• Journal of Powder Materials
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• v.15 no.5
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• pp.371-377
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• 2008

This paper deals with the phase analysis of $MgB_2$ bulk using spark plasma sintering process after ball milling. Mg and amorphous B powders were used as raw materials, and milled by planetary-mill for 9 hours at argon atmosphere. In order to confirm formation of $MgB_2$ phase, DTA and XRD were used. The milled powders were fabricated to $MgB_2$ bulk at the various temperatures by Spark Plasma Sintering. The fabricated $MgB_2$ bulk was evaluated with XRD, EDS, FE-SEM and PPMS. In the DTA result, reaction on formation of $MgB_2$ phase started at $340^{\circ}C$. This means that ball milling process improves reactivity on formation of $MgB_2$ phase. The $MgB_2$ MgO and FeB phases were characterized from XRD result. MgO and FeB were undesirable phases which affect formation of $MgB_2$ phase, and it's distribution could be confirmed from EDS mapping result. Spark Plasma Sintered sample for 5 min at $700^{\circ}C$ was relatively densified and it's density and transition temperature showing super conducting property were $1.87\;g/cm^3$ and 21K.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.73-73
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• 2000

Shear strength of BGA solder joints on Cu pad was studied for Cu-contained Sn n.5 a and 2.5wt.% Cu) and Sn-Pb (o.5wt.% Cu) solders, with emphasis on the roles of the C Cu-Sn intermetallic layer thickness and the roughness of the interface between the i intermetallic layer and solder. The shear strength test was performed both for a as-soldered s이der joints with soldering reaction times of 1, 2, 4 min and for aged s이der j joints at 170 C up to 16 days. The Cu addition to both pure Sn and eutectic Sn-Pb s solders increased the intermetallic layer thickness at both soldering and aging t temperatures. The Cu addition also resulted in changes in the roughness of the interface b between the intermetallic layer and solder at as-soldered states. With increasing Cu c content. the interface roughened for Sn-Cu solders whereas it flattened for Sn-Pb-Cu s solders. The shear fractures in all solder joints investigated were confined in the bulk s solder rather than through the intermetallic layer. Therefore, the effect of Cu content in s solders on the shear strength of the solder joints was primarily attributed to its i influence on the micros$\sigma$ucture of bulk solder, such as the size and spatial distributions of CU6Sn5 precipitates. In addition, the critical intermetallic layer thickness for a m maximum shear strength seemed to depend on the Cu content in bulk solder.older.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.147-150
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• 2020

Relatively pure YBCO was first synthesized by heating a mixture of metal carbonates at temperatures between 1,000 and 1,300 K, resulting in the reaction: 4BaCO₃+Y₂(CO₃)₃+6CuCO₃+(1/2_-x)O₂ → 2YBa₂Cu₃O_7-x+1/3CO₂. Modern syntheses of YBCO use the corresponding oxides and nitrates. The superconducting properties of YBa₂Cu₃O_7-x are sensitive to the value of x, i.e., its oxygen content. Only those materials with 0≤x≤0.65 are superconducting below Tc, and when x ~ 0.07, the material superconducts at the highest temperature, i.e., 95 K, or in the highest magnetic fields, i.e., 120 T and 250 T when B is perpendicular and parallel to the CuO₂ planes, respectively. In addition to being sensitive to the stoichiometry of oxygen, the properties of YBCO are influenced by the crystallization methods applied. YBCO is a crystalline material, and the best superconductive properties are obtained when crystal grain boundaries are aligned by careful control of annealing and quenching temperature rates. However, these alternative methods still require careful sintering to produce a quality product. New possibilities have arisen since the discovery of trifluoroacetic acid, a source of fluorine that prevents the formation of undesired barium carbonate (BaCO₃). This route lowers the temperature necessary to obtain the correct phase at around 700℃. This, together with the lack of dependence on vacuum, makes this method a very promising way to achieve a scalable YBCO bulk.

• Journal of the Korean Vacuum Society
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• v.8 no.3B
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• pp.262-268
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• 1999

Polycarbonate (PC) and Polymethylmethacrylate (PMMA) surface was modified by ion assisted reaction (IAR) technique to obtain the hydrophilic functional groups and improve the wettability. In conditions of ion assisted reaction, ion beam energy was changed from 500 to 1500eV, and ion dose and oxygen gas blown rate were fixed $1\times10^{16}$ ions/$\textrm{cm}^2$ and 4ml/min, respectively. Wetting angle of water on PC and PMMA surface modified by $Ar^+$ ion without blowing oxygen at 4ml/mon showed $5^{\circ}$ and $10^{\circ}$. Changes of wetting angle with oxygen gas and $Ar^+$ ion irradiation were explained by considering formation of hydrophilic group due to a reaction between irradiated polymer chain by energetic ion irradiation and blown oxygen gas. X-ray photoelectron spectroscopy analysis shows that hydrophilic groups such as -C-O, -(C=O)- and -(C=O)-O- are formed on the surface of polymer by chemical interaction. The polymer surface modification using ion assisted reaction only changed the surface physical properties and sept the bulk properties. In comparison with other modification methods, the surface modification by IAR treatment was chemically stable and enhanced the adhesion between metal and polymer surface. The applications of various kinds of polymer surface modification methods, metal and polymer surface. The applications of various kinds of polymer surface modification could be appled to the new materials about hydrophilic surface properties by IAR treatment. The adhesion between metal film and polymer measured by Scotch tape test whether the hydrophilic surfaces could improve the adhesion strength or not.

• Korean Journal of Materials Research
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• v.23 no.6
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• pp.309-315
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• 2013

$GdBa_2Cu_3O_{7-y}$(Gd123) powders were synthesized by the solid-state reaction method using $Gd_2O_3$ (99.9% purity), $BaCO_3$ (99.75%) and CuO (99.9%) powders. The synthesized Gd123 powder and the Gd123 powder with $Gd_2O_3$ addition ($Gd_{1.5}Ba_2Cu_3O_{7-y}$(Gd1.5)) were used as raw powders for the fabrication of Gd123 bulk superconductors. The Gd123 and Gd1.5 bulk superconductors were fabricated by sintering or a top-seeded melt growth (TSMG) process. The superconducting transition temperature ($T_{c,onset}$) of the sintered Gd123 was 93 K and the transition width was as large as 20 K. The $T_{c,onset}$ of the TSMG processed Gd123 was 82 K and the transition width was also as large as 12 K. The critical current density ($J_c$) at 77 K and 0 T of the sintered Gd123 and TSMG processed Gd123 were as low as a few hundreds A/$cm^2$. The addition of 0.25 mole $Gd_2O_3$ and 1 wt.% $CeO_2$ to Gd123 enhanced the $T_c$, $J_c$ and magnetic flux density (H) of the TSMG processed Gd123 sample owing to the formation of the superconducting phase with high flux pinning capability. The $T_c$ of the TSMG processed Gd1.5 was 92 K and the transition width was 1 K. The $J_cs$ at 77 K (0 T and 2 T) were $3.2{\times}10^4\;A/cm^2$ and $2.5{\times}10^4\;A/cm^2$, respectively. The H at 77 K of the TSMG-processed Gd1.5 was 1.96 kG, which is 54% of the applied magnetic field (3.45 kG).

• Journal of Sensor Science and Technology
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• v.3 no.2
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• pp.16-23
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• 1994

Developed fiber-optic biosensor for the detection of organophosphorus compounds in a contaminated water needs the analysis of an enzyme kinetics and the transport phenomena in the reaction part to analyze the sensor signal and to design the sensor. The enzyme inhibition kinetics was investigated and the reactor model was proposed to design the reaction part in the proposed sensor. Since the acetylcholinesterase was inhibited by the organophosphorus compounds, experiments for enzyme inhibition reaction were performed from 0 to 2 ppm to be detected by the developed sensor, and irreversible enzyme inhibition kinetics was proposed. The reactor parts were divided into the two phases, i.e. bulk phase and immobilized enzyme layer, to analyze the flow and diffusion. Sensor signal was able to be analyzed based on the total reactor model established by linking the enzyme reaction kinetics. Based on the proposed model, the effects of loading enzyme amount and enzyme layer thickness on the magnitude of readout signal were simulated.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.526-531
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• 2001

LD slag, that is, a by-product of steel making process, has been mainly used as land construction materials. Recently, the seashore application of LD slag was tried in Japan and Korea tut the reaction between LD slag and seawater was not studied yet. We tried to clarify the leaching reaction and/or mechanism of LD slag and the reaction between seawater and LD slag. We tried to apply these results to the decarbonization of seawater for seawater magnesia process. At first, LD slag was milled and classified into 5 grades, that is, (ⅰ)45${\mu}{\textrm}{m}$ under, (ⅱ)0.25~0.5mm (ⅲ)0.5~1mm(ⅳ)1~2mm, (ⅴ)2.36~3.35mm. These slags were leached in the distilled water. In case of 45${\mu}{\textrm}{m}$ under, the pH of the leached solution was over 12. The chemical analysis of leached solution showed that the $Ca^{+}$$^2$was main component and the S $i^{+}$$^4$was very low. On the other hand, the content of S $i^{+}$$^4$in leached solution was decreased with the increase of pH of this solution. The nearly pure calcium solution was made and the ultra high purity MgO could be made with this calcium solution. The leaching behavior of LD slag was different between the fine particle and coarse particle. The calcium was leached by bulk dissolution in the coarse particle and by surface controlled reaction in fine particle. The leaching rate was slow in coarse particle and fast in fine particle. Therefore, the high pH solution, that is, over 12, was obtained in fine particle.cle.e.

• Journal of Welding and Joining
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• v.14 no.4
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• pp.99-108
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• 1996

The microstructure and bond strength are examined on the SiC/SiC and SiC/mild steel joints brazed by the Ag-Ti based alloys with different Ti contents. In the SiC/SiC brazed joints, the thickness of the reaction layers at the bond interface and the Ti particles in the brazing alloy matrices increase with Ti contents. When Ti is added up to 9 at% in the brazing alloy. $Ti_3SiC_2$ phase in addition to TiC and $Ti_5Si_3$ phase is newly created at the bond interface and TiAg phase is produced from peritectic reaction in the brazing alloy matrix. In the SiC/mild steel joints brazed with different Ti contents, the microstructure at the bond interface and in the brazing alloy matrix near SiC varies similarly to the case of SiC/SiC brazed joints. But, in the brazing alloy matrix near the mild steel, Fe-Ti intermetallic compounds are produced and increased with Ti contents. The bond strengths of the SiC/SiC and SiC/mild steel brazed joints are independent on Ti contents in the brazing alloy. There are no large differences of the bond strength between SiC/SiC and SiC/mild steel brazed joints. In the SiC/mild steel brazed joints, Fe dissolved from the mild steel does not affect on the bond strength of the joints. Thermal contraction of the mild steel has nearly no effects on the bond strength due to the wide brazing gap of specimens used in the four-point bend test. The brazed joints has the average bond strength of about 200 MPa independently on Ti contents, Fe dissolution and joint type. Fracture in four-point bend test initiates at the interface between SiC and TiC reaction layer and propagates through SiC bulk. The adhesive strength between SiC and TiC reaction layer seems to mainly control the bond strength of the brazed joints.

• Applied Microscopy
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• v.26 no.1
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• pp.95-104
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• 1996

A comprehensive methodology to characterize the interfacial reaction products of $SiC_p/2024$ Al composites is introduced on the basis of the experimental results obtained using XRD, SEM and TEM. XRD performed on the electrochemically extracted $SiC_p$ and bulk $SiC_p/2024$ Al composite have shown that the interfacial reaction products consist of $Al_{4}C_3$ having hexagonal crystallographic structure, pure eutectic Si having diamond cubic crystallographic structure, and $CuAl_2$, having tetragonal crystalloraphic structure, respectively. According to the images observed by SEM, $Al_{4}C_3$, which has been reported to have needle shape, has a hexagonal platelet-shape and eutectic Si is found to have a dendritic shape. In addition eutectic $CuAl_2$, was observed to form near interface and/or along the grain boundaries. In order to confirm the results obtained by XRD, the primitive cell volume and reciprocal lattice height of such interfacial reaction products were calculated using the data obtained from convergent beam electron diffraction (CBED) patterns, and then compared with theoretical values.

• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.55-58
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• 2009

Density functional theory was used to investigate the adsorption and reaction of $HfCl_4$ with two hydroxyls on Si (001)-$2{\times}1$ surface in atomic layer deposition (ALD) process. We prepared a reasonable Si substrate which consisted of six inter-dimer dissociated $H_2O$ molecules and two intra-dimer dissociated $H_2O$ molecules. The $HfCl_4$must react with two hydroxyls to be a bulk-like structure. When $HfCl_4$ was adsorbed on a hydroxyl, there was energy benefit of -0.55 eV. Though there was energy loss for $HfCl_4$ to react with H of hydroxyl, thermal energy of ALD chamber would be enough to pass the energy barriers. There were five reaction pathways for $HfCl_4$ to react with two hydroxyls; inter-dimer, intra-dimer, cross-dimer, inter-row, and cross-row. Inter-row, inter-dimer and intra-dimer were relatively favorable among the five reaction pathways based on the energy difference. The electron densities between O and Hf in these three reactions were higher than the others and they had shorter Hf-O and O-O bond lengths than the other two reaction pathways.