• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.140-143
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• 2006

Load/Unload(L/UL) technology includes the benefits, that is, increased areal density, reduced power consumption and improved shock resistance. The main issues of L/UL are no slider-disk contact and no media damage. To make sure L/UL stability, we consider many design parameters in L/UL systems. This paper is focused on disk design parameters through designing a disk bump in outer guard band(OGB). In the case of bump design on the disk, we create a bump by changing bump design parameters as like size and amplitude. From dynamic analysis, we choose optimal bump model with the highest flying height and the longest rising time. When a slider passes over a bump in dynamic system, the slider rise above bump according to bump shape. On the basis of this rising effect on the bump, we apply bump design to classical L/UL system having slider-disk contact possibility. This study is based on the simulation, we finally realize improved slider unloading performance by applying slider dynamic result on unload simulation.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.833-836
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• 2007

Load/Unload technology has more benefits than the conventional CSS technology. However, it remains unsolved technical problem on the unloading process. While the slider climbs up the ramp at the outer edge of the disk, the possibility of the slider-disk contact by lift-off force and rebound of the slider increases. This paper focuses on no slider-disk contact. To prevent the slider-disk contact, we apply the disk bump on disk outer edge proceeding unload. Firstly, in the simulation, the bump dimension is determined by changing bump design parameters. Secondly, dynamic stability of slider have to be checked on disk bump before unload analysis, and unload analysis is performed by applying stable bump shapes to unload simulation. Thirdly, we select optimal bump shape to improve unload performance by unload analysis. Finally, in the experiment, the disk bump is mechanically manufactured by pressing disk surface using diamond tip. That is variously processed by changing pressing pressure. After confirming bump shape by nano-scanner, proper bump shape is applied to real experimental unload process. Through this investigation, we propose the optimal bump design to prevent the slider-disk contact, and then we can realize improved unloading performance.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.2
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• pp.80-88
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• 2000

This paper presents a method to optimize the bump steer characteristics (the change of toe angle with vertical wheel travel) with respect to hard points in the double wishbone front suspension of the four-wheel-drive vehicle using the design of experiment, multibody dynamics simulation, and optimum design program. Front and rear suspensions are modeled as the interconnection of rigid bodies by kinematic joints and force elements using DADS. The design variables with respect to the kinematic characteristics are obtained through the experimental design sensitivity analysis. An object function is defined as the area of absolute differences between the desired and experimental toe angle. By the design of experiment and regression analysis, the regression model function of bump steer characteristics is extracted. The design variables that make the toe angle optimized are selected using the optimum design program DOT. The lane change simulations and tests of the full vehicle models are implemented to evaluate the improvement of vehicle handling performances by the optimization of front bump steer characteristics. The results of the lane change simulations show that the vehicle with optimized bump steer has the weaker understeer tendency than the vehicle with initial bump steer.

• Journal of the Korean Magnetics Society
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• v.4 no.2
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• pp.130-134
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• 1994

This paper describes the occurance of bumps in playback spectrum while reading with MIG heads. The amplitudes of the bumps in theoretically predicted frequencies are investigated by computer simulation. Three cases of MIG head structure are simulated, one without pseudo gaps, the other two with pseudo gap thicknesses of $0.02\;\mu\textrm{m}\;and\;0.2\;\mu\textrm{m}$ on both sides of the main gap, respectively. It is assumed that metal powder tapes are used. The results show that the bumps occur at predicted frequencies and the amplitudes of the bumps agree well with predicted values.

• Journal of Biosystems Engineering
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• v.30 no.6 s.113
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• pp.366-372
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• 2005

The objective of this study was to evaluate the bump crossing and loading stability of a proto-type mini-forwarder under development. The evaluation was performed by computer simulation using a multi-body dynamic analysis program, Recur- Dyn 5.21. The proto-type was modeled and its properties such as mass, mass center, and mass moment of inertia were determined using 3D CAD modeler, Solid Edge 8.0. The $\%$ errors of masses, mass center, mass moment of inertia, and vertical motion of the model were within less than $10\%$ and the model's behavior agreed relatively well with those of the proto-type when traversing over a rectangular bump. Using the validated model, bump crossing of the proto-type was simulated and the loading limit was determined. It was found that effects of the shapes of bump on the bump crossing performance was insignificant within the practical heights of bumps. Stability of bump crossing increased with loading. However, loading of longer logs than 2.7 m made the crossing unstable because the ends of logs contacted ground when traversing over the bump. The maximum loading capacity of the proto-type was estimated to be 7.8 kN of 2.7 m long logs.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.496-499
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• 2012

Modified structure of copper pillar bump which has trapezoidal cross section on the top region is suggested with simulation results and concept of fabrication process. Due to the large surface area of joint region between bump and solder in suggested structure, electro-migration effect can be reduced. Reduction of electro-migration is related with current density and joule heating in bump and investigated with finite element methods with variation of dimensional parameters. Mechanical characteristics are also investigated with comparing modified copper pillar bump and conventional copper pillar bump.

• Transactions of the Society of Information Storage Systems
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• v.3 no.4
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• pp.183-190
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• 2007

In most hard disk drives that apply the ramp load/unload technology, the head is unloaded at the outer edge of the disk while the disk is rotating. During the unloading process, slider-disk contacts may occur by lift-off force and rebound of the slider. The main issue of this paper is to prevent the slider-disk contact by rebound, and we apply a disk bump to the unloading process. To do so, first, the ranges of bump dimension are determined. Second, the stability of each bump is checked by dynamic simulation. Finally, unload simulations are performed for stable bump designs. As a result of these steps, the effect of the bump design and the position for the unloading performance were investigated. As a consequence, we propose the optimal bump design to improve the unloading performance. Furthermore, we can identify to remove rebound contact by applying a bump on disk during the unloading process.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.2
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• pp.157-162
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• 2010

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.2
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• pp.523-536
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• 1991

This dissertation analyzes the running mechanism of flexible and thin tape above rotating head through the numerical simulation and the experiment. The scope of analysis is confined to the phenomena of two dimensional elasto hydrodynamic lubrication between the protruded bump on a rotating cylinder and the running tape. This model is based on the elastic deformation equation of plate and shell and Reynolds equation. Finite difference method is employed as a numerical technique to calculate (1) the distribution of pressure between the running tape and rotating bump and (2) the vertical deformation of elastic thin tape over he rotating bump under hydrodynamic pressure. In numerical analyses, the effects of bump size on flying characteristics of the tape were evaluated and examined considering the influence of tension and stiffness of tape.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.91-96
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• 2001

When it is considered that many vehicle rides on the road and ride quality is an important method to evaluate vehicle performance with handling, running-over-bump manoeuvre may be suitable for testing ride quality. In this paper, a computed model has roughly steering system and lumped mass, connected by joint each rigid body, and suspension that has beam elements and has shock absorber as force element to represent nonlinear characteristics. A computer simulations for passing over a bump were made with two velocities. One side of vehicle passed over bump in due consideration of driver's habit that driver is subject to avoid a bad ride quality. On simulation, vertical acceleration, pitch angle and roll angle were measured at the mass center of chassis each case.