• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1998년도 제28회 추계학술대회
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• pp.106-114
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• 1998

Tribological investigation of ultra thin film magnetic storage disks which have two different kinds of start/stop zone of laser textured bump disk and mechanically textured disk for before CSS test and after CSS test. To measure surface roughness, height reduction before/after CSS test and obtain accurate topographies, AFM(Atomic Force Microscope) which is most powerful recently has been used. The result of statistical analysis showed that both laser textured bump height and mechanically textured zone height have been reduced about 4~7nm after 15000 cycle CSS test. Using commercial Nano-Indenter, ramping load scratch test has been performed to investigate friction characteristic for laser textured zone and mechanically textured zone before/after CSS test.

• 마이크로전자및패키징학회지
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• 제17권2호
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• pp.55-61
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• 2010

탄탈륨실리사이드 히터가 내장된 소자를 Ag 페이스트와 Au SBB(Stud Bump Bonding)를 이용하여 Au가 코팅 된 기판에 각각 접합 하였다. 전단 테스트와 전류를 흐르면서 열 성능을 측정하였다. Au 스터드 범프 본딩의 최적 플립칩 접합조건은 전단 후 파괴면 관찰하여 설정하였으며, 기판 온도를 $350^{\circ}C$, 소자 온도를 $250^{\circ}C$에서 하중을 300 g/bump 로 하여 접합하는 경우가 최적 조건이였다. 히터에 5 W 인가시 소자의 온도는 Ag 페이스트를 이용한 접합의 경우 최대 온도는 약 $50^{\circ}C$이었으며, Au 금속층을 갖고 있는 실리콘 기판에 Au 스터드 본딩으로 접합된 인 경우 약 $64^{\circ}C$를 나타내었다. 기판과의 접촉면적이 와이어본딩과 Au 스터드 범프 본딩 가 약 300배가 차이가 나는 경우 약 $14^{\circ}C$ 차이를 나타내었고, 전사모사를 통하여 접합면의 접촉저항이 중요한 이유임을 알 수 있었다.

• 한국표면공학회지
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• 제41권3호
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• pp.121-128
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• 2008

High strength 7xxx aluminum alloys have been applied to automotive bump back beam of the some limited model for light weight vehicle. The aluminum bump back beam is manufactured through extrusion, bending and welding. The residual stress given on these processes combines with the corrosive atmosphere on the road spreaded with corrosive chemicals to melt snow to occur the stress corrosion cracking. The composition of commercial 7xxx aluminum has Zn/Mg ratio about 3 and Cu over 2 wt% for better strength and stress corrosion cracking resistivity. But this composition isn't adequate for appling to the automotive bump back beam with high resistance to extrusion and bad weldability. In this study the composition of 7xxx aluminum alloy was modified to high Zn/Mg ratio and low Cu content for better extrusion and weldability. To estimate the resistivity against stress corrosion cracking of this aluminum alloy by slow strain rate test, the corrosion atmosphere and strain rate separate the stress corrosion cracking from conventional corrosion must be investigated. Using 0.6 Mol NaCl solution on slow strain rate test the stress corrosion cracking induced fracture was not observed. By adding 0.3% $H_2O_2$ and 0.6M $Na_2SO_4$ to 1M NaCl solution, the corrosion potential and current density of polarization curve moved to active potential and larger current density, and on the slow strain rate test the fracture energy in solution was lower than that in pre-exposure. These mean the stress corrosion cracking induced fracture can be estimated in this 1M NaCl + 0.3% $H_2O_2$ + 0.6M $Na_2SO_4$ solution. When the strain rate was below $2{\times}10^{-6}$, the stress corrosion cracking induced fracture start to be observed.

• 한국정보통신학회논문지
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• 제3권3호
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• pp.661-669
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• 1999

프로브 카드는 IC(integrated circuit) 칩을 테스트할 때, 테스트 시스템의 가장 중요한 부분의 하나이다. 본 연구는 다수의 반도체 칩을 동시에 테스트 할 수 있는 범프(bump)형 수직형 프로브 카드에 관한 것이다. 프로브는 범프 팁을 가지는 실리콘 캔틸레버로 구성되어 있다. 캔틸레버의 최적 크기를 결정하기 위하여 캔틸레버의 크기는 유한요소해석에 의하여 결정되었다. 프로브는 SDB웨이퍼를 사용하여 RIE, 등방성 에칭, 그리고 벌크 마이크로머시닝에 의하여 제조되었다. FEM에 의해 결정된 최적 크기로 제작된 프로브 카드는 범프의 높이가 30$\mum$, 캔틸레버의 두께가 $\mum$, 빔의 폭이 100 $\mum$, 길이가 400 $\mum$, 이었다. 제조된 프로브 카드의 접촉 테스트에서 측정된 접촉 저항은 $2 \Omega$ 미만이고, 2만회의 접촉동안 접촉 저항의 변화가 거의 없는 특성을 보였다. 따라서 20,000회 이상의 수명을 가질 수 있음을 알 수 있었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.3116-3121
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• 2007

In this paper, the inverse shape design is introduced using the permeable wall boundary condition. Inverse shape design defines the blade shape for the prescribed Mach numbers or pressure distribution on its surface. It calculates the normal mass flux from the difference between the calculated and prescribed pressure at the surface. A new geometry can be achieved after applying the quasi one-dimensional continuity equation from the leading edge to the trailing edge. For validation of this method, two test cases are studied. The first test case of inverse shape design illustrates the cosine bump with a strong shock. After seven geometry modifications, the shock-free bump geometry can be obtained. The second example concerns the redesign of a transonic turbine cascade. The initial isentropic Mach distribution has a peak on the upper surface. The target isentropic Mach number distribution was imposed smoothly. The peak of Mach distribution has disappeared at the final geometry. This proposed inverse design method has proven to be an efficient and robust tool in turbomachinery design fields.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.18-20
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• 2006

• 한국재료학회지
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• 제22권10호
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• pp.545-551
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• 2012

In semiconductor manufacturing, the circuit integrity of packaged BGA devices is tested by measuring electrical resistance using test sockets. Test sockets have been reported to often fail earlier than the expected life-time due to high contact resistance. This has been attributed to the formation of Sn oxide films on the Au coating layer of the probe pins loaded on the socket. Similar to contact failure, and known as "fretting", this process widely occurs between two conductive surfaces due to the continual rupture and accumulation of oxide films. However, the failure mechanism at the probe pin differs from fretting. In this study, the microstructural processes and formation mechanisms of Sn oxide films developed on the probe pin surface were investigated. Failure analysis was conducted mainly by FIB-FESEM observations, along with EDX, AES, and XRD analyses. Soft and fresh Sn was found to be transferred repeatedly from the solder bump to the Au surface of the probe pins; it was then instantly oxidized to SnO. The $SnO_2$ phase is a more stable natural oxide, but SnO has been proved to grow on Sn thin film at low temperature (< $150^{\circ}C$). Further oxidation to $SnO_2$ is thought to be limited to 30%. The SnO film grew layer by layer up to 571 nm after testing of 50,500 cycles (1 nm/100 cycle). This resulted in the increase of contact resistance and thus of signal delay between the probe pin and the solder bump.

• Journal of Welding and Joining
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• 제31권5호
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.204-207
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• 2003

The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.45-52
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• 2011

Flip Chip Ball Grid Array (FCBGA) 패키지의 솔더조인트 신뢰성을 평가하기 위한 방법으로는 다이 충격법, 다이 전단법, 3점 굽힘법, 열충격법 등이 활용된다. 본 연구에서는 솔더 접합부의 주요 고장메카니즘인 취성파괴를 확인하기 위한 방법으로 리플로우 상태, $85^{\circ}C$/85%RH 처리, $150^{\circ}C$/10hr 에이징의 처리한 후, 4가지 평가법으로 평가를 진행하여 파단모드를 분석하였다. 본 연구결과에서는 다이 충격법과 다이 전단법의 Good joint rate (GJR, %)는 리플로우 상태와 $85^{\circ}C$/85%RH처리에서 각각 89~91%와 100% 였으며, $150^{\circ}C$/10hr 에이징에서는 66%와 90%를 나타내었다. 3점 굽힘법과 열충격법의 GJR(%)는 3종류 샘플에서 모두 100%를 나타내어 변별력이 없었다. C4 솔더접합부의 신뢰성 평가법에 따른 GJR(%)의 변별력을 확인할 수 있는 방법은 die shock 과 die shear test였다.