SiOC 박막에서 Si-O 결합의 증가와 유전상수의 관계 (Relationship between Dielectric Constant and Increament of Si-O bond in SiOC Film)

  • 오데레사
    • 한국산학기술학회논문지
    • /
    • 제11권11호
    • /
    • pp.4468-4472
    • /
    • 2010
  • ICP-CVD 방법에 의해 제작된 SiOC 박막을 유전상수와 화학적 이동의 상관성에 대하여 조사하였다. SiOC 박막은 플라즈마 에너지에 의해서 해리작용과 재결합작용에 의해서 cross link 구조를 갖게 되는 Si-O 와 C-O 결합으로 구성된 $930{\sim}1230\;cm^{-1}$ 영역에서 혼합된 Si-O-C 주 결합으로 이루어졌다. C-O 결합은 $1270cm^{-1}$에서 보여지는 Si-$CH_3$ 결합의 말단부분인 C-H 결합이 전기음성도가 큰 산소에 의해서 끌리는 효과로부터 만들어진 결합이다. 그러나 Si-O 결합은 Si-$CH_3$ 결합이 분해되고 난뒤 2차 이온결합에 의해서 만들어진 결합이다. Si-O 결합의 증가는 주결합에서 오른쪽 결합이 증가하기 때문이며, FTIR 스펙트라에 의해서 red shift로 나타났다. 이러한 결과는 SiOC 박막이 보다 더 안정되고 강한 박막임을 의미한다. 그래서 SiOC 박막은 열처리 후 비정질도가 높고 거칠기가 감소되는 것을 확인하였다.

C-H 수소결합을 갖는 유무기 하이브리드 물질에서의 열처리 효과 (Annealing effects of organic inorganic hybrid silica material with C-H hydrogen bonds)

  • 오데레사
    • 대한전자공학회논문지SD
    • /
    • 제44권11호
    • /
    • pp.20-25
    • /
    • 2007
  • SiOC 박막과 같은 유무기 하이브리드 실리카 물질에서의 열처리효과에 의한 결합구조의 변화와 유전상수에 관하여 연구하였다. 유무기 하이브리드 실리카 물질은 BTMSM과 산소의 혼합가스를 이용한 CVD방법에 의하여 증착되었다. 유무기 하이브리드 실리카 물질은 증착조건에 따라 3가지 유형으로 분류되었으며, 유전상수는 MIS 구조에 의하여 조사되었다. XPS 분석에 의하여 C 1s 스펙트라는 O2/BTMSM=1.5의 유량비를 갖는 박막에서 282.9 eV의 organometallic carbon 반응을 보여주는 피크를 나타내었다. organometallic carbon반응의 결과는 안정성 있는 크로스 링크 결합구조를 만들어내며, 하이브리드 특성을 갖는 이 박막에서 열처리 후 유전상수는 가장 낮았다.

탄소 주입 실리콘 산화 절연박막에서 전위장벽과 온도 변화에 대한 상관성 (Correlation between the Potential Barrier and Variation of Temperature on SiOC thin film)

  • 오데레사
    • 한국정보통신학회논문지
    • /
    • 제12권12호
    • /
    • pp.2247-2252
    • /
    • 2008
  • 탄소 주입실리콘 산화막으로서 SiOC 박막은 화학적 증착 방법에 의해 성막되었으며, 박막의 분석기법으로 FTIR 분석기와 I-V 측정과 표면분석으로 전자현미경을 이용하였다. 증착된 샘플들은 유량비의 변화에 따라서 화학적 이동현상이 나타났으며, 표면에서의 그레인은 유기물 특성과 무기물 특성의 SiOC 박막샘플에서 나타났다. 그러나 하이브리드 특성의 박막에서는 그레인이 형성되지 않았다. 하이브리드 특성의 박막샘플에서 온도가 증가할수록 누설전류는 감소하였다. 누설전류는 온도가 증가함에 따라 감소하였는데 전위장벽이 증가하기 때문에 감소하는 것으로 나타났다.

유무기 하이브리드 SiOC 박막의 화학적 이동에 대한 FTIR 스펙트라 분석 (Analysis of FTIR Spectra in Organic Inorganic Hybrid Type SiOC Films)

  • 오데레사
    • 대한전자공학회논문지SD
    • /
    • 제42권6호
    • /
    • pp.17-22
    • /
    • 2005
  • 유무기 하이브리드 SiOC 박막은 차세대 유력한 저유전상수를 갖는 박막이다. SiOC 박막의 결합구조는 FTIR 분석기를 이용하여 화학적 이동이 일어나는 것을 확인하여 분석하였다. 유기화학분야에서의 일반적인 화학적 이동은 red shift에 해당하지만, 하이브리드 타입의 SiOC 박막은 red shift 뿐만 아니라 특이한 경우에 해당하는 blue shift도 관찰되었다. 화학적 이동의 원인은 전기음성도가 큰 원소가 주변에 존재하는 수소결합사이의 상호작용 때문인데, SiOC 박막에서 blue shift는 전자를 많이 포함하는 메틸그룹이 증가함으로 생기는 기공을 만드는 원인을 제공한다. SiOC 박막의 결합구조 역시 2가지 유형의 화학적 이동에 따라서 cross-link 구조와 case-link 구조의 두 가지 유형으로 나타난다. 유량비와 증착할 때 주어지는 열에너지에 따라서 두 가지 결합구조를 나타낸다. cross-link 구조와 cross-link breakage 구조는 박막의 유전상수가 낮아지는 원인 서로 다르며 화학적 물리적인 특성 또한 다르게 나타나는 것을 증명하고 있다. Si-O-C cross-link 구조는 red shift의 원인이 된 수소결합에 의한 원자사이의 길이가 길어지는 효과에 의해 표면접착력이 개선되며, 유전상수 역시 감소하였다.

Structural Characterization of the (TEX)$Sr_2Co_0.5Nb(Ta)_0.5O_4$(/TEX) and (TEX)$Sr_3CoNb(Ta)O_7$(/TEX)

  • 조한상;;류광현;유철현
    • Bulletin of the Korean Chemical Society
    • /
    • 제21권7호
    • /
    • pp.679-684
    • /
    • 2000
  • The Sr2Co0.5Nb(Ta)0.5O4 and Sr3CoNb(Ta)O7 compounds, both with Ruddlesden-Popper structures, have been synthesized by the ceramic method at $1150^{\circ}C$ under atmospheric pressure. The crystallographic structure of the compounds was assigned to the tetr agonal system with space group 14/mmm by X-ray diffraction(XRD) Rietveld refinement. The reduced lattice volume and lattice parameters increased as the Ta with 5d substitutes for the Nb with 4d in the compounds. The Co/Nb(Ta)O bond length has been determined by X-ray absorption spectroscopic(EXAFS/XANES) analysis and the XRD refinement. The CoO6,octahedra were tetragonally distorted by elongation of Co-O bond along the c-axis. The magnetic measurement shows the compounds Sr2Co0.5Nb(Ta)0.5O4 and Sr3CoNb(Ta)O7 have paramagnetic properties and the Co ions with intermediate spin sates between high and low spins in D4h symmetry. All the compounds showed semiconducting behavior whose electrical conductivity increased with temperature up to 1000 K. The electrical conductiviy increased and the activation energy for the conduction decreased as the number of perovskite layers increased in the compounds with chemical formula An+1BnO3n+1.

실크 정련 세리신 단백질의 분리특성과 응용(2) (Separation Performance and Application of Sericin Protein in Silk Degumming Solution(2))

  • 차진우;박인우;배기서;홍영기;이서희;김용덕
    • 한국염색가공학회지
    • /
    • 제22권2호
    • /
    • pp.132-139
    • /
    • 2010
  • Sericin pulverization process was applied by freezing-thawing of sericin protein concentration solution and physicochemical properties of sericin/chitosan blended films were investigated. In sericin pulverization process by freezing-thawing method, the refrigeration storage at $4^{\circ}C$ maximized gelling between sericin molecules, which increased 10% of recovery ratio from sericin concentration solution that using ultrafiltration procedure. In physicochemical properties of sericin/chitosan blended films, the maximum load of chitosan (6.7kgf) had higher than that of sericin (1.2kgf), and the elongation of sericin and chitosan had 96% and 34%, respectively. Also FT-IR analysis of sericin/chitosan blended films showed that both sericin and chitosan films had amide I peak (N-H bond) in $1,521cm^{-1}$ and amide II peak (C=O bond) in $1,630cm^{-1}$. In addition, it could confirm compatibility between both materials as indicated by the decrease in the amide I peak's absorption value as chitosan content increases.

유청단백질로 만들어진 식품포장재에 관한 연구

  • 김성주
    • 한국유가공학회:학술대회논문집
    • /
    • 한국유가공기술과학회 2002년도 제54회 춘계심포지움 - 우유와 국민건강
    • /
    • pp.59-60
    • /
    • 2002
  • Edible films such as wax coatings, sugar and chocolate covers, and sausage casings, have been used in food applications for years$^{(1)}$ However, interest in edible films and biodegradable polymers has been renewed due to concerns about the environment, a need to reduce the quantity of disposable packaging, and demand by the consumer for higher quality food products. Edible films can function as secondary packaging materials to enhance food quality and reduce the amount of traditional packaging needed. For example, edible films can serve to enhance food quality by acting as moisture and gas barriers, thus, providing protection to a food product after the primary packaging is opened. Edible films are not meant to replace synthetic packaging materials; instead, they provide the potential as food packagings where traditional synthetic or biodegradable plastics cannot function. For instance, edible films can be used as convenient soluble pouches containing single-servings for products such as instant noodles and soup/seasoning combination. In the food industry, they can be used as ingredient delivery systems for delivering pre-measured ingredients during processing. Edible films also can provide the food processors with a variety of new opportunities for product development and processing. Depends on materials of edible films, they also can be sources of nutritional supplements. Especially, whey proteins have excellent amino acid balance while some edible films resources lack adequate amount of certain amino acids, for example, soy protein is low in methionine and wheat flour is low in lysine$^{(2)}$. Whey proteins have a surplus of the essential amino acid lysine, threonine, methionine and isoleucine. Thus, the idea of using whey protein-based films to individually pack cereal products, which often deficient in these amino acids, become very attractive$^{(3)}$. Whey is a by-product of cheese manufacturing and much of annual production is not utilized$^{(4)}$. Development of edible films from whey protein is one of the ways to recover whey from dairy industry waste. Whey proteins as raw materials of film production can be obtained at inexpensive cost. I hypothesize that it is possible to make whey protein-based edible films with improved moisture barrier properties without significantly altering other properties by producing whey protein/lipid emulsion films and these films will be suitable far food applications. The fellowing are the specific otjectives of this research: 1. Develop whey protein/lipid emulsion edible films and determine their microstructures, barrier (moisture and oxygen) and mechanical (tensile strength and elongation) properties. 2. Study the nature of interactions involved in the formation and stability of the films. 3. Investigate thermal properties, heat sealability, and sealing properties of the films. 4. Demonstrate suitability of their application in foods as packaging materials. Methodologies were developed to produce edible films from whey protein isolate (WPI) and concentrate (WPC), and film-forming procedure was optimized. Lipids, butter fat (BF) and candelilla wax (CW), were added into film-forming solutions to produce whey protein/lipid emulsion edible films. Significant reduction in water vapor and oxygen permeabilities of the films could be achieved upon addition of BF and CW. Mechanical properties were also influenced by the lipid type. Microstructures of the films accounted for the differences in their barrier and mechanical properties. Studies with bond-dissociating agents indicated that disulfide and hydrogen bonds, cooperatively, were the primary forces involved in the formation and stability of whey protein/lipid emulsion films. Contribution of hydrophobic interactions was secondary. Thermal properties of the films were studied using differential scanning calorimetry, and the results were used to optimize heat-sealing conditions for the films. Electron spectroscopy for chemical analysis (ESCA) was used to study the nature of the interfacial interaction of sealed films. All films were heat sealable and showed good seal strengths while the plasticizer type influenced optimum heat-sealing temperatures of the films, 130$^{\circ}$C for sorbitol-plasticized WPI films and 110$^{\circ}$C for glycerol-plasticized WPI films. ESCA spectra showed that the main interactions responsible for the heat-sealed joint of whey protein-based edible films were hydrogen bonds and covalent bonds involving C-0-H and N-C components. Finally, solubility in water, moisture contents, moisture sorption isotherms and sensory attributes (using a trained sensory panel) of the films were determined. Solubility was influenced primarily by the plasticizer in the films, and the higher the plasticizer content, the greater was the solubility of the films in water. Moisture contents of the films showed a strong relationship with moisture sorption isotherm properties of the films. Lower moisture content of the films resulted in lower equilibrium moisture contents at all aw levels. Sensory evaluation of the films revealed that no distinctive odor existed in WPI films. All films tested showed slight sweetness and adhesiveness. Films with lipids were scored as being opaque while films without lipids were scored to be clear. Whey protein/lipid emulsion edible films may be suitable for packaging of powder mix and should be suitable for packaging of non-hygroscopic foods$^{(5,6,7,8,)}$.

  • PDF