• 한국전산유체공학회:학술대회논문집
• /
• 한국전산유체공학회 2008년도 학술대회
• /
• pp.262-267
• /
• 2008

Numerical investigations were performed with an external-compression inlet with a three-dimensional bump at Mach 2 to scrutinize the geometrical effects of the bump in controlling the interaction of a shock wave with a boundary layer. The inlet was designed for two oblique shock waves and a terminal normal shock wave followed by a subsonic diffuser, with a circular cross-section throughout. The bump-type inlet that replaced the aft ramp of the conventional ramp-type inlet was optimized with respect to the inlet performance parameters as well as compared with the conventional ramp-type inlet. The current numerical simulations showed that a bump-type inlet can provide an improvement in the total pressure recovery downstream of the shock wave/boundary layer interaction over a conventional ramp-type inlet.

• 한국전산유체공학회:학술대회논문집
• /
• 한국전산유체공학회 2008년 추계학술대회논문집
• /
• pp.262-267
• /
• 2008

Numerical investigations were performed with an external-compression inlet with a three-dimensional bump at Mach 2 to scrutinize the geometrical effects of the bump in controlling the interaction of a shock wave with a boundary layer. The inlet was designed for two oblique shock waves and a terminal normal shock wave followed by a subsonic diffuser, with a circular cross-section throughout. The bump-type inlet that replaced the aft ramp of the conventional ramp-type inlet was optimized with respect to the inlet performance parameters as well as compared with the conventional ramp-type inlet. The current numerical simulations showed that a bump-type inlet can provide an improvement in the total pressure recovery downstream of the shock wave/boundary layer interaction over a conventional ramp-type inlet.

• Journal of Biosystems Engineering
• /
• 제30권6호통권113호
• /
• pp.366-372
• /
• 2005

The objective of this study was to evaluate the bump crossing and loading stability of a proto-type mini-forwarder under development. The evaluation was performed by computer simulation using a multi-body dynamic analysis program, Recur- Dyn 5.21. The proto-type was modeled and its properties such as mass, mass center, and mass moment of inertia were determined using 3D CAD modeler, Solid Edge 8.0. The $\%$ errors of masses, mass center, mass moment of inertia, and vertical motion of the model were within less than $10\%$ and the model's behavior agreed relatively well with those of the proto-type when traversing over a rectangular bump. Using the validated model, bump crossing of the proto-type was simulated and the loading limit was determined. It was found that effects of the shapes of bump on the bump crossing performance was insignificant within the practical heights of bumps. Stability of bump crossing increased with loading. However, loading of longer logs than 2.7 m made the crossing unstable because the ends of logs contacted ground when traversing over the bump. The maximum loading capacity of the proto-type was estimated to be 7.8 kN of 2.7 m long logs.

• 유체기계공업학회:학술대회논문집
• /
• 유체기계공업학회 2004년도 유체기계 연구개발 발표회 논문집
• /
• pp.98-103
• /
• 2004

This paper presents modeling and simulation of the bump foil bearings with consideration of the elastic behavior of the foil and gas compressibility. Heshmat had originally introduced the simple compliance model to estimate the EHL(elasto-hydrodynamic lubrication) performance. But this approach can not consider the deflection of top foil at the edge of bearing, so model is insufficient to analyze in case that the eccentricity ratio is greater than I. So the top foil is considered as a simple beam model supported by linear spring elements, and the bump foil deflection can be simple compliance model. The EHL calculations are performed for convention rigid type, classical foil type, variable pitch type and double bump type toil bearings. This paper presents that 2nd or 3rd generation bearings have excellent performance in every speeds.

• 마이크로전자및패키징학회지
• /
• 제26권2호
• /
• pp.31-43
• /
• 2019

본 연구에서는 유연한 접속부를 갖는 유연전자 패키지 플립칩 접속을 위해 폴리머 탄성범프를 제작하였으며, 범프의 온도 및 하중에 따른 폴리머 탄성 범프의 점탄성 및 점소성 거동을 해석 및 실험적으로 분석하고 비교 평가하였다. 폴리머 탄성 범프는 하중에 의한 변형이 용이하여 범프 높이 평탄도 오차의 보정이 용이할 뿐만 아니라 소자가 형성된 칩에 가해지는 응력 집중이 감소하는 것을 확인하였다. 폴리머 탄성 범프의 과도한 변형에 따른 Au Metal Cap Crack 현상을 보완하여 $200{\mu}m$ 직경의 Spiral Cap Type, Spoke Cap type 폴리머 탄성 범프 형성 기술을 개발하였다. 제안된 Spoke Cap, Spiral Cap 폴리머 탄성 범프는 폴리머 범프 전체를 금속 배선이 덮고 있는 Metal Cap 범프에 비해 범프 변형에 의한 응력 발생이 적음을 확인할 수 있으며 이는 폴리머 범프 위의 금속 배선이 부분적으로 패터닝되어 있어 쉽게 변형될 수 있는 구조이므로 응력이 완화되는데 기인하는 것으로 판단된다. Spoke cap type 범프는 패드 접촉부와 전기적 접속을 하는 금속 배선 면적이 Spiral Cap type 범프에 비해 넓어 접촉 저항을 유지하면서 동시에 금속 배선에 응력 집중이 가장 낮은 결과를 확인하였다.

• 한국지능시스템학회논문지
• /
• 제23권4호
• /
• pp.286-291
• /
• 2013

대시야 백색광간섭계(WSI ; White Light Scanning Interferometer)를 이용하여, Flip Chip Bump 검사 공정에 적용하는 것을 목적으로 한 인라인 형태의 플립칩 범프 3차원 검사 장치를 개발한다. 여러 서브스트레이트에 있는 플립칩 범프 높이 측정 결과와 이에 의한 동일한 여러 범프에 대한 반복성 측정 실험 결과를 제시한다. 테스트 벤치에서의 실험 결과와 개발된 플립칩 범프 3차원 검사 장치에서의 실험 결과를 비교하였으며 진동의 영향이 감소되어 개선된 반복성 실험 결과를 얻을 수 있었다. 플립칩 범프 3차원 검사 장치의 검사성능을 평가할 수 있는 기준을 제시한다.

• Journal of Mechanical Science and Technology
• /
• 제14권7호
• /
• pp.744-751
• /
• 2000

To achieve lower flying height for high areal recording density, the laser zone texturing of the disk needs to be designed to reduce glide height. One problem of the laser bump design is that the regular laser bump pattern often produces glide resonance phenomenon, which leads to failure of the glide height test. However, it was found in this study that glide resonance is an intrinsic problem of the glide head used and resonance phenomenon depends on the type of the head slider, that is, the natural frequency of the slider body. Therefore, higher glide height or glide failure caused by glide resonance does not lead to head/media interface problem in the real drive operating conditions in which the data head is used. Pseudo-random bump pattern greatly reduces the glide resonance. Smaller bump pitch will also help to reduce the glide resonance. However, as bump spacing becomes smaller, glide height will be increased due to increased air pressure developed around the bumps. Lowering bump height is the most effect way to reduce glide avalanche.

• 한국레이저가공학회지
• /
• 제2권1호
• /
• pp.51-60
• /
• 1999

In this paper, weldability and formability of Tailored-Blank (TB) and the structural impact testing of bump beam were investigated to apply TB to automobile bumper beam. The optimal $CO_2$ laser welding condition for TB of SPFC and SPRC steel plates with different thicknesses was obtained. Before welding, the cross section of butt joint was prepared only by shearing without milling process. Real type bump beam was produced by two kind of forming processes such as roll-forming and press-forming, and the good formability of TB was obtained. Impact test results of bump by using pendulum and barrier were satisfied the impact regulation of bump. Finally. It may be confirmed that laser welded TB is well-balanced material in both weight reduction and production cost of automobile bump.

• 한국소음진동공학회논문집
• /
• 제15권10호
• /
• pp.1202-1210
• /
• 2005

This paper develops a computer model for estimating the bump characterisitcs of a cat)over type large-sized truck. The truck is composed of front and rear suspension systems, a frame, a cab, and ten tires. The computer model is developed using MSC.ADAMS. A shock absorber, a rubber bush, and a leaf spring affect a lot on the dynamic characteristic of the vehicle. Their stiffness and damping coefficient are measured and used as input data of the computer model. Leaf springs in the front and rear suspension systems are modeled by dividing them three links and joining them with joints. To improve the reliability of the developed computer model, the frame is considered as a flexible body. Thus, the frame is modeled by finite elements using MSC.PATRAN. A mode analysis is performed with the frame model using MSC.NASTRAN in order to link the frame model to the computer model. To verify the reliability of the developed computer model, a double wheel bump test is performed with an actual vehicle. In the double wheel bump, vortical displacement, velocity, acceleration are measured. Those test results are compared with the simulation results.

• 한국정보통신학회논문지
• /
• 제3권3호
• /
• pp.661-669
• /
• 1999

프로브 카드는 IC(integrated circuit) 칩을 테스트할 때, 테스트 시스템의 가장 중요한 부분의 하나이다. 본 연구는 다수의 반도체 칩을 동시에 테스트 할 수 있는 범프(bump)형 수직형 프로브 카드에 관한 것이다. 프로브는 범프 팁을 가지는 실리콘 캔틸레버로 구성되어 있다. 캔틸레버의 최적 크기를 결정하기 위하여 캔틸레버의 크기는 유한요소해석에 의하여 결정되었다. 프로브는 SDB웨이퍼를 사용하여 RIE, 등방성 에칭, 그리고 벌크 마이크로머시닝에 의하여 제조되었다. FEM에 의해 결정된 최적 크기로 제작된 프로브 카드는 범프의 높이가 30$\mum$, 캔틸레버의 두께가 $\mum$, 빔의 폭이 100 $\mum$, 길이가 400 $\mum$, 이었다. 제조된 프로브 카드의 접촉 테스트에서 측정된 접촉 저항은 $2 \Omega$ 미만이고, 2만회의 접촉동안 접촉 저항의 변화가 거의 없는 특성을 보였다. 따라서 20,000회 이상의 수명을 가질 수 있음을 알 수 있었다.