• Bulletin of the Korean Mathematical Society
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• v.48 no.2
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• pp.223-245
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• 2011

In this paper, we de ne an $L_p$ analytic generalized Fourier Feynman transform and a convolution product of functionals in a Ba-nach algebra $\cal{F}$($C_{a,b}$[0, T]) which is called the Fresnel type class, and in more general class $\cal{F}_{A_1;A_2}$ of functionals de ned on general functio space $C_{a,b}$[0, T] rather than on classical Wiener space. Also we obtain some relationships between the $L_p$ analytic generalized Fourier-Feynman transform and convolution product for functionals in $\cal{F}$($C_{a,b}$[0, T]) and in $\cal{F}_{A_1,A_2}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.550-553
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• 2001

In this study, unity current gain frequency f$\_$T/ of GaAs MESFET is predicted with different temperatures up to 400 $^{\circ}C$. Temperature dependence parameters of the device including intrinsic carrier concentration n$\_$i/ effective mass, depletion width are considered to be temperature dependent. Small signal parameters such as gate-source, gate dran capacitances C$\_$gs/ C$\_$gd/ are correlated with transconductance g$\_$m/ to predict the unity current gain frequency. The extrinsic capacitance which plays an important roles in high frequency region has been taken into consideration in evaluating total capacitance by using elliptic integral through the substrate. From the results, f$\_$T/ decreases as the temperature increases due to the increase of small signal capacitances and the mobility degradation. Finally the extrinsic elements of capacitances have been proved to be critical in deciding f$\_$T/ which are originated from the design rule of the device.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Communications of the Korean Mathematical Society
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• v.32 no.2
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• pp.305-319
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• 2017

Recently many authors have investigated so-called Aleph (${\aleph}$)-function and its various properties. Here, in this paper, we aim at establishing certain integral formulas involving the Aleph (${\aleph}$)-function. Precisely, integrals with product of Aleph (${\aleph}$)-function with Jacobi polynomials, Bessel Maitland function, general class of polynomials were under consideration. Some interesting special cases of our main result are also considered and shown to be connected with certain known ones.

• Journal of Ocean Engineering and Technology
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• v.6 no.1
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• pp.122-130
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• 1992

The effect of loading waveform on elevated temperature low-cycle fatigue crack growth behavior in a SUS 304 stainless steel have been investigated under symmetrical trangular (fast-fast), trapezoidal and asymmetrical(fast-slow, slow-fast) waveforms at 650.deg. C. It was found that the crack growth rate in fast-slow loading waveform appeared to be higher a little and the crack growth rate in slow-fast loading waveform much higer than that in fast-fast loading waveform, and difference in crack growth rate between fast-show and slow-fast waveforms nearly didn't appear in the region of da/dN>10/sup -2/ The crack growth rate in the trapezoidal loading waveform with t/sub h/=500sec appeared to be faster than that in slow(500sec)-fast(1sec). In addition, parameter modified J-integral could be considered as useful parameter for fatigue crack growth rate in all waveforms. The result obtained are as follow. da/dN=4.91*10/sup -3/ (.DELTA. J/sub c/)/sup 0.565/.

• Journal of the Korean Mathematical Society
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• v.37 no.6
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• pp.915-927
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• 2000

This paper is concerned with degenerate Volterra equations Mu(t) + ∫(sub)0(sup)t k(t-s) Lu(s)ds = f(t) in Banach spaces both in the hyperbolic case, and the parabolic one. The key assumption is played by the representation of the underlying space X as a direct sum X = N(T) + R(T), where T is the bounded linear operator T = ML(sup)-1. Hyperbolicity means that the part T of T in R(T) is an abstract potential operator, i.e., -T(sup)-1 generates a C(sub)0-semigroup, and parabolicity means that -T(sup)-1 generates an analytic semigroup. A maximal regularity result is obtained for parabolic equations. We will also investigate the cases where the kernel k($.$) is degenerated or singular at t=0 using the results of Pruss[8] on analytic resolvents. Finally, we consider the case where $\lambda$ is a pole for ($\lambda$L + M)(sup)-1.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.6 no.1
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• pp.33-45
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• 2002

An approximation of the Fourier Sine Transform via Gr$\ddot{u}$ss, Chebychev and Lupaş integral inequalities and application for an electrical curcuit containing an inductance L, a condenser of capacity C and a source of electromotive force $E_0P$(t), where P (t) is an $L_2$-integrable function, are given.

• Proceedings of the KSR Conference
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• 2004.06a
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• pp.702-709
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• 2004

Modified Gurson model (Gurson-Tvergaard-Needleman model) was used to analyze crack growth in M(T) and C(T) specimens. A commercial finite element code ABAQUS/Explicit is used to account for total failure of material point by cavity coalescence, and crack growth was simulated by finite element extinction. Crack growth resistance curve was obtained by calculating J-integral. Crack growth under residual stress was investigated.

• Kyungpook Mathematical Journal
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• v.50 no.4
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• pp.545-556
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• 2010

A good amount of work has been done on degree of approximation of functions belonging to Lip${\alpha}$, Lip($\xi$(t),r) and W($L_r,\xi(t)$) and classes using Ces$\`{a}$ro, N$\"{o}$rlund and generalised N$\"{o}$rlund single summability methods by a number of researchers ([1], [10], [8], [6], [7], [2], [3], [4], [9]). But till now, nothing seems to have been done so far to obtain the degree of approximation of functions using (N,$p_n$)(C, 1) product summability method. Therefore the purpose of present paper is to establish two quite new theorems on degree of approximation of function $f\;\in\;Lip({\alpha},r)$ class and $f\;\in\;W(L_r,\;\xi(t))$ class by (N, $p_n$)(C, 1) product summability means of its Fourier series.

• Journal of Korean Port Research
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• v.7 no.1
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• pp.5-12
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• 1993

In complex decision making such as ill-defined system, one of the main problem is how to treat ambiguous aspect of the decision making. According to the complexity and ambiguity of the objective systems, many types of evaluation attributes are necessary for the rational decision and the relationship among the attributes become complex and fuzzy. Fuzzy integral is very effective to evalute the complex system with interaction between attributes but how to save the evaluation efforts in the decision making process of grading the membership of the objects or alternative is the problem to be tackled. Because the more object there are to evaluate, the number of decisions to made increase exponentially. Therefore, this paper aimes to propose a new evaluation algorithm based on fuzzy integral which can save the evaluator's efforts in decision making process. The proposed algorithm is constructed as follows : First, compose the fuzzy measure by introducing AHP(Analytical Hierachy Process) & mutual interaction coefficient. Second, generate fuzzy measure value of monotone family set for calculating the fuzzy integral. The effectiveness of the proposed algorithm is investigated through the example and sensitivity of interaction coefficient is illustrated.