• Journal of the Korean Chemical Society
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• v.16 no.2
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• pp.59-63
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• 1972

In connection with two electron binding energy of each bond of saturated hydrocarbons, C-C bond fission and hydrogen abstraction from C-H bond are discussed by means of two center Huckel method. A beautiful correlation could be noticed between the observed bond dissociation energy and the calculated bond energy except for n-butane. Bond dissociation energies between C-C bond were also related to C-C bond fission. We could also find a very close relation between the relative easiness of hydrogen abstraction and the calculated binding energy of C-H bond. In other words, C-H bonds of tertiary hydrogen have been noticed as most weakely bonded and hence the tertiary hydrogen would most easily from the paraffins. In addition, the C-H binding energy is discussed applying ionic character of C-H bond which is derived from its dipole moment (0.4D)

• Journal of Welding and Joining
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• v.15 no.5
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• pp.104-114
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• 1997

The microstructure and bond strength were investigated on the SiC/SiC and SiC/mild steel joints brazed by Ag-5at%Ti alloy. Ag-5at%Ti-2at%Fe and -5at%Fe brazing alloys were also used to see the effects of Fe addition on the bond strength of SiC/SiC brazed joints. Brazing temperature and brazing gap were selected and examined as brazing variables. The microstructure of SiC/SiC brazed joints was affected by Fe addition to the Ag-5at%Ti alloy, but the bond strength was not. Increasing brazing temperature also changed the microstructure of $Ti_5Si_3$ reaction layer and brazing alloy matrix of the SiC/SiC and SiC/mild steel joints, but not the bond strength. Brazing gap had a great effects on the bond strength. Decreasing brazing gap from 0.2 mm to 0.1 mm in SiC/SiC brazing increased the bond strength from 187 MPa to 263 MPa and, in SiC/mild steel brazing, from 189 MPa to 212 MPa. It was concluded that the most important parameter on the bond strength in SiC/SiC and SiC/mild steel brazing was the relative ratio between brazing gap and specimen size.

• Journal of Welding and Joining
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• v.14 no.4
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• pp.99-108
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• 1996

The microstructure and bond strength are examined on the SiC/SiC and SiC/mild steel joints brazed by the Ag-Ti based alloys with different Ti contents. In the SiC/SiC brazed joints, the thickness of the reaction layers at the bond interface and the Ti particles in the brazing alloy matrices increase with Ti contents. When Ti is added up to 9 at% in the brazing alloy. $Ti_3SiC_2$ phase in addition to TiC and $Ti_5Si_3$ phase is newly created at the bond interface and TiAg phase is produced from peritectic reaction in the brazing alloy matrix. In the SiC/mild steel joints brazed with different Ti contents, the microstructure at the bond interface and in the brazing alloy matrix near SiC varies similarly to the case of SiC/SiC brazed joints. But, in the brazing alloy matrix near the mild steel, Fe-Ti intermetallic compounds are produced and increased with Ti contents. The bond strengths of the SiC/SiC and SiC/mild steel brazed joints are independent on Ti contents in the brazing alloy. There are no large differences of the bond strength between SiC/SiC and SiC/mild steel brazed joints. In the SiC/mild steel brazed joints, Fe dissolved from the mild steel does not affect on the bond strength of the joints. Thermal contraction of the mild steel has nearly no effects on the bond strength due to the wide brazing gap of specimens used in the four-point bend test. The brazed joints has the average bond strength of about 200 MPa independently on Ti contents, Fe dissolution and joint type. Fracture in four-point bend test initiates at the interface between SiC and TiC reaction layer and propagates through SiC bulk. The adhesive strength between SiC and TiC reaction layer seems to mainly control the bond strength of the brazed joints.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.170-171
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• 2006

The chemical shift of SiOC film was observed according to the flow rate ratio. SiOC film has the broad main band of $880{\sim}1190cm^{-1}$ and the sharp Si-$CH_3$ bond at $1252cm^{-1}$, and the infrared spectra in the Si-O-C bond moved to low frequency according to the increasing of an oxygen flow rate. The chemical shift affected the carbon content in the SiOC film, and the decreasing of carbon atoms elongated the C-H bonding length, relatively. The main bond without the sharp Si-$CH_3$ bond at $1252cm^{-1}$ consisted of Si-C, C-O and Si-O bonds, and became the bonding structure of the Si-O-C bond.

• Journal of the Korean Chemical Society
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• v.20 no.2
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• pp.111-117
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• 1976

The configuration and conformation of methyl benzamidoxime have been studied from extended Huckel molecular orbital calculations.The results show that the E-configuration of the C=N double bond is favored compared with that of Z-configuration with the sp-conformation of the C-N bond rotamers, but Z-configuration is more stable with the ap-conformation of the C-N bond rotamers. The conformation of C-N bond with equal configuration of C=N bond and equal conformation of N-O bond, sp-form is favored, but the conformation of N-O bond with equal configuration and equal conformation of C-N bond ap-form is more stable. The major part of the stabilization energies can be accounted for by the electrostatic energies between the atoms involved.

• The Journal of Korean Academy of Prosthodontics
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• v.33 no.4
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• pp.662-684
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• 1995

The purpose of this study was to evaluate the shear bond strength between various resin-bonded retainers and enamel according to the adhesive resins and retention types and observe the bond filure modes with scanning electron microscope(SEM). For this purpose, the followin eight sub-groups were tested in shear bond strength : 1) electrochemically etched group(Verabond) using Panavia EX and Superbond C&B 2) tin-plated group(PG-S) using Panavia EX and Superbond C&B 3) salt-treated group(Verabond) using Panavia EX and Superbond C&B 4) meshtreated group(Verabond) using Panavia EX and Superbond C&B. Thermocycling test was conducted on the condition of 15 second dwell time each in $5^{\circ}C$ and $55^{\circ}C$bath. Shear bond strength was measured by Instron Universal Testing Machine(medel 1125). The obtained results were as follows : 1. After thermocycling, the shear bond strengths of tin-plated group and electrochemically etched group were significantly greater than those of salt-treated group and mesh-treated group. And the shear bond strength of Panavia EX was greater than that of Superbond C&B with salt-treated group and tin-plated group(p<0.05). 2. Before thermocycling, electrochemically etched group using Superbond C&B produced the greatest shear bond strength(p<0.01). 3. The shear bond strength of electrochemically etched group using Superbond C&B was significantly decreased after thermocycling(p<0.01). 4. In observation of bond failure modes before thermocycling, Panavia EX highly exhibited enamel fracture. Tin-plated group using Superbond C&B adhesive failure between metal and resin and electrochemically etched group using Superbond C&B exhibited adhesive failure between enamel and rdsin. 5. In observation of failure modes after thermocycling, Panavia EX exhibited cohesive failure and Superbond C&B exhibited adhesive failure between resin and metal.

• Journal of the Korean Chemical Society
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• v.38 no.2
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• pp.169-173
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• 1994

The previously reported cytotoxic metabolites, against the KB cell line, xestoquinone, halenaquinol sulfate and $halenaquinol^{5,6}$ were isolated from the unidentified sponge collected in October 1992, Manado Bay, Sulawesi in Indonesia. Their structure were elucidated by $^1H-,\;^{13}C$-NMR, $^1H-,\;^{13}C$(1 bond) Heteronuclear Multiple Quantum Coherence Spectroscopy$(HMQC)^1$, $^1H-,\;^{13}C$C(2 and 3 bond) Heteronuclear multiple Bond Correlation Spectroscopy$(HMBC)^2$, Electron Impact Mass Spectroscopy(EI ms), Ultraviolet Spectroscopy(UV), and Infrared Spectroscopy(IR)

• Bulletin of the Korean Chemical Society
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• v.25 no.11
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• pp.1623-1624
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• 2004

• Journal of the Semiconductor & Display Technology
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• v.7 no.3
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• pp.1-4
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• 2008

The chemical shift of SiOC film was observed according to the flow rate ratio. SiOC film had the broad main band of $880\sim1190cm^{-1}$ and the sharp Si-$CH_3$ bond at $1252cm^{-1}$, and the peak position of the main bond in the infrared spectra moved to high frequency according to the increasing of an BTMSM flow rate. So the increment of the alkyl group induced the C-H bond condensation in the film, and shows the blueshift in the infrared spectra. In the case of P5000 system of Applied Materials Corporation, the strong bond of Si-CH3 bond in precursor does not enough to dissociated and ionized, because low plasma energy due to the capactive coupled CVD. Therefore, there was the sharp peak of Si-$CH_3$ bond at $1252cm^{-1}$.

• Journal of the Korean Chemical Society
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• v.39 no.4
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• pp.301-305
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• 1995

The cytotoxic metabolites, against the KB cell line, halenaquinone, epispongiatriol and aldisin were isolated from the sponge Spongia sp. collected in September 1992, Manado Bay, Sulawesi in Indonesia. Their structures were elucidated by 1H, 13C NMR, 1H 13C(1 bond) Heteronuclear Multiple Quantum Coherence Spectroscopy (HMQC), 1H 13C(2 and 3 bond) Heteronuclear Multiple Bond Correlation Spectroscopy (HMBC), Electron Impact Mass Spectroscopy (EI ms) and Infrared Spectroscopy (IR).