• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.26-31
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• 2001

Recently, miniaturization and mass production are the main trends in manufacturing fields. Therefore, ultraprecision machining and MEMS technology have been taken more and more important position in machining of microparts. Micro endmilling is one of the prominent technology that has wide spectrum of application field ranging from macro parts to micro products, such as PDP and IT components, in precision products manufacturing. However, the deburring is significant problem in making smooth and precise parts in micro endmilling. This paper shows removal characteristics of burr generated by micro endmilling process. Additionally, it is necessary to understand the formation mechanism of burr of micro barrier ribs to find proper deburring method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.2
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• pp.143-148
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• 2016

A micro end mill is one of the precise tools used in machining ultra-precision products such as microchannel and micropatterned mold. To achieve the required precision of these products, several studies investigated the cutting force, burr formation, and burr generation mechanism of micro end mills; however, there are few studies on the alignment of micro tools, which is the foundation of machining. Hence, in this investigation, relation expressions were derived to determine the relation between the misalignment parameters and the machining accuracy. At the same time, the effect of the machining parameters was analyzed using a multiple linear regression analysis and the analysis of variance. The results indicate that the tilting angle of a micro tool has more influence on the machining accuracy than other parameters.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.3
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• pp.29-35
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• 2006

Various types of elliptical motions are generated by PZT mechanism which is composed of two parallel piezoelectric actuators. Elliptical vibration cutting(EVC) is obtained by attaching single crystal diamond cutting tool to the mechanism, and V-grooving for Brass and Aluminum is carried out by applying the EVC. It is experimentally observed that the cutting force in the process of the EVC reduces compared to the ordinary non-vibration cutting, which is due to the decrease of undeformed chip thickness and frictional force between the tool and chip. Ultrasonic elliptical vibration cutting(UEVC) suppresses burr formation and decreases cutting force still more, so UEVC makes it possible to enhance the shape accuracy of machined surface.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.